High-speed electroplating luminous tin-plating electroplating liquid as well as preparation method and application thereof

A high-speed electroplating and electroplating bath technology, applied in the field of electrochemical deposition of metals, can solve the problems affecting the wettability of the sample and the bath, the deterioration of the sample performance, the increase of the bath foam, etc., to achieve excellent coating rate, reduce dosage, improve Effect of plating speed

Inactive Publication Date: 2012-04-18
SHANGHAI INSTITUTE OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in high-speed electroplating, the high-speed circulation of the plating solution will inevitably involve a large amount of air. For high-speed electroplating of pure tin, it will not only cause the oxidation of divalent tin under the condition of

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A bright tin-plating solution for high-speed electroplating, its raw material components are calculated per liter of bright tin-plating solution for high-speed electroplating, and its composition and content are as follows:

[0045] Tin methanesulfonate 140 mL

[0046] 70wt% methanesulfonic acid 120 mL

[0047] Brightener 2 g

[0048] Conductive salt 45 g

[0049] Grain refiner 5 g

[0050] Antioxidant 10 g

[0051] Wetting agent 1 g

[0052] Antifoaming agent 0.001g

[0053] The remainder is water;

[0054]The brightener is benzaldehyde and acrolein, which is a mixture of 5:1 by mass ratio benzaldehyde: acrolein;

[0055] Described conductive salt is sodium sulfate and sodium methylsulfonate, namely sodium sulfate by mass ratio: sodium methylsulfonate is the mixture that 2:3 forms;

[0056] The grain refiner is thiadiazole, methylaniline and methyl salicylate, according to the mass ratio of thiadiazole: methylaniline: methyl salicylate is a mixture of 1:3:4; ...

Embodiment 2

[0072] A bright tin-plating solution for high-speed electroplating, its raw material components are calculated per liter of bright tin-plating solution for high-speed electroplating, and its composition and content are as follows:

[0073] Tin methanesulfonate 170 mL

[0074] 70wt% methanesulfonic acid 150 mL

[0075] Brightener 3 g

[0076] Conductive salt 35 g

[0077] Grain refiner 5.5 g

[0078] Antioxidant 10 g

[0079] Wetting agent 1 g

[0080] Antifoaming agent 0.001g

[0081] The remainder is water;

[0082] Described brightener is benzaldehyde and acrolein, benzaldehyde by mass ratio: acrolein is the mixture of 2:1 composition;

[0083] Described conductive salt is sodium methylsulfonate and sodium benzenesulfonate, namely sodium methylsulfonate by mass ratio: sodium benzenesulfonate is the mixture of 1:2 composition;

[0084] The grain refiner is thiadiazole and 2-methylamino-4-methyl-6-methoxy-1,3,5-triazine, which is thiadiazole:2-methyl Amino-4-methyl-6-...

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Abstract

The invention discloses a high-speed electroplating luminous tin-plating electroplating liquid as well as a preparation method and application thereof. The high-speed electroplating luminous tin-plating electroplating liquid comprises the following raw materials calculated according to each liter of high-speed electroplating luminous tin-plating electroplating liquid: 120-200mL of tin methyl sulfonate, 100-175mL of 70 percent by weight methylsulfonic acid, 0.03-5g of brightening agent, 30-45g of conducting salt, 1-10g of grain refiner, 5-20g of antioxidant, 0.5-2g of wetting agent, 0.0005-0.001g of antifoaming agent and the balance water. The preparation method comprises the following steps of: dissolving the tin methyl sulfonate into the 70 percent by weight methylsulfonic acid; diluting the mixed solution with a proper amount of water; then adding the brightening agent, the conducting salt, the grain refiner, the antioxidant, the wetting agent and the antifoaming agent into the solution; and uniformly stirring and filtering to obtain filtrate, namely the high-speed electroplating luminous tin-plating electroplating liquid. The high-speed electroplating luminous tin-plating electroplating liquid disclosed by the invention has high coating speed, excellent dispersion capability and antifoaming capability and is suitable for a high-speed electroplating process.

Description

technical field [0001] The invention belongs to the technical field of electrochemical deposition of metals, in particular to a high-speed electroplating bright tin plating solution and a preparation method and application thereof. Background technique [0002] Today, when the electronic components industry adopts fully automatic mass production technology and the market competition is increasingly fierce, people also put forward higher requirements for the electronic electroplating industry that it serves, such as the thickness, uniformity, hardness, and coating thickness of each batch of products. The brightness must be consistent, the electroplating area is strictly controlled, and the cost is reduced. However, ordinary electroplating equipment cannot meet the needs of actual production, and it is also difficult to meet product performance requirements. High-speed electroplating is more in line with the actual needs of microelectronic packaging, so it has gradually becom...

Claims

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Application Information

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IPC IPC(8): C25D3/32
Inventor 韩生方曦朱贤
Owner SHANGHAI INSTITUTE OF TECHNOLOGY
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