Standard copper wire electroplating solution formula

A technology of electroplating solution and copper wire, which is applied in the field of formula of standard copper wire electroplating solution, can solve the problems of uniform welding performance and inability to guarantee the plating layer, and achieve the effect of good bonding force, easy electroplating process, and uniform plating layer

Inactive Publication Date: 2018-11-09
如皋市跃天特种标准件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a standard copper wire electroplating solution formula, whic

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] A standard copper wire electroplating solution formula, the pH of the plating solution is 5.0, including aluminum hydroxide 20g, aluminum oxide 20g, sodium lauryl sulfate 12g, silicic acid 15g, magnesium carbonate 50g, methyl methacrylate 12g of ester, 7g of potassium chloride, 3g of ferric oxide, 2g of silver nitrate, 30g of tin propanesulfonate; 0.5g of additive bismuth oxide; 0.5g of additive non-ionic surfactant; 5g of stabilizer hydroquinone; gelatin 2g and deionized water 300g.

[0012] The additive nonionic surfactant is any one of polyoxyethylene (EO15) lauryl alcohol and OP emulsifier or a mixture of the two in any ratio.

Embodiment 2

[0014] A standard copper wire electroplating solution formula, the pH of the plating solution is 5.0, including aluminum hydroxide 28g, aluminum oxide 33g, sodium lauryl sulfate 14g, silicic acid 16.5g, magnesium carbonate 57g, methacrylic acid 14g methyl ester, 9.5g potassium chloride, 7g ferric oxide, 3.5g silver nitrate, 3.5g tin propane sulfonate; 1.25g bismuth oxide additive; 1.25g non-ionic surfactant additive; hydroquinone stabilizer 6.5g; brightener gelatin 3g and deionized water 400g.

[0015] The additive nonionic surfactant is any one of polyoxyethylene (EO15) lauryl alcohol and OP emulsifier or a mixture of the two in any ratio.

Embodiment 3

[0017] A standard copper wire electroplating solution formula, the pH of the plating solution is 5.0, including aluminum hydroxide 36g, aluminum oxide 46g, sodium lauryl sulfate 16g, silicic acid 18g, magnesium carbonate 64g, methyl methacrylate 16g of ester, 12g of potassium chloride, 11g of ferric oxide, 5g of silver nitrate, 40g of tin propane sulfonate; additive bismuth oxide 2g; additive non-ionic surfactant 2g; stabilizer hydroquinone 8g; brightener gelatin 4g and deionized water 500g.

[0018] The additive nonionic surfactant is any one of polyoxyethylene (EO15) lauryl alcohol and OP emulsifier or a mixture of the two in any ratio.

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PUM

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Abstract

The invention relates to a standard copper wire electroplating solution formula which is characterized in that the pH of the electroplating solution is 5.0, the standard copper wire electroplating solution includes 20-30 g of aluminum hydroxide, 20 to 46 g of aluminum oxide, 12-16g of sodium lauryl sulfate, 15-18g of silicic acid, 50-64g of magnesium carbonate, 12-16g of methyl methacrylate, 7-12gof potassium chloride, 3-11g of ferroferric oxide, 2-5g of silver nitrate, 30 40g of tin propane sulfonate; 0.5-2g of additive bismuth oxide; 0.5-2g of additive non-ionic surfactant; 5-8g of stabilizer hydroquinone; 2-4g of brightener gelatin and 300-500g of deionized water. The the standard copper wire electroplating solution has the advantages of simple formula, environmental protection, and good stability, an electroplating process is easy to control, and an electroplated layer is uniform, compact, good in bonding force, and widely used in welding. The electroplating solution does not generate bubbles, and remains clear during the electroplating process.

Description

technical field [0001] The invention relates to the field of electroplating of standard parts, in particular to a standard copper wire electroplating solution formula. Background technique [0002] In recent years, the rapid development of the electronics industry has made people have higher and higher requirements for solderable coatings. Due to the good solderability of tin and the limited use of lead, a lot of research has been done on tin plating and tin alloy plating. [0003] At present, there are many tinning processes, which are divided into two parts: alkaline tinning and acidic tinning. Alkaline tin plating has many disadvantages, such as: slow deposition rate, low cathodic current efficiency, high alkali concentration will lead to serious hydrogen evolution reaction, and it will also affect tin anode, etc. Acid system tin plating generally includes sulfate system tin plating, fluoroboric acid system tin plating, and methanesulfonic acid system tin plating. Most...

Claims

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Application Information

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IPC IPC(8): C25D7/06C25D3/32
CPCC25D7/0607C25D3/32
Inventor 黄仁秀
Owner 如皋市跃天特种标准件有限公司
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