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Tin plating solution for copper electronic material as well as preparation method and application method of tin plating solution

A technology of electronic materials and application methods, applied in the field of electroless plating, can solve the problems of easy plating of terminals, affecting conductivity, low damage and so on, and achieving the effects of easy degradation, low porosity, and high production stability.

Pending Publication Date: 2022-06-03
深圳市虹喜科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Tin-plated electronic materials have good solderability, but today’s chemical manufacturers ignore a problem, that is, some electronic materials often need to be bent to obtain a certain insertion force, so the thickness of tin plating is the key point that affects the performance of electronic materials. If tin If the plating layer is too thick, the plating layer will fall off easily when the terminal is bent, and the insertion force will not be good. If it is thinner, it will be easy to wear and expose the inner copper, causing it to form a patina and affect the conductivity. Research on plating solutions for electronic materials that need to be bent

Method used

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  • Tin plating solution for copper electronic material as well as preparation method and application method of tin plating solution
  • Tin plating solution for copper electronic material as well as preparation method and application method of tin plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The formula of electroless tin plating solution is: 8g / L stannous methanesulfonate, 60g / L thiourea, 1g / L silver methanesulfonate, 4g / L EDTA, 104ml / L methanesulfonic acid , 66ml / L reducing agent, 0.25g / L auxiliary brightener (other additives are not shown one by one);

[0037] The process conditions of the electroless tin plating solution are as follows: the temperature of the plating solution is 35±2° C., the pH value is 1.0, the electroless plating time is 15 minutes, and the loading amount of the plating solution is 1.2 dm2 / L.

Embodiment 2

[0039] The formula of electroless tin plating solution is: 10g / L stannous methanesulfonate, 60g / L thiourea, 1g / L silver methanesulfonate, 4g / L EDTA, 104ml / L methanesulfonic acid , 66ml / L reducing agent, 0.25g / L auxiliary brightener (other additives are not shown one by one);

[0040] The process conditions of the electroless tin plating solution are as follows: the temperature of the plating solution is 35±2° C., the pH value is 1.0, the electroless plating time is 15 minutes, and the loading amount of the plating solution is 1.2 dm2 / L.

Embodiment 3

[0042] The formula of electroless tin plating solution is: 12g / L stannous methanesulfonate, 60g / L thiourea, 1g / L silver methanesulfonate, 4g / L EDTA, 104ml / L methanesulfonic acid , 66ml / L reducing agent, 0.25g / L auxiliary brightener (other additives are not shown one by one);

[0043] The process conditions of the electroless tin plating solution are as follows: the temperature of the plating solution is 35±2° C., the pH value is 1.0, the electroless plating time is 15 minutes, and the loading amount of the plating solution is 1.2 dm2 / L.

[0044] The thickness of the electroless plating layer in Example 1 is 0.83 μm, the appearance is silver white, the mass percentage of tin is 93.4 wt %, and the porosity is less than 4 pieces / 6cm 2 . In the tin-lead alloy whose flux is 25% rosin isopropanol and the solder is 60% tin + 40% lead, the wetting time is less than 3s, and the solderability is better. After passivation treatment, after being placed in the atmosphere for 3 months, th...

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Abstract

The invention discloses a copper electronic material tin plating solution, a preparation method and an application method, and the formula of an additive of the copper electronic material tin plating solution comprises the following components: main salt: stannous methanesulfonate with the concentration of 10-13g / L; a hydrolysis agent: 96 to 112 ml / L of methanesulfonic acid; the complexing agent is thiourea with the concentration of 75 g / L or 80 g / L; a tin whisker inhibitor: 0.8-1.2 g / L of silver methanesulfonate; the antioxidant is ethylenediamine tetraacetic acid with the concentration of 3-5g / L; the auxiliary brightening agent is benzaldehyde with the concentration of 0.2 g / L to 0.3 g / L; the reducing agent is at least one of hypophosphorous acid and sodium hypophosphite, and the concentration of the reducing agent is 50-82ml / L; gelatin is also added into the plating solution, and the concentration of the gelatin is 0.2-1.0 g / L; the complex solubilizer is polyalcohol with the concentration of 50 to 500g / L; and the crystal refiner is a polyoxyalkylene ether or amino acid type solution with the concentration of 0.1-10g / L.

Description

【Technical field】 [0001] The invention relates to the technical field of chemical plating, in particular to a tin plating solution for copper electronic materials, a preparation method and an application method. 【Background technique】 [0002] At present, the materials of commonly used electronic materials are generally brass or phosphor bronze. The surface of copper will be oxidized due to the air, so we will consider the coating. The general coating is gold-plated, silver-plated, nickel-plated, tin-plated, etc. In common cases, gold-plated or semi-gold products are used for advanced precision products, and the price is relatively expensive, so ordinary products are mainly tin-plated or nickel-plated. The weldability of silver plating is good, but it is also easy to oxidize. It is easy to blacken when exposed to the air for a long time. Nickel plating is an option, and the usage rate is also higher, but the weldability is slightly worse. Tin plating takes into account the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/52C23C18/18
CPCC23C18/52C23C18/1844C23C18/1669
Inventor 吴旭明蔡良胜陈阳蔡绪开
Owner 深圳市虹喜科技发展有限公司
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