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Plating solution formula for electroplating pure tin on copper wire and electroplating method

A copper wire and plating solution technology, applied in the field of electroplating, can solve the problems of uneven surface, uneven electroplating coating, affecting the solderability of the solder layer, etc., and achieve the effects of simple formula, good bonding force and good stability

Active Publication Date: 2016-08-03
JIANGSU XINGDA STEEL TYPE CORD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: the present invention provides a plating solution formula and electroplating method for electroplating pure tin on copper wires, so as to solve the problem that the addition of additives to the plating solution for electroplating tin on thin copper wires in the prior art affects the solderability of the solder layer, and the plating layer Uneven, rough surface problems

Method used

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  • Plating solution formula for electroplating pure tin on copper wire and electroplating method
  • Plating solution formula for electroplating pure tin on copper wire and electroplating method
  • Plating solution formula for electroplating pure tin on copper wire and electroplating method

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Embodiment 1

[0035] Table 1

[0036]

[0037] A kind of electroplating method of electroplating pure tin on copper wire, the pH of described plating solution is 1.0, and contains composition in table 1 in every 1L plating solution, prepare 1L plating solution and copper wire electroplating as follows:

[0038] Step 1. Preparation of plating solution:

[0039] a. Measure 100mL of methanesulfonic acid into deionized water and stir;

[0040] B, take by weighing 0.5g bismuth oxide, be dissolved in the solution that step a is prepared, stir;

[0041] c, take by weighing 5g hydroquinone, be dissolved in the solution that step b is prepared, stir;

[0042] d. Weigh 1g of polyoxyethylene (EO15) lauryl alcohol, dissolve it in the solution prepared in step c, and stir;

[0043] E, take by weighing 30g stannous sulfate, be dissolved in the solution that step d is joined, stir;

[0044] f. Weigh 2g of gelatin, dissolve it in hot water at 50°C, make it fully dissolved, then add it to the solutio...

Embodiment 2

[0049] Table 2

[0050]

[0051] A kind of electroplating method of electroplating pure tin on copper wire, the pH of described plating solution is 1.0, and contains composition in table 2 in every 1L plating solution, prepare 1L plating solution and copper wire electroplating as follows:

[0052] Step 1. Preparation of plating solution:

[0053] a. Measure 110mL of methanesulfonic acid into deionized water and stir;

[0054] b. Take 1g of bismuth oxide, dissolve it in the solution prepared in step a, and stir;

[0055] c, take by weighing 6g hydroquinone, be dissolved in the solution prepared in step b, stir;

[0056] d. Weigh 0.5g OP emulsifier, dissolve in the solution prepared in step c, and stir;

[0057] E, take by weighing 35g stannous sulfate, be dissolved in the solution that step d is equipped, stir;

[0058] f. Weigh 3g of gelatin, dissolve it in hot water at 60°C, make it fully dissolved, then add it to the solution prepared in step e, stir, and finally dilu...

Embodiment 3

[0062] table 3

[0063]

[0064] A kind of electroplating method of electroplating pure tin on copper wire, the pH of described plating solution is 1.0, and contains composition in table 3 in every 1L plating solution, prepare 1L plating solution and copper wire electroplating as follows:

[0065] Step 1. Preparation of plating solution:

[0066] a. Measure 120mL of methanesulfonic acid into deionized water and stir;

[0067] B, take by weighing 1.8g bismuth oxide, be dissolved in the solution that step a is prepared, stir;

[0068] c, take by weighing 8g hydroquinone, be dissolved in the solution that step b is prepared, stir;

[0069] d. Weigh 1g of polyoxyethylene (EO15) lauryl alcohol and 1g of OP emulsifier, dissolve in the solution prepared in step c, and stir;

[0070] E, take by weighing 40g stannous sulfate, be dissolved in the solution that step d is joined, stir;

[0071] f. Weigh 4g of gelatin, dissolve it in hot water at 58°C, make it fully dissolved, then ad...

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Abstract

The invention discloses a plating solution formula for electroplating pure tin on a copper wire and an electroplating method. The pH value of a plating solution is 1.0. The plating solution comprises tin(II) sulfate, an adding agent bismuth oxide, an adding agent nonionic surfactant, a stabilizing agent p-dihydroxybenzene, a brightening agent gelatin and solvent sulphonethane. The electroplating method includes the steps that the copper wire serves as an electroplating cathode after being subjected to alkaline washing to remove oil and subjected to hot water washing, acid pickling, cold water washing and drying, and a titanium plate serves as an electroplating anode; and the current density is 2.5-4 A / dm<2>, the electroplating time is 10 min, and temperature is normal temperature. The plating solution composition is simple and easy to control, waste liquid is environment-friendly and easy to process, the electroplating process is easy to control, and a plating layer is uniform, smooth and good in binding force.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a plating solution formula and an electroplating method for electroplating pure tin on copper wires. Background technique [0002] In recent years, the rapid development of the electronics industry has made people have higher and higher requirements for solderable coatings. Due to the good solderability of tin and the limited use of lead, a lot of research has been done on tin plating and tin alloy plating. [0003] At present, there are many tinning processes, which are divided into two parts: alkaline tinning and acidic tinning. Alkaline tin plating has many disadvantages, such as: slow deposition rate, low cathodic current efficiency, high alkali concentration will lead to serious hydrogen evolution reaction, and it will also affect tin anode, etc. Acid system tin plating generally includes sulfate system tin plating, fluoroboric acid system tin plating, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32C25D7/06
CPCC25D3/32C25D7/0607
Inventor 倪自飞华欣何广仁王威
Owner JIANGSU XINGDA STEEL TYPE CORD
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