Method for electroplating stannum-cerium-bismuth alloy on microwave high-frequency circuit board

A high-frequency circuit board and bismuth alloy technology, applied in electrolysis process, electrolysis components, metal processing equipment, etc., can solve the problems of poor chemical stability and anti-interference, poor solderability and corrosion resistance, high dielectric loss, etc., to achieve Effects of widening the brightness range, strong corrosion resistance, and improving welding performance
CN101899691AActive Publication Date: 2010-12-01TAIZHOU BOTAI ELECTRONICS
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
TAIZHOU BOTAI ELECTRONICS
Publication Date
2010-12-01
Patent Text Reader

Abstract

The invention discloses a method for electroplating stannum-cerium-bismuth alloy on a microwave high-frequency circuit board, which comprises the following steps of: firstly, opening a cylinder for medicinal liquid for a electroplating stannum-cerium-bismuth alloy process; and secondly, electroplating the stannum-cerium-bismuth alloy according to a graph to complete the manufacturing of the process for electroplating the stannum-cerium-bismuth alloy on the microwave high-frequency circuit board. The high-frequency circuit board prepared by the method has high weldability and corrosion resistance, high chemical stability and anti-interference, low medium consumption and high signal transmission.
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Description

technical field

[0001] The invention provides a method for electroplating a tin-cerium-bismuth alloy on a microwave high-frequency circuit board. Background technique

[0002] At present, traditional microwave high-frequency circuit boards use traditional tin-plating, nickel-gold plating and hot air leveling technologies. The solderability and corrosion resistance of the tin layer and nickel-gold layer plated on these circuit boards are relatively poor. Moreover, the chemical stability and anti-interference are relatively poor, the dielectric loss is relatively high, and the transmission signal is relatively poor. Contents of the invention

[0003] The invention provides a method for electroplating a tin-cerium-bismuth alloy on a microwave high-frequency circuit board. The high-frequency circuit board prepared by the method has strong weldability and corrosion resistance, and has good chemical stability and Anti-interference, the dielectric loss is relatively low, and the...

Claims

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