Electroplate copper liquor for printed circuit board

A technology for printed circuit boards and copper electroplating, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of reducing the flexibility of the coating, the brittleness of the coating and the increase and decrease of the porosity, so as to improve the comprehensive electroplating performance, Good throwing power and the effect of expanding the brightness range

Inactive Publication Date: 2009-06-17
深圳市天泽科技实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the 1950s, there was a patent for using thiourea or thiourea together with dextrin, mercaptobenzothiazole and other substances as brighteners for acidic sulfate copper plating. Although these additives can make the coating bright and the grains fine, However, the mechanical properties of the coating cannot meet the requirements, such as: additives such as gelatin lead to inclusions in the coating, brittleness and porosity of the coating increase; while additives composed of thiourea will greatly reduce the softness of the coating, and it is easy to delaminate and reduce the mechanical properties of the coating.
The plating performance of the electroplating solution in the existing industry has been difficult to meet the copper plating requirements for high-density and high-precision circuit boards

Method used

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  • Electroplate copper liquor for printed circuit board
  • Electroplate copper liquor for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The distribution ratio of each component of the electroplating copper solution is as follows:

[0037] Copper sulfate: 50g / L

[0038] Sulfuric acid: 160g / L

[0039] Chloride ion concentration: 35ppm

[0040] Dispersant used: disodium ether sulfosuccinate monoester (DAPS) Adding ratio: 0.05g / L

[0041] Crystal refiner: 2-mercaptobenzimidazole (M) Adding ratio: 0.5ppm

[0042] Brightener: sodium thiopropanesulfonate Addition ratio: 1ppm

[0043] Temperature: 20—30℃

[0044] Current density: 2A / dm2

[0045] Anode current density: 1A / dm 2

[0046] The copper electroplating solution configured according to the above components has been filtered many times, vigorously stirred by air, and the cathode is moved mechanically. The moving speed is controlled at 0.6 m / min, and the copper electroplating solution is continuously circulated during the electroplating process.

Embodiment 2

[0048] The distribution ratio of each component of the electroplating copper solution is as follows:

[0049] Copper sulfate: 90g / L

[0050] Sulfuric acid: 200g / L

[0051] Chloride ion concentration: 80ppm

[0052] Dispersant used: dipentyl sodium succinate (AY-65) Adding ratio: 10g / L

[0053] Crystal refiner: mercaptobenzothiazole Addition ratio: 0.2ppm

[0054] Brightener: sodium thiazoline propane sulfonate Addition ratio: 5ppm

[0055] Temperature: 20—30℃

[0056] Current density: 3 / dm 2

[0057] Anode current density: 1A / dm 2

[0058] The copper electroplating solution configured according to the above components has been filtered many times, vigorously stirred by air, and the cathode is moved mechanically. The moving speed is controlled at 1 m / min, and the copper electroplating solution is continuously circulated during the electroplating process.

Embodiment 3

[0059] Embodiment 3: (best embodiment)

[0060] The distribution ratio of each component of the electroplating copper solution is as follows:

[0061] Copper sulfate: 75g / L

[0062] Sulfuric acid: 180g / L

[0063] Chloride ion concentration: 60ppm

[0064] Dispersant used: 1-sulfonyl succinate-2-oxyethylene-3-hydroxyl-4-sodium succinate (TPSO3) adding ratio: 2.5g / L

[0065] Crystal refiner: 2-Mercaptobenzimidazole (M) Adding ratio: 0.4ppm

[0066] Brightener: sodium polydisulfide dipropane sulfonate Addition ratio: 3ppm

[0067] Temperature: 20-30°C

[0068] Current density: 2.2A / dm 2

[0069] Anode current density: 1A / dm 2

[0070] The copper electroplating solution configured according to the above components has been filtered many times, vigorously stirred by air, and the cathode is moved mechanically. The moving speed is controlled at 1.2 m / min, and the copper electroplating solution is continuously circulated during the electroplating process.

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Abstract

The invention belongs to the electroplating field, in particular relates to a novel electroplating solution with excellent plating property used in the process of plating copper in the production and manufacturing of a circuit board. The electroplating copper solution of a printed circuit board comprises a copper sulphate solution and a dispersant; the dispersant is mainly sodium salt solution containing sulfosuccinate group and ethylene oxide group, and the dispersant comprises alkyl ester sodium sulfonate salt of succinic acid, succinate sodium salt containing amine and the succinate sodium salt containing ethoxy. An anion surfactant containing the sodium salt of the sulfosuccinate group and the ethylene oxide group is taken as the dispersant for a used additive, which significantly improves the comprehensive electroplating property of the electroplating copper solution, and ensures that the electroplating solution has high dispersing property, excellent ductibility and better plating homogeneity. The invention can provide the novel electroplating copper solution with the high dispersing property, the excellent ductibility and the better plating homogeneity. The copper solution can meet requirements for high density and high accuracy of plating copper on the printed circuit board.

Description

【Technical field】 [0001] The invention belongs to the field of electroplating, in particular a novel electroplating solution with excellent plating performance used in the copper plating process in the production and manufacture of circuit boards. 【Background technique】 [0002] As early as the beginning of this century, it has been found that substances such as gelatin, glycine, cystine and thiourea can make the copper sulfate bath obtain a bright coating. After the 1950s, there was a patent for using thiourea or thiourea together with dextrin, mercaptobenzothiazole and other substances as brighteners for acidic sulfate copper plating. Although these additives can make the coating bright and the grains fine, However, the mechanical properties of the coating cannot meet the requirements, such as: additives such as gelatin lead to inclusions in the coating, brittleness and porosity of the coating increase; while additives composed of thiourea will greatly reduce the softness ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38H05K3/18
Inventor 王海粟
Owner 深圳市天泽科技实业有限公司
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