Method of manufacturing ultrafine molybdenum powder or ultrafine tungsten powder surface clad metal copper

Abstract

The invention relates to a preparation method for a metal copper covered on the surface of ultrafine molybdenum powder or ultrafine tungsten powder, which belongs to the field of new materials. The preparation method is characterized in that the method mainly adopts the ultrafine molybdenum powder or the ultrafine tungsten powder with the average particle diameter D50 not more than 1.3 Mum, which is mixed with Cu<2+> soluble salt solution under the continual stirring, polymeric surfactant of coordination group with N atom and O atom is added, one of hydrazine hydrate, sodium hydrosulfite or sodium hypophosphite is added as reducing agent, and an appropriate amount of alkali is dropwise added to adjust pH value in the period so that pH value of the reaction system is from 5.5 to 12.0; in addition, in the range of 20 to 95 DEG C, the reaction continues for 0.5 to 3 hours; the ultrafine molybdenum powder or the ultrafine tungsten powder is filtered through flushing by diluted NH4Cl or NH4NO3 solution, the powder is pulped by alcoholic solution with 0.2-3.0 percent of fatty acid, and the ultrafine molybdenum powder or the ultrafine tungsten powder is filtered again, the powder is heated and dried by H2, to prepare the ultrafine molybdenum powder or the ultrafine tungsten powder of the metal copper covered with the even surface. Through adjusting the proportion of soluble salt of the ultrafine molybdenum powder or the ultrafine tungsten powder and the copper, the ultrafine molybdenum powder or the ultrafine tungsten powder covered by metal copper with different composition proportions can be prepared to meet different demands.

Description

Technical field [0001] The invention relates to a preparation method for coating metal copper on the surface of ultrafine molybdenum powder or ultrafine tungsten powder, in particular to a preparation method for coating metal copper with nanometer thickness on the surface of ultrafine molybdenum powder or ultrafine tungsten powder, and belongs to a novel Material technology field. Background technique [0002] Molybdenum copper material, like tungsten copper material, is a pseudoalloy composed of two immiscible metal phases in structure. Therefore, this material has the characteristics of both constituent metals and has good overall performance. [0003] 1. High electrical and thermal conductivity [0004] Molybdenum and tungsten are elements with good electrical and thermal conductivity in addition to high-conductivity metals such as gold, silver and copper. Therefore, tungsten-copper and molybdenum-copper materials that are further added with highly conductive and thermally con...

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Problems solved by technology

[0009] 4. Non-magnetic

[0019] The method of inorganic powder surface metallization announced in CN1401819 patent literature, the electroless plating method that Huang Jianzhong etc. propose produces high activity, high uniformity Cu, Ni clad tungsten composite powder (mining and metallurgy engineering, the 16th volume the 3rd in September, 1996 Issue), and Qin Guangrong et al. (Compilation of papers on new hydrogen storage materials and their application seminars, "863" hydrogen storage materials special group, December 1990, research on the performance of hydrogen storage alloy particle electroless copper plating process P193) proposed surface Copper plating technology uses stannous chloride for sensitization in the surface coating process, but in molybdenum copper and tungsten copper alloys used in electric vacuum materials, tin, aluminum and other low melting point metals should not be introduced, otherwise it will affect the Vacuum performance has a negative impact; the formaldehyde-free chemical copper plating method and the solution used in the method disclosed by CN1502720 patent documents also need catalytic components such as palladium and tin; the microporous copper film disclosed by CN1204291 patent documents and used The electroless copper plating solution for preparing the copper film is not suitable for superfine molybdenum powder and ultrafine tungsten powder surface coating; the chemical copper plating solution formula of rare earth nickel-based hydrogen storage alloy powder disclosed in CN1060697 patent literature and its copper plating Method, Cu 2+ Replacement and reduction can occur on the surface of hydrogen storage alloy powder. On the surface of tungsten powder and molybdenum powder, this reaction is difficult to carry out; on the surface of ultrafine molybdenum powder and tungsten powder with a particle size of submicron and nanometer, the metal copper is uniformly coated , and do not introduce impurities, the thickness of the coating should be in the nanometer range, which is difficult to achieve by conventional electroless plating methods

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