High-performance electrochemical capacitor plate material and preparation method thereof

An electrochemical and capacitor technology, applied in the field of electrochemical capacitors, can solve the problems of unfavorable silicon-based integrated circuit technology, limited capacitance capacity, low electrolyte wettability, etc., and achieve the effect of cheap drugs, easy realization, and simple formula

Inactive Publication Date: 2015-09-30
QIQIHAR UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, activated carbon materials with large areas have been used as plate materials in commercial electrochemical capacitors, although these activated carbons have high specific surface areas (1000-2000 m 2 g -1 ), but its capacitance is limited. This capacity defect is related to its own small gap and low electrolyte affinity, and it is not conducive to compatibility with traditional silicon-based integrated circuit processes.

Method used

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  • High-performance electrochemical capacitor plate material and preparation method thereof
  • High-performance electrochemical capacitor plate material and preparation method thereof
  • High-performance electrochemical capacitor plate material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] 1) Preparation of silicon microchannels:

[0042] The preparation process of the electrochemical etching microchannel based on the MEMS process has been described in detail in the patent application 200610025900.7. The microchannel holes are disk-shaped, with a diameter distribution of 5 microns and a depth of about 200 microns. Its etching depth and width can be controlled by etching time, etchant concentration, temperature, etching voltage and light irradiation intensity.

[0043] 2) Preparation of Ni / Si-MCP:

[0044] With the silicon microchannel as the substrate, after the surface pretreatment, the nickel single film is ring-coated on the inner wall of each channel by the electroless plating method to form a nickel / silicon microchannel nanocomposite structure. Surface pretreatment refers to: soaking with 1% polyethylene glycol octyl phenyl ether solution for 30s; the formula of electroless nickel plating solution is: nickel sulfate hexahydrate with a concentration...

Embodiment 2

[0059] 1. Preparation of silicon microchannels:

[0060] The preparation process of the electrochemical etching microchannel based on the MEMS process has been described in detail in the patent application 200610025900.7. The microchannel holes are disk-shaped, with a diameter distribution of 5 microns and a depth of about 200 microns. Its etching depth and width can be controlled by etching time, etchant concentration, temperature, etching voltage and light irradiation intensity.

[0061] 2. Preparation of Ni / Si-MCP:

[0062] The silicon microchannel is used as the substrate, and after surface pretreatment, a thin layer of metal nickel is coated on the inner wall of each channel by electroless plating to form a nickel / silicon microchannel nanocomposite structure. Surface pretreatment refers to: soaking with 1.5% polyethylene glycol octylphenyl ether solution for 40s; the formula of electroless nickel plating solution is: nickel sulfate hexahydrate with a concentration of 1....

Embodiment 3

[0074] 1. Preparation of silicon microchannels:

[0075] The preparation process of electrochemical etching microchannels based on MEMS technology has been described in detail in the patent application 200610025900. The microchannel holes are disk-shaped, with a diameter distribution of 5 microns and a depth of about 200 microns. Its etching depth and width can be controlled by etching time, etchant concentration, temperature, etching voltage and light irradiation intensity.

[0076] 2. Preparation of Ni / Si-MCP:

[0077]The silicon microchannel is used as the substrate, and after surface pretreatment, a thin layer of metal nickel is coated on the inner wall of each channel by electroless plating to form a nickel / silicon microchannel nanocomposite structure. Surface pretreatment refers to: soaking with 1.5% polyethylene glycol octyl phenyl ether solution for 50s; the formula of electroless nickel plating solution is: nickel sulfate hexahydrate with a concentration of 1.0 mol / ...

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Abstract

The invention discloses a high-performance electrochemical capacitor plate material and a preparation method thereof, and belongs to the field of capacitor manufacture. The high-performance electrochemical capacitor plate material is silicon micro-channel supported neodymium-doped bismuth titanate, and adopts the structure that a neodymium-doped bismuth titanate thin film layer is generated on the inner wall of a three-dimensional silicon micro-channel plate through vacuum filtration and high-temperature oxidation to be used as an electrochemical capacitor active layer. The preparation method of the high-performance electrochemical capacitor plate material comprises the following steps: preparing the three-dimensional silicon micro-channel plate by adopting an electrochemical method, then, depositing a nickel layer by adopting a electroless plating method, preparing a nano-neodymium-doped bismuth titanate thin film layer by adopting a sol-gel method, and finally, performing rapid thermal annealing in an oxygen atmosphere, so as to form a neodymium-doped bismuth titanate/silicon micro-channel composite structure material. The high-performance electrochemical capacitor plate material provided by the invention provides a short transmission/diffusion path length, has larger specific area, and is conductive to obtaining higher energy density and power density.

Description

technical field [0001] The invention relates to a high-performance electrochemical capacitor plate material, and also relates to a preparation method of a high-performance electrochemical capacitor plate material, which belongs to the technical field of electrochemical capacitors. Background technique [0002] Electrochemical capacitors (ECS), also known as supercapacitors, are excellent electrical storage devices that are valued for their high energy density, long life cycle, and reversibility compared to batteries and fuel cells, It has a wide range of applications in transportation systems, consumer electronics, renewable energy, and military equipment. The selection of electrode materials is crucial to the performance of capacitors. [0003] At present, activated carbon materials with large areas have been used as plate materials in commercial electrochemical capacitors, although these activated carbons have high specific surface areas (1000-2000 m 2 g -1 ), but its ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G11/24H01G11/30H01G11/86
CPCY02E60/13H01G11/24H01G11/30H01G11/86
Inventor 苗凤娟陶佰睿邹立颖张冬冬张嘉高玉峰李倩倩
Owner QIQIHAR UNIVERSITY
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