Method for preparing copper-clad tungsten tungsten-copper composite powder

Abstract

The invention provides a method for preparing copper-clad tungsten tungsten-copper composite powder. The method comprises the following steps of: preparing plating solution and heating a container accommodating the plating solution by using a constant temperature water bath; performing acid-washing and alkali-washing on tungsten powder; adding the tungsten powder into the plating solution; performing complex stirring of mechanical stirring and air stirring on the plating solution; and cleaning the plated composite powder, drying and annealing. The preparation method has the advantage that: the complex stirring of the mechanical stirring and the air stirring is adopted, so the plating speed can be increased, the plating coat can be thickened, the adjustment range of copper content can be widened and the plating solution can be kept stable during industrial mass production.

Description

technical field [0001] The invention belongs to the technical field of powder metallurgy, and in particular relates to a method for preparing copper-clad tungsten-tungsten-copper composite powder. Background technique W-Cu alloy is composed of highly conductive copper and refractory metal tungsten. Metal tungsten and copper neither dissolve each other nor form intermetallic compounds. Tungsten and copper can only be mixed uniformly as a monomer to form a pseudo-alloy alloy). Therefore, the W-Cu alloy presents the advantages of high temperature resistance, high hardness, and low expansion coefficient of tungsten, and the comprehensive excellent properties of copper such as high thermal conductivity and good plasticity. Therefore, tungsten-copper material has excellent resistance to arc ablation, welding resistance and good electrical and thermal conductivity, and has attracted much attention in the fields of medium and high voltage electrical appliances, communications, av...

AI Technical Summary

Problems solved by technology

However, in the process of industrialized mass production, there are still problems such as slow plating speed, thin coating, low copper content and unstable plating solution.

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