A kind of through-hole electroplating method of printed circuit board

Abstract

The invention relates to a through-hole electroplating method of a printed circuit board, comprising the following steps: grafting graphene oxide with γ-aminoethylaminopropyltrimethoxysilane to obtain a product A; making the product A adsorb active metal ions, The product B is obtained; the product B is physically adsorbed to the surface of the insulating substrate of the through-hole wall of the printed circuit board to form an adsorption layer; the adsorption layer is converted into a conductive layer through a chemical reduction process; the through-hole wall with a conductive layer is electroplated A metal layer is formed. In the present invention, graphene oxide is selected and grafted with γ-aminoethylaminopropyltrimethoxysilane. Due to the formation of high-density oxygen bond functional sites at the grafting interface, the adsorption capacity for active metal ions is effectively improved, and the conductive layer The ethylenediamine groups on the surface can effectively improve the ability to capture copper ions in the solution during the electroplating process, accelerate the mass transfer of copper ions, and facilitate the accelerated deposition of copper plating in the holes, thereby greatly enhancing the uniformity of the plating solution. Plating ability.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and in particular relates to a through-hole electroplating method for printed circuit boards. Background technique [0002] After the printed circuit board is drilled, hole metallization is required to achieve interconnection between layers. Hole metallization consists of two steps, first forming a conductive layer on the hole wall, and then thickening it by electroplating. Graphene is a two-dimensional material with ultrahigh electrical conductivity. At present, the industry has begun to try to use graphene as a conductive layer in the metallization process. [0003] However, if the conductive layer does not contain metal or metal particles, it is difficult to directly deposit the coating on the non-metallic conductive layer. Usually, it is necessary to use the original metal as the starting point for lateral growth, but the uniformity of the thickness of the coating formed in this way P...

AI Technical Summary

Problems solved by technology

However, it uses highly toxic organic solvents such as tetrahydrofuran, which is not conducive to human health

Images