Preparation method of reverse copper foil

A technology of copper foil and copper content, applied in electrolysis process, electroforming, etc., can solve the problems of low peel strength, coarse surface crystallization, residual copper on circuit boards, etc.

Pending Publication Date: 2020-06-19
深圳市惟华电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, due to the uneven distribution of crystalline particles on the surface of copper foil, the following problems are caused:
[0004] First, the tensile strength and elongation of the traditional copper foil for circuit boards are low, and it is easy to cause wrinkles during the lamination process;
[0005] Second, the traditional copper foil used for circuit boards has a thick outline

Method used

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  • Preparation method of reverse copper foil
  • Preparation method of reverse copper foil
  • Preparation method of reverse copper foil

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0046] Example 1

[0047] Such as figure 1 As shown, the present invention provides a process method for reverse electrolytic copper foil, including the following steps: electrolyte preparation adopts 99% cathode copper plate, sulfuric acid and deionized water into a copper melting tank, and at a constant temperature of 50°C, In the copper foil production process, the electrolyte is recycled, and the electrolytic copper is continuously precipitated from the titanium roller, thereby continuously consuming the copper in the electrolyte, and the copper melting tank continuously dissolves the copper to supplement the copper consumed in the electrolyte. The copper content in the electrolyte is always balanced. In the electrolyte preparation process, not only must the electrolyte continue to circulate, but also the electrolyte composition must be adjusted and stably controlled in time. The copper content in the electrolyte is 130-220g / L and the sulfuric acid content is 70-100g / L; The ...

Example Embodiment

[0048] Example 2

[0049] A process method of reverse electrolytic copper foil includes the following steps:

[0050] Use the electrolyte preparation method in Example 1 to prepare an electrolyte;

[0051] The copper content in the electrolyte is 130-220g / L and the sulfuric acid content is 70-100g / L; the electrolyte is heated to 45 degrees, and 7 parts by mass of WH-001 additive is added to 1000 parts by volume of the electrolyte per hour. Add 3 parts by mass of WH-002 additive to the electrolyte by volume, 3 parts by mass of WH-003 for the electrolyte of 1000 parts by volume, add 15 ml of 16% hydrochloric acid to the electrolyte and mix well, then the electrolyte enters the anode tank; Under the action of an electric field, the current density of the electrolyte is 20-30A / dm2, the cations move to the cathode and the anions move to the anode, and the electrochemical reaction is carried out to make a single-sided electrolytic copper foil with uniform surface density. Single-sided sm...

Example Embodiment

[0052] Example 3

[0053] A process method of reverse electrolytic copper foil includes the following steps:

[0054] Use the electrolyte preparation method in Example 1 to prepare an electrolyte;

[0055] The copper content in the electrolyte is 130-220g / L, and the sulfuric acid content is 70-100g / L; the electrolyte is heated to 45 degrees, and 10 parts by mass of WH-001 additive are added to 1000 parts by volume of the electrolyte per hour. Add 3 parts by mass of WH-002 additive to a volume of electrolyte, 5 parts by mass of WH-003 additive to a 1000 volume of electrolyte, add 15 ml of 16% hydrochloric acid to the electrolyte and mix well, then the electrolyte enters the anode tank; Under the action of an electric field, the current density of the electrolyte is 20-30A / dm2, the cations move to the cathode and the anions move to the anode, and the electrochemical reaction is carried out to make a single-sided electrolytic copper foil with uniform surface density. Single-sided smoo...

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Abstract

The invention discloses a preparation method of reverse copper foil. The preparation method of the reverse copper foil comprises the following steps of electrolytic bath arrangement, addition agent addition, stirring operation, primary electroplating operation, primary roughening operation, primary curing operation, secondary electroplating operation, secondary roughening operation, secondary curing operation, cleaning operation, anti-oxidation treatment and drying operation. A titanium iridium anode plate and a titanium roller are adopted, an electrolytic solution is used in an electrolytic bath, specifically, the copper content of the electrolytic solution ranges from 130g/L to 220g/L, and the sulfuric acid content of the electrolytic solution ranges from 70g/L to 100g/L. When addition agents are added, the electrolytic solution is heated to enable the temperature to range from 45 DEG C to 50 DEG C, and 5-10 parts of WH-001 addition agents, 3-5 parts of WH-002 addition agents and 2-3parts of WH-003 addition agents by mass are added to 1000 parts of electrolytic solutions by volume every hour. When the secondary electroplating operation is conducted, 5-10 parts of WH-004 additionagents by mass are added. When the secondary roughening operation is conducted, 5-15 parts of WH-005 addition agents by mass are added, and the secondary roughening operation is accomplished. By theadoption of the technology, the potential barrier of metal nucleation is reduced, the nucleation speed is increased, high-density copper particle crystals can be formed on the surface of the copper foil, the non-uniformity degree of the surface is reduced, the mechanical property of the copper foil is improved, and therefore the tensile strength and the peeling resistance strength of the copper foil are improved.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil, in particular to a preparation method of reverse electrolytic copper foil. Background technique [0002] Copper foil is a negative electrolytic material, a thin, continuous layer of metal foil deposited on the base layer of the circuit board, which acts as a conductor for the PCB. Copper foil is electrodeposited copper foil in English, which is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB). In the rapid development of today's electronic information industry, electrolytic copper foil is called: the "neural network" of electronic product signal and power transmission and communication. It easily adheres to the insulating layer, accepts the printed protective layer, and forms a circuit pattern after etching. Copper foil has low surface oxygen characteristics, can be attached to various substrates, such as metals, insulati...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38C25D5/10C25D5/48C25D7/06
CPCC25D1/04C25D3/38C25D5/10C25D5/48C25D7/0614
Inventor 杨木强
Owner 深圳市惟华电子科技有限公司
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