Cyanide-free high-speed silver plating electroplating solution
An electroplating solution and high-speed technology, which is applied in the field of electrochemical silver plating, can solve the problems of poor stability, high cost of plating solution, and low production efficiency, and achieve high corrosion resistance and wear resistance, low cost of plating solution, and high silver plating efficiency Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0019] The silver plating solution is mainly composed of silver nitrate-sodium thiosulfate system and brightener sodium selenocyanide. The mass concentration of each component in the electroplating solution is:
[0020] Silver nitrate 60g / L, sodium thiosulfate 145g / L, sodium metabisulfite 60g / L, sodium sulfate 15g / L, boric acid 24g / L, sodium selenocyanide 2mg / L, and the balance is pure water.
Embodiment 2
[0022] The silver plating solution is mainly composed of silver nitrate-sodium thiosulfate system and brightener sodium selenocyanide. The mass concentration of each component in the electroplating solution is:
[0023] Silver nitrate 45g / L, sodium thiosulfate 105g / L, sodium metabisulfite 54g / L, sodium sulfate 15g / L, boric acid 18g / L, sodium selenocyanide 2mg / L, and the balance is pure water.
Embodiment 3
[0025] The silver plating solution is mainly composed of silver nitrate-sodium thiosulfate system and brightener sodium selenocyanide. The mass concentration of each component in the silver plating electroplating solution is: silver nitrate 50g / L, sodium thiosulfate 125g / L, sodium metabisulfite 57g / L, sodium sulfate 15g / L, boric acid 21g / L, sodium selenocyanide 2mg / L L, the balance is pure water.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com