Leveler and electroplating solution containing same
A leveling agent and compound technology, applied in the field of electroplating, can solve problems such as poor metal plating effect, affecting the stability of electronic equipment, and broken copper
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Embodiment 1
[0080] The preparation of embodiment 1 leveling agent (the reactant molar ratio is 0.7:0.3:1)
[0081] In a 100mL three-necked flask equipped with a condenser and a thermometer, add 4.06g (28.13mmol) of 2-phenylimidazole, 2.08g (12.06mmol) of N,N,N',N'-tetramethyl-1,6 - Hexamethylenediamine, 30mL deionized water, 8.13g (40.20mmol) 1,4-butanediol diglycidyl ether, adjust the pH value of the reaction system to 5 with 50% dilute sulfuric acid, and heat it in an oil bath at 50°C The mixture was stirred at low temperature for 1 hour, then raised to 90° C. and stirred for 10 hours, then stopped, cooled to room temperature, and adjusted to pH 2 of the reaction system with 50% dilute sulfuric acid to obtain an amber solution.
[0082] The NMR spectrum of the reaction product solution (heavy water as solvent, 300MHz) has the following peaks: δppm: 7.76-7.40 (m, 7H), 4.30-3.30 (m, 21.7H), 3.14-3.03 (m, 5.14H), 1.70 -1.20(m,9.12H), confirmed the structure.
Embodiment 2
[0083] The preparation of embodiment 2 leveling agent (the reactant molar ratio is 0.5:1:1)
[0084] In a 100mL three-necked flask equipped with a condenser and a thermometer, add 4.00g (27.74mmol) 4-phenylimidazole, 5.61g (55.48mmol) triethylamine, 34mL deionized water, 11.22g (55.48mmol) 1, 4-Butanediol diglycidyl ether, adjust the pH of the reaction system to 6 with 50% dilute sulfuric acid, heat in an oil bath, stir and react at 50°C for 2 hours, then rise to 90°C and stir for 15 hours, stop the reaction , cooled to room temperature, and adjusted the pH of the reaction system to 2 with 50% dilute sulfuric acid to obtain an amber solution.
[0085] The H NMR spectrum of the reaction product solution (heavy water as solvent, 300MHz) has the following peaks: δppm: 8.70-8.60 (m, 1H), 7.65-7.40 (m, 6H), 4.30-3.05 (m, 40H), 1.60-1.14 (m,26H), the structure was confirmed.
Embodiment 3~8
[0086] Embodiment 3~8 leveling agent preparation
[0087] The preparation method is the same as that in Example 1, except that the types and molar ratios of the reagents of imidazole compounds, tertiary amine compounds and epoxy compounds are shown in Table 1 for details.
[0088] Table 1
[0089]
[0090]
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