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High-density and high-precision printed circuit board copper electroplating process

A printed circuit board, high-precision technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of reducing the softness of the coating, the brittleness of the coating, and the increase and decrease of porosity, so as to improve the comprehensive electroplating performance, Good throwing ability and the effect of expanding the bright range

Inactive Publication Date: 2014-05-21
WUXI XINSANZHOU STEEL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the 1950s, there was a patent for using thiourea or thiourea together with dextrin, mercaptobenzothiazole and other substances as brighteners for acidic sulfate copper plating. Although these additives can make the coating bright and the grains fine, However, the mechanical properties of the coating cannot meet the requirements, such as: additives such as gelatin lead to inclusions in the coating, brittleness and porosity of the coating increase; while additives composed of thiourea will greatly reduce the softness of the coating, and it is easy to delaminate and reduce the mechanical properties of the coating.
The plating performance of the electroplating solution in the existing industry has been difficult to meet the copper plating requirements for high-density and high-precision circuit boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The distribution ratio of each component of the electroplating copper solution is as follows:

[0022] Copper sulfate: 50g / L

[0023] Sulfuric acid: 160g / L

[0024] Chloride ion concentration: 35ppm

[0025] Dispersant used: disodium ether sulfosuccinate monoester (DAPS) adding ratio: 0.05g / L

[0026] Crystal refiner: 2-Mercaptobenzimidazole (M) Adding ratio: 0.5ppm

[0027] Brightener: sodium thiopropanesulfonate Adding ratio: 1ppm

[0028] Temperature: 20—30℃

[0029] Current density: 2A / dm 2

[0030] Anode current density: 1A / dm 2

[0031] The applied power of ultrasound is 40W

[0032] The copper electroplating solution configured according to the above components has been filtered many times, vigorously stirred by air, and the cathode is moved mechanically. The moving speed is controlled at 0.6 m / min, and the copper electroplating solution is continuously circulated during the electroplating process.

Embodiment 2

[0034] The distribution ratio of each component of the electroplating copper solution is as follows:

[0035] Copper sulfate: 90g / L

[0036] Sulfuric acid: 200g / L

[0037] Chloride ion concentration: 80ppm

[0038] Dispersant used: dipentyl sodium succinate (AY-65) adding ratio: 10g / L

[0039] Crystal refiner: mercaptobenzothiazole addition ratio: 0.2ppm

[0040] Brightener: thiazoline propane sulfonate sodium addition ratio: 5ppm

[0041] Temperature: 20—30℃

[0042] Current density: 3 / dm 2

[0043] Anode current density: 1A / dm 2

[0044] The applied power of ultrasound is 100W

[0045] The copper electroplating solution configured according to the above components has been filtered many times, vigorously stirred by air, and the cathode is moved mechanically. The moving speed is controlled at 1 m / min, and the copper electroplating solution is continuously circulated during the electroplating process.

Embodiment 3

[0046] Embodiment 3: (best embodiment)

[0047]The distribution ratio of each component of the electroplating copper solution is as follows:

[0048] Copper sulfate: 75g / L

[0049] Sulfuric acid: 180g / L

[0050] Chloride ion concentration: 60ppm

[0051] Dispersant used: 1-sulfonyl succinate-2-oxyethylene-3-hydroxyl-4-sodium succinate (TPSO3) adding ratio: 2.5g / L

[0052] Crystal refiner: 2-Mercaptobenzimidazole (M) Adding ratio: 0.4ppm

[0053] Brightener: sodium polydisulfide dipropane sulfonate Adding ratio: 3ppm

[0054] Temperature: 20-30°C

[0055] Current density: 2.2A / dm 2

[0056] Anode current density: 1A / dm 2

[0057] The applied power of ultrasound is 80W

[0058] The copper electroplating solution configured according to the above components has been filtered many times, vigorously stirred by air, and the cathode is moved mechanically. The moving speed is controlled at 1.2 m / min, and the copper electroplating solution is continuously circulated during th...

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PUM

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Abstract

The invention belongs to the field of electroplating, and especially relates to a high-density and high-precision printed circuit board copper electroplating process used during a copper plating process in circuit board production manufacturing. According to the present invention, the electroplating solution comprises a copper sulfate solution and a dispersant; the high-density and high-precision printed circuit board copper electroplating process is characterized in that a plating tank added with a copper plating solution is placed in a numerical control ultrasonic generator, a prepared printed circuit board is placed into the plating solution, and ultrasonic waves with a certain power are applied during the electroplating process to enhance electroplating; and ultrasonic waves are adopted to enhance copper electroplating, such that the obtained plating layer has characteristics of delicate appearance, good gloss, uniform grain, tight covering and excellent comprehensive performance, and provides good bonding force and good corrosion resistance compared with the plating layer obtained through the treatment with no ultrasonic wave assisted effect.

Description

Technical field [0001] The invention relates to the field of electroplating, in particular to a high-density and high-precision copper electroplating process for printed circuit boards used in the copper plating process in circuit board production and manufacturing. Background technique [0002] As early as the beginning of this century, it was discovered that substances such as gelatin, glycine, cystine and thiourea can make copper sulfate plating solutions obtain bright coatings. After the 1950s, there were patents for using thiourea or thiourea together with dextrin, mercaptobenzothiazole and other substances as acidic sulfate copper plating brighteners. Although these additives can make the coating bright and the grains refined, However, the mechanical properties of the coating cannot meet the requirements. For example, additives such as gelatin lead to inclusions in the coating, increasing the brittleness and porosity of the coating; and additives composed of thiourea w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/20H05K3/18
Inventor 林永峰
Owner WUXI XINSANZHOU STEEL
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