Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for electroplating stannum-cerium-bismuth alloy on microwave high-frequency circuit board

A technology of high-frequency circuit boards and bismuth alloys, which is applied in electrolytic processes, electrolytic components, metal processing equipment, etc., can solve problems such as poor chemical stability and anti-interference, poor solderability and corrosion resistance, and poor transmission signals. Achieve the effects of widening the light range, strong corrosion resistance, and improving precision

Active Publication Date: 2012-05-23
TAIZHOU BOTAI ELECTRONICS
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, traditional microwave high-frequency circuit boards use traditional tin-plated, nickel-plated gold, and hot air leveling technologies. The solderability and corrosion resistance of the tin layer and nickel-gold layer plated on these circuit boards are relatively poor. Moreover, the chemical stability and anti-interference are relatively poor, the dielectric loss is relatively high, and the transmission signal is relatively poor.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0007] The invention discloses a method for electroplating tin-cerium-bismuth alloy on a microwave high-frequency circuit board, which comprises the following steps: step one, opening the tank for electroplating tin-cerium-bismuth alloy process solution: first cleaning the plating tank, and cleaning the plating tank Process: first clean the inside and outside of the plating tank, soak the tank wall with 5% sodium hydroxide for 4 hours, then pour the tank, then soak the tank wall with 5% sulfuric acid for 4 hours, pour the tank, rinse the inside of the tank, and place it in the plating tank. Add 70L of pure water and 16kg of sulfuric acid, the concentration of sulfuric acid is 80-100ml / L, and stir; then add 6kg of stannous sulfate in the plating tank and keep stirring, the concentration of stannous sulfate is 40-70g / L, then Then add 1.5kg of cerium sulfate and 1.5kg of bismuth sulfate after heating and dissolving to room temperature. Add additives and keep stirring. The concentra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for electroplating stannum-cerium-bismuth alloy on a microwave high-frequency circuit board, which comprises the following steps of: firstly, opening a cylinder for medicinal liquid for a electroplating stannum-cerium-bismuth alloy process; and secondly, electroplating the stannum-cerium-bismuth alloy according to a graph to complete the manufacturing of the process for electroplating the stannum-cerium-bismuth alloy on the microwave high-frequency circuit board. The high-frequency circuit board prepared by the method has high weldability and corrosion resistance, high chemical stability and anti-interference, low medium consumption and high signal transmission.

Description

Technical field [0001] The invention provides a method for electroplating tin-cerium-bismuth alloy on a microwave high-frequency circuit board. Background technique [0002] At present, traditional microwave high frequency circuit boards use traditional tin plating, nickel gold plating and hot air leveling technology. The tin layer and nickel gold layer plated on these circuit boards have poor solderability and corrosion resistance. Moreover, the chemical stability and anti-interference are relatively poor, the dielectric loss is relatively high, and the transmission signal is relatively poor. Summary of the invention [0003] The invention provides a method for electroplating tin-cerium-bismuth alloy on microwave high-frequency circuit boards. The high-frequency circuit boards prepared by it have strong solderability and corrosion resistance, and have good chemical stability and Anti-interference, low dielectric loss, strong transmission signal. [0004] The present invention ado...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/60C25D5/02C25D17/00B23K1/20
Inventor 施吉连
Owner TAIZHOU BOTAI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com