Standard aluminum wire electroplating solution formula

A technology of electroplating solution and standard aluminum, which is applied in the field of formula of standard aluminum wire electroplating solution, can solve the problems such as influence on solderability and pollution of coating, and achieve the effect of easy electroplating process, simple formula and wide application

Inactive Publication Date: 2020-05-05
江门市顺高电镀有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the tin plating in the acidic system also takes into account the high current efficiency, the stability of the plating solution, the throwing ability and deep plating ability of the plating solution, the pollution of the plating solution to the environment, the cycle of the plating solution, and the treatment cost of the electroplating waste solution and so on, and to solve these problems, various additives will be added to the plating solution, and some additives will affect the solderability of the coating. According to the prior art, some welding in the photovoltaic industry needs to use Standard aluminum wire with good weldability coating, and there are few electroplating solutions in the existing technology that can achieve uniform coating, smooth surface, high bonding force and good welding performance on standard aluminum wire.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0011] A standard aluminum wire electroplating solution formula, the pH of the plating solution is 5.2, including 37g of aluminum chloride, 47g of aluminum oxide, 17g of sodium chloride, 191g of boric acid, 65g of magnesium carbonate, 17g of methyl methacrylate, and 13g of potassium carbonate , zinc chloride 12g, copper chloride 6g, stannous sulfate 41g; additive bismuth oxide 2.5g; additive nonionic surfactant 2.5g; stabilizer hydroquinone 9g; brightener gelatin 5g and deionized water 510g.

Embodiment 2

[0013] A standard aluminum wire electroplating solution formula, the pH of the plating solution is 5.3, including 38g of aluminum chloride, 48g of aluminum oxide, 18g of sodium chloride, 20g of boric acid, 66g of magnesium carbonate, 18g of methyl methacrylate, and 14g of potassium carbonate , zinc chloride 14g, cupric chloride 7g, stannous sulfate 45g; additive bismuth oxide 2.7g; additive nonionic surfactant 2.8g; stabilizer hydroquinone 10g; brightener gelatin 6g and deionized water 540g.

Embodiment 3

[0015] A standard aluminum wire electroplating solution formula, the pH of the plating solution is 5.4, including 40g of aluminum chloride, 49g of aluminum oxide, 19g of sodium chloride, 21g of boric acid, 67g of magnesium carbonate, 20g of methyl methacrylate, and 15g of potassium carbonate , zinc chloride 15g, copper chloride 8g, stannous sulfate 48g; Additive bismuth oxide 3g; Additive non-ionic surfactant 3g; Stabilizer hydroquinone 11g; Brightener gelatin 7g and deionized water 560g.

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PUM

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Abstract

The invention discloses a standard aluminum wire electroplating solution formula. The pH of the plating solution is in the range of 5.2 to 5.4, the standard aluminum wire electroplating solution formula comprises the following components of, in parts by weight, 37g-40g of aluminum chloride, 47g-49 g of aluminum oxide, 17g-19g of sodium chloride, 19g-21g of boric acid, 65g-67g of magnesium carbonate, 17g-20g of methyl methacrylate, 13g-15g of potassium carbonate, 12g-15 g of zinc chloride, 6g-8g of copper chloride and 41g-48g of stannous sulfate; 2.5g-3g of additive bismuth oxide, 2.5g-3g of additive nonionic surfactant, 9g-11g of stabilizer hydroquinone, 5g-7g of brightener gelatin and 510g-560g of deionized water. The invention provides the standard aluminum wire electroplating solution formula which is uniform in plating, smooth in surface, high in binding force and good in welding performance.

Description

technical field [0001] The invention relates to the field of electroplating of standard parts, in particular to a standard aluminum wire electroplating solution formula. Background technique [0002] There are many tinning processes, which are divided into two parts: alkaline tinning and acidic tinning. Alkaline tin plating has many disadvantages, such as: slow deposition rate, low cathodic current efficiency, high alkali concentration will lead to serious hydrogen evolution reaction, and it will also affect tin anode, etc. Acid system tin plating generally includes sulfate system tin plating, fluoroboric acid system tin plating, and methanesulfonic acid system tin plating. Most of the tin plating in the acidic system also takes into account the high current efficiency, the stability of the plating solution, the throwing ability and deep plating ability of the plating solution, the pollution of the plating solution to the environment, the cycle of the plating solution, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/30C25D7/06
CPCC25D3/30C25D7/0607
Inventor 王志和
Owner 江门市顺高电镀有限公司
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