Method for electroplating stannum-cerium-bismuth alloy on microwave high-frequency circuit board

A high-frequency circuit board and bismuth alloy technology, applied in electrolysis process, electrolysis components, metal processing equipment, etc., can solve the problems of poor chemical stability and anti-interference, poor solderability and corrosion resistance, high dielectric loss, etc., to achieve Effects of widening the brightness range, strong corrosion resistance, and improving welding performance

Active Publication Date: 2010-12-01
TAIZHOU BOTAI ELECTRONICS
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Problems solved by technology

[0002] At present, traditional microwave high-frequency circuit boards use traditional tin-plated, nickel-plated gold, and hot air leveling technologies. The solderability and corrosion resistance of the tin layer and nickel-gold layer plated on these circuit boards are relatively poor. Moreover, the chemical stability and anti-interference are relatively poor, the dielectric loss is relatively high, and the transmission signal is relatively poor.

Method used

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Embodiment Construction

[0007] The invention discloses a method for electroplating tin-cerium-bismuth alloy on a microwave high-frequency circuit board. Process: First clean the inside and outside of the plating tank, soak the tank wall with 5% sodium hydroxide for 4 hours, then pour the tank, then soak the tank wall with 5% sulfuric acid for 4 hours, pour the tank, rinse the tank, and put it in the plating tank Add 70L of pure water and 16kg of sulfuric acid, the concentration of sulfuric acid is 80-100ml / L, and stir; then add 6kg of stannous sulfate in the plating tank and keep stirring, the concentration of stannous sulfate is 40-70g / L, then Then add 1.5kg of ceric sulfate and 1.5kg of bismuth sulfate after heating and dissolving, cool down to room temperature, add additives and keep stirring. The concentration of ceric sulfate is 8-20g / L, and the concentration of bismuth sulfate is 3-5g / L. Additives include SNR -3A tin plating additive, SNR-3B tin plating cerium supplement and TNR-3 stabilizer, S...

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Abstract

The invention discloses a method for electroplating stannum-cerium-bismuth alloy on a microwave high-frequency circuit board, which comprises the following steps of: firstly, opening a cylinder for medicinal liquid for a electroplating stannum-cerium-bismuth alloy process; and secondly, electroplating the stannum-cerium-bismuth alloy according to a graph to complete the manufacturing of the process for electroplating the stannum-cerium-bismuth alloy on the microwave high-frequency circuit board. The high-frequency circuit board prepared by the method has high weldability and corrosion resistance, high chemical stability and anti-interference, low medium consumption and high signal transmission.

Description

technical field [0001] The invention provides a method for electroplating a tin-cerium-bismuth alloy on a microwave high-frequency circuit board. Background technique [0002] At present, traditional microwave high-frequency circuit boards use traditional tin-plating, nickel-gold plating and hot air leveling technologies. The solderability and corrosion resistance of the tin layer and nickel-gold layer plated on these circuit boards are relatively poor. Moreover, the chemical stability and anti-interference are relatively poor, the dielectric loss is relatively high, and the transmission signal is relatively poor. Contents of the invention [0003] The invention provides a method for electroplating a tin-cerium-bismuth alloy on a microwave high-frequency circuit board. The high-frequency circuit board prepared by the method has strong weldability and corrosion resistance, and has good chemical stability and Anti-interference, the dielectric loss is relatively low, and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/60C25D5/02C25D17/00B23K1/20
Inventor 施吉连
Owner TAIZHOU BOTAI ELECTRONICS
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