The invention discloses a micro-channel heat dissipation device with a
composite structure and a heat dissipation method thereof. The micro-channel heat dissipation device comprises a micro-channel
heat sink and a manifold
shunting device which are sequentially arranged at the bottom of a
chip, the top of the micro-channel
heat sink is provided with a fin array with an open top, and the top of each fin of the fin array is provided with chutes which are uniformly spaced; a rhombus body is arranged in the center of each chute; a micro-channel groove bottom inlet and a micro-channel groove bottom outlet are formed in the bottom of a micro-channel of the micro-channel
heat sink, a manifold
inlet channel and a manifold outlet channel are arranged on the manifold
shunting device, the manifold
inlet channel is communicated with the micro-channel groove bottom inlet, and the manifold outlet channel is communicated with the micro-channel groove bottom outlet. Fluid is equally divided through the manifold
inlet channel, a secondary flow array is directly formed at the bottom of the
chip through the inclined grooves and the rhombic bodies for efficient heat exchange, the problems that the heat dissipation level of the embedded microfluid technology is insufficient, and the
chip is prone to being damaged when the microgrooves are directly machined are solved, and the packaging heat dissipation level and the working reliability of the high-power chip are improved.