The invention discloses a preparation method of reverse copper foil. The preparation method of the reverse copper foil comprises the following steps of electrolytic bath arrangement, addition agent addition, stirring operation, primary electroplating operation, primary roughening operation, primary curing operation, secondary electroplating operation, secondary roughening operation, secondary curing operation, cleaning operation, anti-oxidation treatment and drying operation. A titanium iridium anode plate and a titanium roller are adopted, an electrolytic solution is used in an electrolytic bath, specifically, the copper content of the electrolytic solution ranges from 130g/L to 220g/L, and the sulfuric acid content of the electrolytic solution ranges from 70g/L to 100g/L. When addition agents are added, the electrolytic solution is heated to enable the temperature to range from 45 DEG C to 50 DEG C, and 5-10 parts of WH-001 addition agents, 3-5 parts of WH-002 addition agents and 2-3parts of WH-003 addition agents by mass are added to 1000 parts of electrolytic solutions by volume every hour. When the secondary electroplating operation is conducted, 5-10 parts of WH-004 additionagents by mass are added. When the secondary roughening operation is conducted, 5-15 parts of WH-005 addition agents by mass are added, and the secondary roughening operation is accomplished. By theadoption of the technology, the potential barrier of metal nucleation is reduced, the nucleation speed is increased, high-density copper particle crystals can be formed on the surface of the copper foil, the non-uniformity degree of the surface is reduced, the mechanical property of the copper foil is improved, and therefore the tensile strength and the peeling resistance strength of the copper foil are improved.