Chemical copper plating liquid and preparation method thereof

Abstract

The invention provides chemical copper plating liquid and a preparation method thereof. The chemical copper plating liquid comprises, by mass concentration, 1-10 g / L of water soluble cupric salt, 10-100 g / L of a first complexing agent, 3-20 g / L of a second complexing agent, 2-50 g / L of a reduction agent and 0.001-100 mg / L of stabilizer. According to the chemical copper plating liquid, the specificsecond complexing agent is selected, by means of mutual operation and synergistic interaction between the two complexing agents, thus the obtained chemical copper plating liquid is stable without decomposing in the plating application process, and the plating speed of the chemical copper plating liquid is also increased substantially. In addition, a copper plated film obtained after the chemicalcopper plating liquid applies plating is smooth and uniform, and the requirement for functionality chemical copper plating can be met.

Description

technical field

[0001] The invention relates to the technical field of circuit board production, in particular to an electroless copper plating solution and a preparation method thereof. Background technique

[0002] Since the 1950s, electroless copper plating has been industrialized. After more than half a century of hard work, this technology has been applied in various fields of the national economy. Electroless copper plating occupies a very important position in electroless plating, and has been widely used in various aspects such as the bottom layer of non-metallic plating, hole metallization of printed boards, and electromagnetic shielding layers of electronic instruments. In the past 30 years, a lot of achievements have been made in the research on electroless copper plating, but there are still many problems, for example, how to coordinate the stability and plating speed of the electroless copper plating solution to achieve a certain plating speed. And the electro...

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