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35results about How to "Formation is also reduced and inhibited" patented technology

Magnolia extract containing compositions

Disclosed is a composition comprising at least two of the following ingredients: Magnolia extract, honokiol, humulus lupulus extract, hesperidin methyl chalcone, gotu kola, dipeptide valyl-tryptophane, palmitoyl tetrapeptide-3, corylus avellana bud extract, centella asiatica extract, cucumis sativa extract, morus alba extract, hibiscus sabdariffa flower extract, vitis vinifera extract, ascorbyl glucoside, citrus medica limonum extract, avena sativa kernel extract, hydrolyzed soy protein, aniseed myrtle extract, tasmania lanceolata leaf extract, artemisia abrotanum extract, or citrus grandis fruit extract or any combination thereof. Also disclosed are methods of treating skin conditions by topically applying the composition to skin.
Owner:MARY KAY INC

Antibody/drug conjugates and methods of use

ActiveUS20140127241A1Reducing and inhibiting proliferationReducing and inhibiting and growthAntibacterial agentsAntimycoticsDiseaseDrug conjugation
The invention relates to conjugates that bind to targets, methods of using conjugates that bind to targets and methods of treating undesirable or aberrant cell proliferation or hyperproliferative disorders, such as tumors, cancers, neoplasia and malignancies that express a target.
Owner:A28 THERAPEUTICS INC

Magnolia extract containing compositions

Disclosed is a composition comprising at least two of the following ingredients: Magnolia extract, honokiol, humulus lupulus extract, hesperidin methyl chalcone, gotu kola, dipeptide valyl-tryptophane, palmitoyl tetrapeptide-3, corylus avellana bud extract, centella asiatica extract, cucumis sativa extract, morus alba extract, hibiscus sabdariffa flower extract, vitis vinifera extract, ascorbyl glucoside, citrus medica limonum extract, avena sativa kernel extract, hydrolyzed soy protein, aniseed myrtle extract, tasmania lanceolata leaf extract, artemisia abrotanum extract, or citrus grandis fruit extract or any combination thereof. Also disclosed are methods of treating skin conditions by topically applying the composition to skin.
Owner:MARY KAY INC

Lytic domain fusion constructs and methods of making and using same

ActiveUS20090269341A1Reducing and inhibiting and growthReducing and inhibiting proliferationNervous disorderFollicle-stimulating hormoneAbnormal tissue growthAberrant cell
The invention relates to fusion constructs, methods of using fusion constructs and methods of treating undesirable or aberrant cell proliferation or hyperproliferative disorders, such as tumors, cancers, neoplasia and malignancies.
Owner:A28 THERAPEUTICS INC +1

Nucleolin-binding peptides, nucleolin- binding lytic peptides, fusion constructs and methods of making and using same

InactiveUS20110124564A1Reducing and decreasing and durationReducing and decreasing and and frequencyPeptide/protein ingredientsAntibody mimetics/scaffoldsAntibody conjugateBinding peptide
The invention relates to nucleolin binding peptides, nucleolin binding peptides and anti-nucleolin antibody conjugates with cytotoxic activity, fusion constructs, methods of using nucleolin binding peptides and antibodies and fusion constructs thereof, and methods of treating various disorders, undesirable conditions and diseases treatable with nucleolin binding peptides and fusion constructs, such as undesirable or aberrant cell proliferation (hyperproliferation) or hyperproliferative disorders, including tumors, cancers, neoplasia and malignancies, angiogenesis related or dependent diseases, and inflammatory diseases and inflammation.
Owner:A28 THERAPEUTICS INC

Lytic domain fusion constructs and methods of making and using same

ActiveUS8318899B2Reducing and inhibiting and growthReducing and inhibiting proliferationNervous disorderPeptide/protein ingredientsAbnormal tissue growthAberrant cell
The invention relates to fusion constructs, methods of using fusion constructs and methods of treating undesirable or aberrant cell proliferation or hyperproliferative disorders, such as tumors, cancers, neoplasia and malignancies.
Owner:A28 THERAPEUTICS INC +1

Method of demulsing a natural gas dehydrator

Provided is a method of inhibiting the formation of emulsions in a natural gas dehydrator by lubricating the upstream compressors and natural gas engines with a lubricating oil comprising an effective amount of one or more demulsifiers. Provided is also a method of lubricating the upstream compressors and natural gas engines with the same oil compositions.
Owner:CHEVRON ORONITE CO LLC

Filling through-holes

InactiveUS20160105975A1Reduce and inhibit dimple formationReduce and inhibit and voidAnodisationPrinted circuit aspectsCopperPulse plating
Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC

Method of filling through-holes

InactiveUS20140262801A1Reduce and inhibit dimple formationReduce and inhibit and voidLiquid/solution decomposition chemical coatingPrinted circuit manufactureCopperElectroplating
The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing disulfide compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using an acid copper electroplating bath which includes additives such as brighteners and levelers.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC

Method of filling through-holes to reduce voids and other defects

ActiveUS20170238427A1Reduce and inhibit dimple formationReduce and inhibit and voidPrinted circuit aspectsLiquid/solution decomposition chemical coatingHigh current densityPower flow
Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by electroplating at a lower current density to fill through-holes.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC

Lytic domain fusion constructs and methods of making and using same

InactiveUS20090233860A1Reducing and inhibiting and growthReducing and inhibiting proliferationNervous disorderPeptide/protein ingredientsAbnormal tissue growthAberrant cell
The invention relates to fusion constructs, methods of using fusion constructs and methods of treating undesirable or aberrant cell proliferation or hyperproliferative disorders, such as tumors, cancers, neoplasia and malignancies.
Owner:BOARD OF SUPERVISORS OF LOUISIANA STATE UNIV & AGRI & MECHANICAL COLLEGE +1

Proteinaceous molecules and uses therefor

Disclosed are proteinaceous molecules corresponding to an acetylation site and their use for inhibiting or reducing the nuclear localization of a nuclear localizable polypeptide, such as PD-1, PD-L1 and PD-L2. This invention also relates to the use of the proteinaceous molecules for altering at least one of (i) formation; (ii) proliferation; (iii) maintenance; (iv) epithelial to mesenchymal cell transition (EMT); or (v) mesenchymal to epithelial cell transition (MET) of a PD-1-, PD-L1- or PD-L2-overexpressing cell, and for treating or preventing a cancer in a subject.
Owner:EPIAXIS THERAPEUTICS PTY LTD

Method of filling through-holes

InactiveUS20140262799A1Reduce and inhibit dimple formationReduce and inhibit and voidLiquid/solution decomposition chemical coatingPrinted circuit manufactureNitrogenCopper
The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC

Texturing of monocrystalline semiconductor substrates to reduce incident light reflectance

ActiveUS20140065836A1Improve efficiencyFormation be also reduce and inhibitBiocideOrganic chemistryChemistrySingle crystal
Monocrystalline semiconductor substrates are textured with alkaline solutions to form pyramid structures on their surfaces to reduce incident light reflectance and improve light absorption of the wafers. The alkaline baths include hydantoin compounds and derivatives thereof in combination with alkoxylated glycols to inhibit the formation of flat areas between pyramid structures to improve the light absorption.
Owner:SUN CHEM CORP

Therapeutic oral composition

ActiveUS20170128340A1Ameliorate dry mouthTreat erosion and gingivitisAntibacterial agentsCosmetic preparationsDiseaseArginine
Owner:COLGATE PALMOLIVE CO

Antibody/drug conjugates and methods of use

ActiveUS20170121370A1Reducing and inhibiting proliferation and growthReducing and inhibiting cell proliferationAntibacterial agentsAntimycoticsDrug conjugationMalignancy
The invention relates to conjugates that bind to targets, methods of using conjugates that bind to targets and methods of treating undesirable or aberrant cell proliferation or hyperproliferative disorders, such as tumors, cancers, neoplasia and malignancies that express a target.
Owner:A28 THERAPEUTICS INC

Compositions And Methods For Inhibiting Drusen

InactiveUS20150051212A1Reduce and inhibt drusen formationAmeliorate and prevent and inhibit drusen-associated disorderBiocideAntinoxious agentsDrusenCancer research
Owner:REGENERATIVE RES FOUND

Method of filling through-holes to reduce voids and other defects

ActiveUS20170233886A1Reduce and inhibit dimple formationReduce and inhibit and voidCellsLiquid/solution decomposition chemical coatingHigh current densityCopper
Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC

Method of filling through-holes

The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC

Texturing of monocrystalline semiconductor substrates to reduce incident light reflectance

Monocrystalline semiconductor substrates are textured with alkaline solutions to form pyramid structures on their surfaces to reduce incident light reflectance and improve light absorption of the wafers. The alkaline baths include compounds which inhibit the formation of flat areas between pyramid structures to improve the light adsorption.
Owner:SUN CHEM CORP

Intraocular lens with a proofed surface

ActiveUS20140228947A1Formation of spots inside the polymer matrix is inhibited or reducedAvoid paddingOptical articlesIntraocular lensIntraocular lensMedicine
Methods and apparatus for an intraocular lens with a proofed surface are disclosed. The proofed surface functions as a barrier to fluid diffusion inside the material and within vacuoles. By preventing the interstitial filling of fluid, the formation of spots inside the polymer matrix is inhibited or reduced. The proofed surface of the intraocular lenses is a highly stable re-assembled surface without any coating or grafting.
Owner:S I F I SPA

Method of filling through-holes to reduce voids and other defects

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by electroplating at a lower current density to fill through-holes.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC

Compositions and methods for reduction of lipoprotein a formation and treatment of aortic valve sclerosis and aortic stenosis

PendingUS20210155682A1Reducing and inhibiting formationReduce severityCompound screeningApoptosis detectionAntigenUrology
Compositions and methods to reduce the formation of lipoprotein(a) are provided, thereby reducing the risk of aortic stenosis or aortic valve sclerosis. Antibodies or antigen-binding fragments thereof capable of binding apolipoprotein B100 or apolipoprotein a are provided, which effectively prevents the binding and assembly of lipoprotein(a), thereby reducing the risk of aortic valve stenosis or sclerosis.
Owner:ABCENTRA LLC

Method of filling through-holes to reduce voids and other defects

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC
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