High-speed electroplating luminous tin-plating electroplating liquid as well as preparation method and application thereof

Abstract

The invention discloses a high-speed electroplating luminous tin-plating electroplating liquid as well as a preparation method and application thereof. The high-speed electroplating luminous tin-plating electroplating liquid comprises the following raw materials calculated according to each liter of high-speed electroplating luminous tin-plating electroplating liquid: 120-200mL of tin methyl sulfonate, 100-175mL of 70 percent by weight methylsulfonic acid, 0.03-5g of brightening agent, 30-45g of conducting salt, 1-10g of grain refiner, 5-20g of antioxidant, 0.5-2g of wetting agent, 0.0005-0.001g of antifoaming agent and the balance water. The preparation method comprises the following steps of: dissolving the tin methyl sulfonate into the 70 percent by weight methylsulfonic acid; diluting the mixed solution with a proper amount of water; then adding the brightening agent, the conducting salt, the grain refiner, the antioxidant, the wetting agent and the antifoaming agent into the solution; and uniformly stirring and filtering to obtain filtrate, namely the high-speed electroplating luminous tin-plating electroplating liquid. The high-speed electroplating luminous tin-plating electroplating liquid disclosed by the invention has high coating speed, excellent dispersion capability and antifoaming capability and is suitable for a high-speed electroplating process.

Description

technical field [0001] The invention belongs to the technical field of electrochemical deposition of metals, in particular to a high-speed electroplating bright tin plating solution and a preparation method and application thereof. Background technique [0002] Today, when the electronic components industry adopts fully automatic mass production technology and the market competition is increasingly fierce, people also put forward higher requirements for the electronic electroplating industry that it serves, such as the thickness, uniformity, hardness, and coating thickness of each batch of products. The brightness must be consistent, the electroplating area is strictly controlled, and the cost is reduced. However, ordinary electroplating equipment cannot meet the needs of actual production, and it is also difficult to meet product performance requirements. High-speed electroplating is more in line with the actual needs of microelectronic packaging, so it has gradually becom...

AI Technical Summary

Problems solved by technology

However, in high-speed electroplating, the high-speed circulation of the plating solution will inevitably involve a large amount of air. For high-speed electroplating of pure tin, it will not only cause the oxidation of divalent tin under the condition of a large amount of air, but also easily cause the foam of the plating solution to increase, affecting the sample and The wettability of the plating solution leads to poor performance of the sample, and the present invention proposes to solve this problem