Standard aluminum wire electroplating solution formula

A technology of electroplating solution and standard aluminum, which is applied in the field of formula of standard aluminum wire electroplating solution, can solve the problems such as influence on solderability and pollution of coating, and achieve the effect of easy electroplating process, simple formula and wide application
CN111101165AInactive Publication Date: 2020-05-05江门市顺高电镀有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
江门市顺高电镀有限公司
Publication Date
2020-05-05
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention discloses a standard aluminum wire electroplating solution formula. The pH of the plating solution is in the range of 5.2 to 5.4, the standard aluminum wire electroplating solution formula comprises the following components of, in parts by weight, 37g-40g of aluminum chloride, 47g-49 g of aluminum oxide, 17g-19g of sodium chloride, 19g-21g of boric acid, 65g-67g of magnesium carbonate, 17g-20g of methyl methacrylate, 13g-15g of potassium carbonate, 12g-15 g of zinc chloride, 6g-8g of copper chloride and 41g-48g of stannous sulfate; 2.5g-3g of additive bismuth oxide, 2.5g-3g of additive nonionic surfactant, 9g-11g of stabilizer hydroquinone, 5g-7g of brightener gelatin and 510g-560g of deionized water. The invention provides the standard aluminum wire electroplating solution formula which is uniform in plating, smooth in surface, high in binding force and good in welding performance.
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Description

technical field

[0001] The invention relates to the field of electroplating of standard parts, in particular to a standard aluminum wire electroplating solution formula. Background technique

[0002] There are many tinning processes, which are divided into two parts: alkaline tinning and acidic tinning. Alkaline tin plating has many disadvantages, such as: slow deposition rate, low cathodic current efficiency, high alkali concentration will lead to serious hydrogen evolution reaction, and it will also affect tin anode, etc. Acid system tin plating generally includes sulfate system tin plating, fluoroboric acid system tin plating, and methanesulfonic acid system tin plating. Most of the tin plating in the acidic system also takes into account the high current efficiency, the stability of the plating solution, the throwing ability and deep plating ability of the plating solution, the pollution of the plating solution to the environment, the cycle of the plating solution, and ...

Claims

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