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This invention discloses an IoT chip module encapsulation conveying device, including a CNC guide rail and a carrier block. A laterally movable mounting plate is installed on the CNC guide rail, and a rack is fixedly connected to one side of the CNC guide rail. An air supply mechanism is installed on the mounting plate, and the rack is drivenly connected to the air supply mechanism. A first sliding groove is formed on the mounting plate, and a locking block is provided on the carrier block. This IoT chip module encapsulation conveying device, through the setting of a buffer mechanism, allows the carrier block to slide along the first sliding groove due to inertia the instant the mounting plate stops. The buffer mechanism can buffer the carrier block, thereby reducing the possibility of the encapsulant on the chip flowing out or deforming due to inertia. Through the coordinated arrangement of the rack, air supply mechanism, and buffer damping adjustment mechanism, the buffer mechanism can automatically adjust the damping magnitude according to the speed of the carrier block's movement, further improving the practicality of the device.