This invention discloses an
environmentally friendly copper etching solution based on bio-based materials and its preparation method. The
etching solution, by weight percentage, comprises 5-20% bio-based chelating agent, 3-15% bio-based oxidant, 0.5-5% pH adjuster, 0.1-2%
corrosion inhibitor, 0.05-1% surfactant, with the balance being deionized water. The bio-based chelating agent is selected from
citric acid,
glutamic acid, and their salts; the bio-based oxidant is selected from
dehydroascorbic acid,
phytic acid, and other similar substances. During preparation, the chelating agent is dissolved sequentially, the pH is adjusted to 3.0-7.0, the oxidant,
corrosion inhibitor, and surfactant are added, and the solution is brought to a final volume and filtered. This invention uses renewable bio-based materials as its core, resulting in a weakly acidic to neutral
etching solution with low corrosiveness to equipment. The waste liquid is easily biodegradable after use, making it
environmentally friendly. Furthermore, this etching solution exhibits a suitable
etching rate and a high etching factor, enabling the production of smooth etched surfaces, which meets the requirements of
copper etching processes in fields such as printed circuit boards.