A method for activating the surface of pcb circuit to realize electroless nickel plating

A technology of electroless nickel plating and electroless nickel plating solution, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of high price, low production efficiency, easy decomposition, etc., to reduce production cost, The effect of fast plating speed and high bonding strength
CN104862677BInactive Publication Date: 2017-08-11UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
UNIV OF ELECTRONICS SCI & TECH OF CHINA
Publication Date
2017-08-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a method for activating the surface of a PCB circuit to realize electroless nickel plating, which belongs to the field of printed circuit board manufacturing. The method comprises the following steps: 1) preparing 0.01-10 g / L soluble silver salt as a silver immersion solution; 2) preparing an activation solution according to the ratio of 1-100 g / L pH stabilizer and 10-50 g / L reducing agent, and the pH stabilizer is hydrogen One or more of sodium oxide, potassium hydroxide, ammonia water, sodium acetate, etc., and the reducing agent is one or more of formaldehyde, acetaldehyde, glyoxylic acid, methanol, vitamin C, citric acid, etc.; 3) Pretreatment of PCB board; 4) After pretreatment, the PCB board is immersed in the immersion silver solution for 10-120s, cleaned, and then immersed in the activation solution for 10-80s; 5) The PCB board obtained in the previous step is chemically nickel plated. The invention avoids the use of precious metal palladium in the activation process, the activation solution has high stability and no seepage phenomenon, and effectively reduces the PCB production cost.
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Description

technical field

[0001] The invention belongs to the field of printed circuit board (PCB) manufacturing, and in particular relates to a palladium-free activation method before electroless nickel plating on the copper circuit surface of the printed circuit board (PCB). Background technique

[0002] A printed circuit board (PCB) is an interconnect that provides electronic component connections through copper circuits on its insulating substrate, and is a support for electronic components. However, in the process of PCB production and use, circuits made of copper are easily oxidized, resulting in deterioration of electrical conductivity and soldering performance. Therefore, surface treatment of copper circuits is necessary to improve the corrosion resistance and soldering performance of copper circuits. Electroless nickel plating / gold displacement plating technology is electroless nickel plating on the surface of copper circuits followed by gold displacement plating. The nickel / ...

Claims

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