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Chemical copper plating solution and chemical copper plating method

A technology of electroless copper plating and cuprous chloride, which is applied in the field of electroless plating, can solve the problems of unstable plating quality during electroless copper plating, decreased production efficiency, and low copper plating speed, so as to ensure quality, improve plating speed, good stabilizing effect

Inactive Publication Date: 2018-06-22
四川省劲腾环保建材有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But at the same time, due to the large amount of complexation of copper ions, the copper plating speed will be low, resulting in a decline in production efficiency, and the electroless copper plating time is too long to easily cause the quality of the plating layer to be unstable.

Method used

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  • Chemical copper plating solution and chemical copper plating method

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Embodiment 1

[0036] The present embodiment provides a kind of electroless copper plating solution, it comprises:

[0037] Cuprous salt (cuprous chloride) 10g / L, formaldehyde 7.5g / L, phosphine ligand (triphenylphosphine) 25g / L, auxiliary complexing agent (ethylenediamine) 0.5g / L, stabilizer (linked pyridine) 1g / L, surfactant (sodium dodecylbenzenesulfonate) 0.5g / L.

[0038] Its preparation method is as follows:

[0039] S1. Dissolving the phosphine ligand, auxiliary complexing agent, and surfactant in deionized water, and stirring evenly to obtain the first solution;

[0040] S2. Add a stabilizer and formaldehyde to the first solution, stir evenly, and adjust the pH to 11 with sodium hydroxide to obtain a second solution;

[0041] S3. Add cuprous salt to the above second solution, stir until dissolved, and age at room temperature for 24 hours to obtain the desired electroless copper plating solution.

Embodiment 2

[0043] The present embodiment provides a kind of electroless copper plating solution, it comprises:

[0044] Cuprous salt (cuprous chloride) 20g / L, formaldehyde 15g / L, phosphine ligand (triphenylphosphine) 50g / L, auxiliary complexing agent (sodium citrate) 2.5g / L, stabilizer (bipyridyl ) 1g / L, surfactant (sodium dodecylbenzenesulfonate) 0.1g / L.

[0045] Its preparation method is as follows:

[0046] S1. Dissolving the phosphine ligand, auxiliary complexing agent, and surfactant in deionized water, and stirring evenly to obtain the first solution;

[0047] S2. Add a stabilizer and formaldehyde to the first solution, stir evenly, and adjust the pH to 13 with sodium hydroxide to obtain a second solution;

[0048] S3. Add cuprous salt to the above second solution, stir until dissolved, and age at room temperature for 36 hours to obtain the desired electroless copper plating solution.

Embodiment 3

[0050] The present embodiment provides a kind of electroless copper plating solution, it comprises:

[0051] Cuprous salt (cuprous bromide) 15g / L, formaldehyde 10g / L, phosphine ligand (tributylphosphine) 40g / L, auxiliary complexing agent (sodium citrate) 2g / L, stabilizer (methanol) 0.5 g / L, surfactant (sodium lauryl sulfate) 0.2g / L.

[0052] Its preparation method is as follows:

[0053] S1. Dissolving the phosphine ligand, auxiliary complexing agent, and surfactant in deionized water, and stirring evenly to obtain the first solution;

[0054] S2. Add a stabilizer and formaldehyde to the first solution, stir evenly, and adjust the pH to 11 with sodium hydroxide to obtain a second solution;

[0055] S3. Add cuprous salt to the above second solution, stir until dissolved, and age at room temperature for 24 hours to obtain the desired electroless copper plating solution.

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Abstract

The invention discloses a chemical copper plating solution and relates to the field of chemical plating. According to the chemical copper plating solution, formaldehyde serves as a reducing agent; cuprous salt serves as a copper source; and complexing of the cuprous salt is conducted with phosphine ligand as a complexing reagent. Monovalent copper ions are different from bivalent copper ions in that the monovalent copper ions are likely to be subjected to a disproportionated reaction in water to generate elementary substance copper and bivalent copper, and ligand needs to be added to stabilizethe monovalent copper ions. The monovalent copper ions belongs to soft acid specified in the Louis acid and base theory, and the effect that the monovalent copper ions are matched with traditional nitrogen and oxygen ligand belonging to hard base is poor. According to the chemical copper plating solution, the adopted phosphorus ligand belongs to soft base and is good in coordination with the monovalent copper ions, and the good stabilizing effect can be achieved for the monovalent copper ions; and product quality is improved while the plating speed is increased. The invention further discloses a chemical copper plating method. According to the chemical copper plating method, a to-be-placed workpiece is put in the chemical copper plating solution for chemical plating at the temperature of40-60 DEG C. The method is high in plating speed, good in stability and high in production efficiency.

Description

technical field [0001] The invention relates to the field of electroless plating, in particular to an electroless copper plating solution and a method for electroless copper plating. Background technique [0002] Since Brenner and Ridlell first developed the electroless copper plating technology in the 1940s, after more than half a century of hard work, this technology has been vigorously developed, and it has been widely used in the bottom layer of non-metallic plating and the holes of printed boards. Various aspects such as metallization and electromagnetic shielding layer of electronic instruments. In the process of conductive treatment of non-metallic materials, electroless copper plating is usually used as the first step, which can provide an initial continuous and uniform conductive substrate for subsequent complete and excellent conductive plating. Since the electroless copper plating using formaldehyde as a reducing agent not only has a lower production cost, but al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
CPCC23C18/405
Inventor 游义才蔡建利陈启超林永刚王元彤汤春林邓彦吴宗玖汪秀
Owner 四川省劲腾环保建材有限公司
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