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385 results about "Phenazine" patented technology

Phenazine is an organic compound with the formula (C₆H₄)₂N₂. It is a dibenzo annulated pyrazine, and the parent substance of many dyestuffs, such as the toluylene red, indulines, and safranines (and the closely related eurhodines). Phenazine crystallizes in yellow needles, which are only sparingly soluble in alcohol. Sulfuric acid dissolves it, forming a deep-red solution.

Thermal activation delayed fluorescence material based on dibenzophenazine derivative as well as preparation method and application of thermal activation delayed fluorescence material

The invention discloses a thermal activation delayed fluorescence material based on a dibenzophenazine derivative as well as a preparation method and application of the thermal activation delayed fluorescence material, and belongs to the technical field of organic photoelectric materials and devices. The structural formula of the material is shown as a formula (I), in the formula (I), R1 is phenoxazinyl, phenothiazinyl or dimethyl acridinyl, R1' is phenoxazinyl, phenothiazinyl or dimethyl acridinyl, R1 '' is phenoxazinyl, phenothiazinyl or dimethyl acridinyl, and R2 is H, phenoxazinyl, phenothiazinyl or dimethyl acridinyl. The material provided by the invention has the advantages that the electron acceptor and the electron donor unit show a highly distorted rigid structure, 100% theoretical internal quantum efficiency can be realized, the fluorescence quantum yield is high, a guarantee is provided for a high-efficiency long-waveband OLED device, and the like. And a polysubstitution mode is adopted, so that red shift of molecular emission wavelength is facilitated, long-waveband luminescence is realized, and a guarantee is provided for an efficient long-waveband OLED device.
Owner:山西穿越光电科技有限责任公司

Ruthenium (II)-polypyridine complex, and preparation method and application thereof

InactiveCN102464676AG-quadruplex DNA molecular optical switch with good performanceMicrobiological testing/measurementGroup 8/9/10/18 element organic compoundsLithium chlorideFiltration
The invention provides a ruthenium (II)-polypyridine complex. For the ruthenium (II)-polypyridine complex, bipyridyl (bpy) or phenanthroline hydrate (phen) is used as an ancillary ligand, and dipyridine[3,2-a:2',3'-c]phenazine-11,12-imidazole (dppzi) is used as a main ligand. The preparation method comprises the following steps: preparing 5,6-dinitrobenzimidazole from 5,6-nitrobenzimidazole; reducing 5,6-dinitrobenzimidazole into 5,6-diaminobenzimidazole by using hydrazine hydrate and palladium/carbon; preparing dppzi from phenanthroline hydrate-5,6-dione and 5,6-diaminobenzimidazole and preparing cis-[Ru(bpy)2Cl2].2H2O from ruthenium trichloride, bpy and lithium chloride; preparing cis-[Ru(phen)2Cl2].3H2O from ruthenium trichloride, phen and lithium chloride; carrying out a heating reflux reaction on dppzi and cis-[Ru(bpy)2Cl2].2H2O or cis-[Ru(phen)2Cl2].3H2O under the protection of argon, carrying out cooling, adding ammonium hexafluorophosphate, allowing precipitate to deposit and carrying out filtration and column chromatography so as to obtain a target product. The ruthenium (II)-polypyridine complex provided in the invention can be used as an optical switch for G-quadruplex DNA molecules.
Owner:TONGJI UNIV

Electroplating copper solution and electroplating method for wafer-level packaging super TSV copper interconnection material

The invention discloses an electroplating copper solution and electroplating method for a wafer-level packaging super TSV copper interconnection material. The electroplating copper solution comprises,according to the concentration, 100-250 g/L of concentrated copper sulfate pentahydrate, 40-80 g/L of concentrated sulfuric acid, 30-50 mg/L of chloride ions, 1-5 mg/L of 3-sulfur-isothiourea propanesulfonic acid inner salt, 50-100 mg/L nonylphenol polyoxyethylene ether, 40-80 mg/L of phenazine dye and the balance DI pure water; the components are uniformly mixed to form the electroplating coppersolution; before electroplating, the wafer is subjected to vacuum treatment by a pretreatment solution; the pretreatment solution is DI pure water, and the wafer is vacuumized by using DI pure waterin vacuum equipment for 5-10 min after the wafer is mounted by an electroplating hanger; and after vacuumizing, electroplating is carried out in the electroplating copper solution. The super TSV growsin the bottom-up form, so that the problems of voids, cracks and the like of existing super TSV are solved, and the defects of unstable signal transmission, large resistance, excessive power loss andthe like due to voids can be effectively avoided.
Owner:SHENZHEN CHENGGONG CHEM
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