Standard aluminum wire electroplating solution formula
A technology of electroplating solution and standard aluminum, which is applied in the field of formula of standard aluminum wire electroplating solution, can solve the problems such as influence on solderability and pollution of coating, and achieve the effect of easy electroplating process, simple formula and wide application
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Embodiment 1
[0011] A standard aluminum wire electroplating solution formula, the pH of the plating solution is 5.2, including 37g of aluminum chloride, 47g of aluminum oxide, 17g of sodium chloride, 191g of boric acid, 65g of magnesium carbonate, 17g of methyl methacrylate, and 13g of potassium carbonate , zinc chloride 12g, copper chloride 6g, stannous sulfate 41g; additive bismuth oxide 2.5g; additive nonionic surfactant 2.5g; stabilizer hydroquinone 9g; brightener gelatin 5g and deionized water 510g.
Embodiment 2
[0013] A standard aluminum wire electroplating solution formula, the pH of the plating solution is 5.3, including 38g of aluminum chloride, 48g of aluminum oxide, 18g of sodium chloride, 20g of boric acid, 66g of magnesium carbonate, 18g of methyl methacrylate, and 14g of potassium carbonate , zinc chloride 14g, cupric chloride 7g, stannous sulfate 45g; additive bismuth oxide 2.7g; additive nonionic surfactant 2.8g; stabilizer hydroquinone 10g; brightener gelatin 6g and deionized water 540g.
Embodiment 3
[0015] A standard aluminum wire electroplating solution formula, the pH of the plating solution is 5.4, including 40g of aluminum chloride, 49g of aluminum oxide, 19g of sodium chloride, 21g of boric acid, 67g of magnesium carbonate, 20g of methyl methacrylate, and 15g of potassium carbonate , zinc chloride 15g, copper chloride 8g, stannous sulfate 48g; Additive bismuth oxide 3g; Additive non-ionic surfactant 3g; Stabilizer hydroquinone 11g; Brightener gelatin 7g and deionized water 560g.
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