Cyanide-free copper electroplating method for reducing porosity of copper plating layer

A technology of electroplating copper and porosity, which is applied in the field of electroplating copper, which can solve the problems of time-consuming, large porosity of the coating, laborious and other problems, and achieve the effect of simple formula, good plating ability and high bonding strength

Inactive Publication Date: 2014-05-21
WUXI XINSANZHOU STEEL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] However, the use of the above solution for electroplating has a large porosity of the coating. In some application environments that require high porosity, the usual method of controlling the voids is to increase the thickness of the copper layer (50~70um), but this is time-consuming. , strenuous

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The formula of electroplating copper solution is:

[0043] Disodium edetate 120g / L

[0044] Basic copper carbonate 12g / L

[0045] Potassium hydroxide 30g / L

[0046] Tripotassium citrate 30g / L

[0047] Potassium nitrate 6g / L;

[0048] The process conditions during electroplating are as follows: direct current electroplating units and pulse electroplating units are alternately performed on the substrate, the pH of the electroplating solution is controlled between 12 and 13, and the temperature is 50°C.

[0049] Among them, the cathode current density of copper plating in each DC electroplating unit is 0.5A / dm 2 , the plating time is 2min;

[0050] Among them, the pulse average current density of copper electroplating in each AC electroplating unit is 0.5A / dm 2 ; The duty cycle is 15%, and the electroplating time is 2min.

Embodiment 2

[0052] The formula of electroplating copper solution is:

[0053] Dipotassium EDTA 145g / L

[0054] Basic copper carbonate 14g / L

[0055] Trisodium citrate 25g / L

[0056] Sodium nitrate 5g / L

[0057] Sodium hydroxide 20g / L;

[0058] The process conditions during electroplating are as follows: direct current electroplating units and pulse electroplating units are alternately performed on the substrate, the pH of the electroplating solution is controlled between 12 and 13, and the temperature is 70°C.

[0059] Among them, the cathode current density of copper plating in each DC electroplating unit is 3.0A / dm 2 , the electroplating time is 3min;

[0060] Among them, the pulse average current density of copper electroplating in each AC electroplating unit is 3.0A / dm 2 ; The duty cycle is 15%, and the electroplating time is 3min.

Embodiment 3

[0062] The formula of electroplating copper solution is:

[0063] Disodium edetate 155g / L

[0064] Basic copper carbonate 18g / L

[0065] Sodium Potassium Tartrate 30g / L

[0066] Sodium nitrate 5g / L

[0067] Potassium hydroxide 40g / L;

[0068] The process conditions during electroplating are as follows: direct current electroplating units and pulse electroplating units are alternately performed on the substrate, the pH of the electroplating solution is controlled between 12 and 13, and the temperature is 60°C.

[0069] Among them, the cathode current density of copper plating in each DC electroplating unit is 1A / dm 2 , the plating time is 2min;

[0070] Among them, the pulse average current density of copper plating in each AC electroplating unit is 1A / dm 2 ; The duty cycle is 15%, and the electroplating time is 2min.

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PUM

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Abstract

The present invention relates to a cyanide-free copper electroplating method for reducing porosity of a copper plating layer. According to the cyanide-free copper electroplating method, a substrate is alternately subjected to a direct current electroplating unit and a pulse electroplating unit, the pH value of the electroplating solution is controlled to 12-13, the temperature is 50-70 DEG C, the cathode current density for copper electroplating in each direct current electroplating unit is 0.5-3.0 A/dm<2>, the electroplating time is 2-3 min, the pulse average current density for copper electroplating in each alternating current electroplating unit is 0.5-3.0 A/dm<2>, the duty ratio is 15%, and the electroplating time is 2-3 min. The plating layer obtained through the method has minimal porosity when the plating layer thickness is 10-20 mum.

Description

technical field [0001] The invention relates to a method for electroplating copper, in particular to a method for reducing the porosity of a copper plating layer without cyanide electroplating. Background technique [0002] The cyanide electroplating copper layer has fine crystallization, good bonding force, good leveling, leveling and stability of the plating solution, and can be directly electroplated on steel, zinc and zinc alloy substrate parts. However, the cyanide electroplating copper solution contains cyanide ions, which is highly toxic, difficult to handle waste water and liquid waste, seriously pollutes the environment, and endangers human health. Therefore, people have been looking for a cyanide-free copper plating process that can replace cyanide electroplating copper. The existing cyanide-free copper plating process mainly has the following types: [0003] (1) Sulfate copper plating [0004] Sulfate acidic copper plating solution is mainly composed of copper ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/18C25D3/38
Inventor 林永峰
Owner WUXI XINSANZHOU STEEL
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