Electroplate copper liquor for printed circuit board

Abstract

The invention belongs to the electroplating field, in particular relates to a novel electroplating solution with excellent plating property used in the process of plating copper in the production and manufacturing of a circuit board. The electroplating copper solution of a printed circuit board comprises a copper sulphate solution and a dispersant; the dispersant is mainly sodium salt solution containing sulfosuccinate group and ethylene oxide group, and the dispersant comprises alkyl ester sodium sulfonate salt of succinic acid, succinate sodium salt containing amine and the succinate sodium salt containing ethoxy. An anion surfactant containing the sodium salt of the sulfosuccinate group and the ethylene oxide group is taken as the dispersant for a used additive, which significantly improves the comprehensive electroplating property of the electroplating copper solution, and ensures that the electroplating solution has high dispersing property, excellent ductibility and better plating homogeneity. The invention can provide the novel electroplating copper solution with the high dispersing property, the excellent ductibility and the better plating homogeneity. The copper solution can meet requirements for high density and high accuracy of plating copper on the printed circuit board.

Description

【Technical field】 [0001] The invention belongs to the field of electroplating, in particular a novel electroplating solution with excellent plating performance used in the copper plating process in the production and manufacture of circuit boards. 【Background technique】 [0002] As early as the beginning of this century, it has been found that substances such as gelatin, glycine, cystine and thiourea can make the copper sulfate bath obtain a bright coating. After the 1950s, there was a patent for using thiourea or thiourea together with dextrin, mercaptobenzothiazole and other substances as brighteners for acidic sulfate copper plating. Although these additives can make the coating bright and the grains fine, However, the mechanical properties of the coating cannot meet the requirements, such as: additives such as gelatin lead to inclusions in the coating, brittleness and porosity of the coating increase; while additives composed of thiourea will greatly reduce the softness ...

AI Technical Summary

Problems solved by technology

After the 1950s, there was a patent for using thiourea or thiourea together with dextrin, mercaptobenzothiazole and other substances as brighteners for acidic sulfate copper plating. Although these additives can make the coating bright and the grains fine, However, the mechanical properties of the coating cannot meet the requirements, such as: additives such as gelatin lead to inclusions in the coating, brittleness and porosity of the coating increase; while additives composed of thiourea will greatly reduce the softness of the coating, and it is easy to delaminate and reduce the mechanical properties of the coating.

The plating performance of the electroplating solution in the existing industry has been difficult to meet the copper plating requirements for high-density and high-precision circuit boards

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