Electroplating solution circulating filtration device used in electroplating technology

Abstract

The invention discloses an electroplating solution circulation filtering device used in electroplating process, which comprises an electroplating tank, an electroplating solution filtering tank and a circulation system. tube; the electroplating solution filter tank is located below the electroplating solution discharge pipe, and a vertical partition and a horizontal filter plate are arranged on the electroplating solution filter tank; the circulation system includes a liquid inlet pipe, a suction pump and Liquid outlet pipe, the inlet of the liquid inlet pipe is located on the side wall of the post-filtration area in the electroplating solution filter tank, and the liquid outlet pipe extends into the electroplating tank. In the electroplating solution circulating filter device of the present invention, since the electroplating solution in the electroplating tank and the electroplating solution filter tank is filtered through the filter plate and then returns to the electroplating tank through the circulation system, a cyclic agitation is formed around the workpiece to be plated in the electroplating tank, thereby reducing the loss of the electroplating solution. Concentration polarization increases the upper limit of allowable cathode current density, effectively preventing solid particles from adhering to the workpiece to be plated and forming pinhole-like plating defects.

Description

technical field [0001] The invention relates to the technical field of electroplating technology, in particular to an electroplating solution circulation filter device used in the electroplating technology. Background technique [0002] Electroplating is mainly used to improve the corrosion resistance, wear resistance and decoration of the surface of the workpiece, or to make the surface of the workpiece have certain functions, and its electroplating is widely used. In order to ensure the quality of the coating, in addition to strictly controlling the process parameters such as temperature, current density, and PH, it is also necessary to pay attention to the influence of factors such as the stirring of the plating solution and the impurities in the plating solution on the quality of the plated parts. In order to prevent air bubbles from staying on the surface of the coating And concentration polarization during electroplating, usually adopt mechanical stirring or air stirri...

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Problems solved by technology

In order to ensure the quality of the coating, in addition to strictly controlling the process parameters such as temperature, current density, and PH, it is also necessary to pay attention to the influence of factors such as the stirring of the plating solution and the impurities in the plating solution on the quality of the plated parts. In order to prevent air bubbles from staying on the surface of the coating And concentration polarization during electroplating, usually adopt mechanical stirring or air stirring, or use circulating flow mode to improve the circulation of electroplating solution, but it is easy to cause the decomposition of cyanide, and bring oil, dust, etc. Plating solution, thus affecting the quality of electroplating

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