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Chemical copper plating liquid and preparation method thereof

A technology of electroless copper plating and complexing agent, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of cumbersome process, complex composition, instability, etc., to improve the plating speed and improve the stability. The effect of smoothness and uniformity of copper plating film

Inactive Publication Date: 2019-11-29
SUZHOU TIANCHENG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, monovalent copper is unstable in the electroless copper plating solution, and additional antioxidants are needed to maintain the stability of cuprous ions. The composition is complex and the process is cumbersome.

Method used

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  • Chemical copper plating liquid and preparation method thereof
  • Chemical copper plating liquid and preparation method thereof
  • Chemical copper plating liquid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment provides an electroless copper plating solution and a preparation method thereof.

[0039] Wherein, the electroless copper plating solution includes the following components: copper sulfate 8g / L, formaldehyde 6g / L, potassium sodium tartrate 10g / L, EDTA tetrasodium 8g / L and 2,2'-bipyridine 0.0001 g / L, wherein the solvent is deionized water, and sodium hydroxide is used to adjust the pH of the above copper plating solution to 12.

[0040] The preparation method of present embodiment electroless copper plating solution is as follows:

[0041] First mix copper sulfate with deionized water for the first time, then mix with potassium sodium tartrate, tetrasodium edetate, 2,2'-bipyridine and formaldehyde for the second time in turn, and use hydrogen oxidation after the mixing is completed The pH of the above-mentioned copper plating solution was adjusted to 12 with sodium, and finally the volume was constant with water to obtain the electroless copper plating ...

Embodiment 2

[0043] This embodiment provides an electroless copper plating solution and a preparation method thereof.

[0044]Wherein, the electroless copper plating solution comprises the following components: copper sulfate 8g / L, formaldehyde 6g / L, potassium sodium tartrate 30g / L, tetrasodium edetate 5g / L and thiourea 0.001g / L, wherein , the solvent is deionized water, and the pH of the above-mentioned copper plating solution is adjusted to 12.5 using sodium hydroxide.

[0045] The preparation method of present embodiment electroless copper plating liquid is as follows:

[0046] First mix copper sulfate with deionized water for the first time, then mix with sodium potassium tartrate, tetrasodium ethylenediaminetetraacetic acid, thiourea and formaldehyde for the second time in turn, after the mixing is completed, use sodium hydroxide to coat the above copper The pH of the solution was adjusted to 12.5, and finally the volume was constant with water to obtain the electroless copper platin...

Embodiment 3

[0048] This embodiment provides an electroless copper plating solution and a preparation method thereof.

[0049] Wherein, the electroless copper plating solution comprises the following components: copper sulfate 8g / L, formaldehyde 6g / L, potassium sodium tartrate 50g / L, tetrasodium edetate 3g / L and thiosemicarbazide 0.001g / L, Wherein, the solvent is deionized water, and sodium hydroxide is used to adjust the pH of the copper plating solution to 13.

[0050] The preparation method of present embodiment electroless copper plating liquid is as follows:

[0051] First mix copper sulfate with deionized water for the first time, then mix it with potassium sodium tartrate, tetrasodium ethylenediaminetetraacetic acid, thiosemicarbazide and formaldehyde for the second time. The pH of the copper solution was adjusted to 13, and finally the volume was constant with water to obtain the electroless copper plating solution.

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Abstract

The invention provides chemical copper plating liquid and a preparation method thereof. The chemical copper plating liquid comprises, by mass concentration, 1-10 g / L of water soluble cupric salt, 10-100 g / L of a first complexing agent, 3-20 g / L of a second complexing agent, 2-50 g / L of a reduction agent and 0.001-100 mg / L of stabilizer. According to the chemical copper plating liquid, the specificsecond complexing agent is selected, by means of mutual operation and synergistic interaction between the two complexing agents, thus the obtained chemical copper plating liquid is stable without decomposing in the plating application process, and the plating speed of the chemical copper plating liquid is also increased substantially. In addition, a copper plated film obtained after the chemicalcopper plating liquid applies plating is smooth and uniform, and the requirement for functionality chemical copper plating can be met.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to an electroless copper plating solution and a preparation method thereof. Background technique [0002] Since the 1950s, electroless copper plating has been industrialized. After more than half a century of hard work, this technology has been applied in various fields of the national economy. Electroless copper plating occupies a very important position in electroless plating, and has been widely used in various aspects such as the bottom layer of non-metallic plating, hole metallization of printed boards, and electromagnetic shielding layers of electronic instruments. In the past 30 years, a lot of achievements have been made in the research on electroless copper plating, but there are still many problems, for example, how to coordinate the stability and plating speed of the electroless copper plating solution to achieve a certain plating speed. And the electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
CPCC23C18/40C23C18/405
Inventor 邵永存
Owner SUZHOU TIANCHENG CHEM
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