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Standard nut electroplate liquid formula

A technology of electroplating liquid and nuts, which is applied in jewelry and other fields, can solve the problems of uniform welding performance and inability to guarantee the plating layer, and achieve the effects of good bonding force, easy electroplating process, and simple formula

Inactive Publication Date: 2018-10-23
如皋市跃天特种标准件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a standard nut electroplating solution formula, which can solve the problem that the general standard nut electroplating solution cannot ensure uniform coating and can have good welding performance.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0011] A standard nut electroplating solution formula, the pH of the plating solution is 5.0, including aluminum hydroxide 20g, aluminum oxide 20g, sodium hydroxide 12g, silicic acid 15g, magnesium carbonate 50g, methyl methacrylate 12g, chlorine Potassium chloride 7g, ferric oxide 3g, silver nitrate 2g, stannous sulfate 30g; additive bismuth oxide 0.5g; additive nonionic surfactant 0.5g; stabilizer hydroquinone 5g; brightener gelatin 2g and 300g of deionized water.

[0012] The additive nonionic surfactant is any one of polyoxyethylene (EO15) lauryl alcohol and OP emulsifier or a mixture of the two in any ratio.

Embodiment 2

[0014] A kind of standard nut plating solution formula, the pH of described plating solution is 5.0, comprises aluminum hydroxide 28g, aluminum oxide 33g, sodium hydroxide 14g, silicic acid 16.5g, magnesium carbonate 57g, methyl methacrylate 14g, Potassium chloride 9.5g, ferric oxide 7g, silver nitrate 3.5g, stannous sulfate 3.5g; additive bismuth oxide 1.25g; additive non-ionic surfactant 1.25g; stabilizer hydroquinone 6.5g; brightener Gelatin 3g and deionized water 400g.

[0015] The additive nonionic surfactant is any one of polyoxyethylene (EO15) lauryl alcohol and OP emulsifier or a mixture of the two in any ratio.

Embodiment 3

[0017] A standard nut electroplating solution formula, the pH of the plating solution is 5.0, including aluminum hydroxide 36g, aluminum oxide 46g, sodium hydroxide 16g, silicic acid 18g, magnesium carbonate 64g, methyl methacrylate 16g, chlorine Potassium chloride 12g, ferric oxide 11g, silver nitrate 5g, stannous sulfate 40g; additive bismuth oxide 2g; additive non-ionic surfactant 2g; stabilizer hydroquinone 8g; brightener gelatin 4g and deionized water 500g .

[0018] The additive nonionic surfactant is any one of polyoxyethylene (EO15) lauryl alcohol and OP emulsifier or a mixture of the two in any ratio.

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Abstract

The invention relates to a standard nut electroplate liquid formula. The standard nut electroplate liquid formula is characterized in that the pH value of the electroplate liquid is 5.0; the electroplate liquid comprises 20-36g of aluminium hydroxide, 20-46g of aluminium oxide, 12-16g of sodium hydroxide, 15-18g of silicic acid, 50-64g of magnesium carbonate, 12-16g of methyl methacrylate, 7-12g of potassium chloride, 3-11g of ferriferrous oxide, 2-5g of silver nitrate, 30-40g of stannous sulfate, 0.5-2g of additive bismuth oxide; 0.5-2g of additive nonionic surfactant, 5-8g of stabilizer hydroquinone, 2-4g of brightener gelatin, and 300-500g of deionized water. The standard nut electroplate liquid formula is simple, environmentally friendly and excellent in stability; electroplating technology is easy to control; a clad layer produced by electroplating is high in uniformity, densification and binding force; and the standard nut electroplate liquid formula can be widely applied in welding; and bubbles are not produced in the electroplate liquid during electroplating, and the electroplate liquid is always clear.

Description

technical field [0001] The invention relates to the field of electroplating of standard parts, in particular to a formula of electroplating solution for standard nuts. Background technique [0002] In recent years, the rapid development of the electronics industry has made people have higher and higher requirements for solderable coatings. Due to the good solderability of tin and the limited use of lead, a lot of research has been done on tin plating and tin alloy plating. [0003] At present, there are many tinning processes, which are divided into two parts: alkaline tinning and acidic tinning. Alkaline tin plating has many disadvantages, such as: slow deposition rate, low cathodic current efficiency, high alkali concentration will lead to serious hydrogen evolution reaction, and it will also affect tin anode, etc. Acid system tin plating generally includes sulfate system tin plating, fluoroboric acid system tin plating, and methanesulfonic acid system tin plating. Most...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/30C25D7/00
CPCC25D3/30C25D7/003
Inventor 黄仁秀
Owner 如皋市跃天特种标准件有限公司
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