Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate

一种组合物、电解铜的技术，应用在苯系吖嗪染料等方向，达到高均镀能力、粘附良好、促进方法优化的效果

Active Publication Date: 2020-06-16
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, supplementation of such compounds has to be laboriously accommodated as not all compounds are consumed in proportion and inaccurate addition of components can lead to further undesired effects

Method used

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  • Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate
  • Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate
  • Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0172] The invention will now be illustrated with reference to the following non-limiting examples. Unless otherwise stated below, commercial products were used as described in the technical data sheets available on the filing date of this specification. Tetronic ® 304 (ethylenediamine derivative represented by the following formula (ED)) is a product of BASF SE. The substrate material in all the examples was a brass sheet with dimensions of 100 mm x 75 mm.

[0173] Measurement of roughness:

[0174] The roughness (or smoothness) of the outer surface was measured by a scanning atomic force microscope (Digital Instruments, NanoScope, equipped with a PointProbe® from Nanosensors, tip radius less than 7 nm), scan size: 5 × 5 μm, scanned in intermittent contact mode. From these measurements we get S A value (average roughness) and are provided in the individual examples below. In order to be able to better compare roughness values, the same location was used for each measur...

Embodiment 1

[0192] By dissolving the specified components in water, an electroplating composition comprising the following components is prepared:

[0193]

[0194] The plating conditions were the same as those described in Comparative Example 1. The resulting roughness S A is 46.6 nm (at 2 ASD), which corresponds to a leveling effect of 52% compared to the scratched pristine substrate. The copper layer is glossy across the substrate and has a mirror polished appearance. They additionally adhere well to the underlying substrate and are extensible as desired in the art.

Embodiment 2

[0195] Invention Example 2: Preferred Embodiment

[0196] Using the electroplating composition of Inventive Example 1, but using the same concentration of ethylenediamine derivative as Tetronic® 304 in Inventive Example 1 instead of Tetronic ® 304. R of ethylenediamine derivatives ED1 to R ED4 at least one of . the rest of R ED1 to R ED4 for . The plating conditions were the same as those described in Comparative Example 1.

[0197] The resulting roughness S A is 40.7 nm (at 2 ASD), which corresponds to a leveling effect of 58% compared to the scratched pristine substrate. By using the above-mentioned ethylenediamine derivative, which is a preferred embodiment of the present invention, the roughness can be significantly reduced (40%) compared to Comparative Example 3.

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Abstract

The present invention relates to a plating composition for electrolytic copper deposition, comprising copper ions, halide ions and at least one acid, at least one benzothiazole compound, at least onephenanzine dye and at least one ethanediamine derivative. The present invention further concerns the use of above plating composition and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate.

Description

technical field [0001] The present invention relates to electroplating compositions for electrolytic copper deposition, uses thereof, and methods of electrolytically depositing copper or copper alloy layers on at least one surface of a substrate. Background technique [0002] Various methods and deposition solutions for electroplating copper are used, for example, to produce decorative bright and level surfaces, large surfaces, on metallic or plastic materials. where they are used to form ductile layers, eg in the field of decorative coatings for sanitary or automotive equipment, where intermediate copper layers are required for subsequent deposition of different metal layers, eg for corrosion protection and / or decorative layers . [0003] A uniform and glossy appearance is particularly desired for the final metal layer on the surface of the substrate. On substrates without complex shapes, since the current density is distributed in a narrow range during electroplating of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38C09B17/02
Inventor P.瓦赫特C.普菲尔曼S.克雷奇默
Owner ATOTECH DEUT GMBH
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