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Plating solution and plating method of cyanide-free plating silver

An electroplating solution and silver electroplating technology, applied in the field of electroplating silver, can solve the problems of cyanide-free silver plating not widely used electroplating silver, poor stability of the plating solution, large stress of the coating layer, etc., to improve the corrosion resistance and discoloration resistance, and the coating Low stress, simple formula effect

Inactive Publication Date: 2013-04-17
XI AN JIAOTONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to problems such as high stress, poor bonding, and poor stability of the plating solution, cyanide-free silver plating has not been widely used in the electroplating banking industry.

Method used

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  • Plating solution and plating method of cyanide-free plating silver

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Comparison scheme
Effect test

Embodiment 1

[0023] The electroplating method of cyanide-free silver electroplating includes the following steps:

[0024] 1) The formula of cyanide-free alkaline silver plating solution is (using water as solvent): silver nitrate content 20g / L, ammonium acetate 70g / L, niacin 70g / L, potassium carbonate 60g / L, potassium hydroxide 40g / L, sodium phthalylsulfonimide 0.2g / L, polyethylene glycol 0.16g / L, ammonia water as a pH adjuster, adjust the pH of the plating solution to 9.5.

[0025] 2) The silver plate (purity 99.99%) is used as the anode, and the parts to be plated are used as the cathode; the following are several specific materials of the plated parts, and the corresponding pre-treatment and pre-treatment processes (the existing methods can be processed ):

[0026] The base material of plated parts is copper pre-treatment and pre-treatment process: plated parts degreasing-washing-pickling-washing-weak erosion-washing-pre-silvering-washing.

[0027] The base material of the plated parts is al...

Embodiment 2

[0031] The electroplating method of cyanide-free silver electroplating includes the following steps:

[0032] 1) The formula of cyanide-free alkaline silver plating solution is: silver nitrate content 40g / L, ammonium acetate 80g / L, niacin 95g / L, potassium carbonate 70g / L, potassium hydroxide 50g / L, phthaloyl Sodium sulfonimide 0.8g / L, polyethylene glycol 0.32g / L, ammonia water is the pH value adjuster, the pH value of the plating solution is 9.5-10.

[0033] 2) Take the silver plate (purity 99.99%) as the anode, and the article to be plated as the cathode; heat the bath temperature to 30~40℃, apply a single pulse electroplating power between the anode and the cathode to control the average pulse current of the cathode The density is 0.6~1.2A / dm 2 , The pulse width is 4ms, the duty cycle is 30%; the cathode is moved and stirred, and the plating is completed when the thickness of the coating reaches the requirement.

Embodiment 3

[0035] The electroplating method of cyanide-free silver electroplating includes the following steps:

[0036] 1) The formula of cyanide-free alkaline silver plating solution is: silver nitrate content 60g / L, ammonium acetate 90g / L, niacin 110g / L, potassium carbonate 80g / L, potassium hydroxide 60g / L, phthaloyl Sodium sulfonimide 1.2g / L, polyethylene glycol 0.64g / L, ammonia water is the pH value adjuster, and the pH value of the plating solution is 9-9.5.

[0037] 2) Use the silver plate (purity 99.99%) as the anode, and the article to be plated as the cathode; heat the bath temperature to 25~35℃, apply a single pulse electroplating power between the anode and the cathode to control the average pulse current of the cathode The density is 0.6~1.2A / dm 2 , The pulse width is 5ms, the duty cycle is 40%; the cathode is moved and stirred, and the plating is completed when the thickness of the coating reaches the requirement.

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Abstract

The invention discloses a plating solution and a plating method of cyanide-free plating silver. 20-60g silver nitrate, 70-90g ammonium acetate, 70-110g nicotinic acid, 60-90g potassium carbonate, 40-70g potassium hydroxide, 0.2-1.2g o-benzoyl sulfimide sodium and 0.16-0.64g polyethylene glycol are contained in 1L of the plating solution with a pH value of 9-10. According to the plating solution and the plating method of the cyanide-free plating silver, the plating solution does not contain cyanide ions; the pollution of wastewater treatment is reduced; the injury to a human body due to precious metal plating is reduced; a formula of the plating solution is simple, and easy to control; compared with other cyanide-free plating, the current density is higher; and the deposition efficiency of a silver coating can be improved. With the adoption of pulse plating, a coating that is small in coating stress and good in compactness and brightness, and combines with a matrix well can be obtained.

Description

Technical field [0001] The invention belongs to the technical field of silver electroplating, and belongs to an electroplating solution and an electroplating method for cyanide-free silver electroplating. Background technique [0002] With the development of industry, electroplating silver is widely used in the contact part of appearance decoration, electronic devices, instrumentation, transformer switches, high and low voltage switches and other industries. [0003] The cyanide-free silver electroplating solution uses cyanide-free ions as the silver ion complexing agent to deposit the silver plating layer through electrochemical reaction. However, cyanide-free silver plating has not been widely used in electroplating banking due to the problems of large stress, poor bonding, and poor stability of the plating solution. Summary of the invention [0004] The problem solved by the present invention is to provide an electroplating solution and electroplating method for cyanide-free sil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46C25D5/18
Inventor 宋忠孝郝留成李钦廉继英阮兴伟李宝红
Owner XI AN JIAOTONG UNIV
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