32results about How to "Formation is also reduced and inhibited" patented technology

Disclosed is a composition comprising at least two of the following ingredients: Magnolia extract, honokiol, humulus lupulus extract, hesperidin methyl chalcone, gotu kola, dipeptide valyl-tryptophane, palmitoyl tetrapeptide-3, corylus avellana bud extract, centella asiatica extract, cucumis sativa extract, morus alba extract, hibiscus sabdariffa flower extract, vitis vinifera extract, ascorbyl glucoside, citrus medica limonum extract, avena sativa kernel extract, hydrolyzed soy protein, aniseed myrtle extract, tasmania lanceolata leaf extract, artemisia abrotanum extract, or citrus grandis fruit extract or any combination thereof. Also disclosed are methods of treating skin conditions by topically applying the composition to skin.

The invention relates to conjugates that bind to targets, methods of using conjugates that bind to targets and methods of treating undesirable or aberrant cell proliferation or hyperproliferative disorders, such as tumors, cancers, neoplasia and malignancies that express a target.

The invention relates to nucleolin binding peptides, nucleolin binding peptides and anti-nucleolin antibody conjugates with cytotoxic activity, fusion constructs, methods of using nucleolin binding peptides and antibodies and fusion constructs thereof, and methods of treating various disorders, undesirable conditions and diseases treatable with nucleolin binding peptides and fusion constructs, such as undesirable or aberrant cell proliferation (hyperproliferation) or hyperproliferative disorders, including tumors, cancers, neoplasia and malignancies, angiogenesis related or dependent diseases, and inflammatory diseases and inflammation.

Provided is a method of inhibiting the formation of emulsions in a natural gas dehydrator by lubricating the upstream compressors and natural gas engines with a lubricating oil comprising an effective amount of one or more demulsifiers. Provided is also a method of lubricating the upstream compressors and natural gas engines with the same oil compositions.

Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper.

The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing disulfide compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using an acid copper electroplating bath which includes additives such as brighteners and levelers.

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by electroplating at a lower current density to fill through-holes.

Disclosed are proteinaceous molecules corresponding to an acetylation site and their use for inhibiting or reducing the nuclear localization of a nuclear localizable polypeptide, such as PD-1, PD-L1 and PD-L2. This invention also relates to the use of the proteinaceous molecules for altering at least one of (i) formation; (ii) proliferation; (iii) maintenance; (iv) epithelial to mesenchymal cell transition (EMT); or (v) mesenchymal to epithelial cell transition (MET) of a PD-1-, PD-L1- or PD-L2-overexpressing cell, and for treating or preventing a cancer in a subject.

The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.

Monocrystalline semiconductor substrates are textured with alkaline solutions to form pyramid structures on their surfaces to reduce incident light reflectance and improve light absorption of the wafers. The alkaline baths include hydantoin compounds and derivatives thereof in combination with alkoxylated glycols to inhibit the formation of flat areas between pyramid structures to improve the light absorption.

Described herein are methods for inhibiting drusen.

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.

Monocrystalline semiconductor substrates are textured with alkaline solutions to form pyramid structures on their surfaces to reduce incident light reflectance and improve light absorption of the wafers. The alkaline baths include compounds which inhibit the formation of flat areas between pyramid structures to improve the light adsorption.

Compositions and methods to reduce the formation of lipoprotein(a) are provided, thereby reducing the risk of aortic stenosis or aortic valve sclerosis. Antibodies or antigen-binding fragments thereof capable of binding apolipoprotein B₁₀₀ or apolipoprotein a are provided, which effectively prevents the binding and assembly of lipoprotein(a), thereby reducing the risk of aortic valve stenosis or sclerosis.