Method for performing electroless nickel plating on surface of aluminum nitride ceramic

A technology of aluminum nitride ceramics and surface chemistry, applied in the direction of liquid chemical plating, coating, metal material coating technology, etc., can solve problems such as uneven coating, poor brazing performance, residue, etc.

Active Publication Date: 2011-02-02
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in addition to the precipitation of solid Ni and P in the process of electroless nickel plating, there are also gaseous H 2 The precipitation, if H 2 If the coating and plating solution cannot be discharged in time, they will remain in the coating, resulting in uneven coating and poor brazing performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Polish the aluminum nitride substrate with 150# sandpaper, wash and degrease with acetone and deionized water, then soak in 400g / L NaOH solution for 15 minutes, and then sensitize with 20g / L stannous chloride solution at room temperature for 5 minutes , activated with 0.5mg / L palladium chloride solution for 5 minutes, and finally placed in the following formula solution for nickel plating:

[0023] nickel sulfate

[0024] The temperature of the plating solution is 70°C, the pH value is 4.5, and the plating time is 30 minutes. The obtained coating is dense and smooth, the bonding force between the coating and the substrate is enhanced, and the brazing property of the coating is good.

Embodiment 2

[0026] Polish the aluminum nitride substrate with 150# sandpaper, wash it with acetone and deionized water to remove oil, then soak it in 500g / L NaOH solution for 15 minutes, and then sensitize it with 30g / L stannous chloride solution at room temperature for 5 minutes , activated with 0.5mg / L palladium chloride solution for 5 minutes, and finally placed in the following formula solution for nickel plating:

[0027] nickel sulfate

[0028] The temperature of the plating solution is 80°C, the pH value is 4.5, and the plating time is 30 minutes. The obtained coating is dense and smooth, the bonding force between the coating and the substrate is enhanced, and the brazing property of the coating is good.

Embodiment 3

[0030] Polish the aluminum nitride substrate with 150# sandpaper, wash it with acetone and deionized water to remove oil, then soak it in 600g / L NaOH solution for 15 minutes, and then sensitize it with 40g / L stannous chloride solution at room temperature for 5 minutes , activated with 0.5mg / L palladium chloride solution for 5 minutes, and finally placed in the following formula solution for nickel plating:

[0031] nickel sulfate

[0032] The temperature of the plating solution is 80°C, the pH value is 4.5, and the plating time is 30 minutes. The obtained coating is dense and smooth, the bonding force between the coating and the substrate is enhanced, and the brazing property of the coating is good.

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PUM

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Abstract

The invention provides a method for performing electroless nickel plating on the surface of aluminum nitride ceramic, belonging to the ceramic thin-film metallization field. The method comprises the following specific steps: 1) polishing the surface of aluminum nitride with a machinery; coarsening the aluminum nitride substrate with mixed acid or alkali, completely cleaning away the residual acid or alkali; 3) sensitizing the coarsened substrate in stannous chloride solution, activating in palladium chloride solution or performing activation without palladium; 4) weighting a certain amount of nickel sulphate, sodium hypophosphite, sodium citrate, sodium acetate, lactic acid, thiourea and sodium dodecyl sulfate in sequence to prepare a chemical plating solution; and 5) adjusting the pH value of the solution to 4.0-6.0 with acid or alkali, heating the solution to 70-95 DEG C, and placing the prepared substrate in the solution to perform electroless nickel plating. The invention is characterized in that the electroless nickel plating can be performed on the surface of the aluminum nitride ceramic substrate which is difficult to plate; and a certain amount of surfactant is added so that the plating becomes denser and smoother, the binding force between the plating and the substrate is increased, and the solderability of the plating is better.

Description

technical field [0001] The invention belongs to the field of thin film metallization of materials and provides a method for electroless nickel plating on the surface of aluminum nitride ceramics. Background technique [0002] Aluminum nitride ceramics have been widely used in the electronic packaging industry due to their excellent thermal conductivity, low dielectric constant, and thermal expansion coefficient matching chip materials. When aluminum nitride ceramics are used as electronic packaging materials, they need to be connected with various ceramics, metals and composite materials. In the process of connection, the ceramics need to be metallized first. Metallization is one of the key procedures in the whole connection process. [0003] There are various methods of ceramic metallization, such as magnetron sputtering, electroplating, vacuum evaporation, chemical plating, etc. Among these metallization methods, electroless nickel plating has many advantages, such as go...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C04B41/88C23C18/36
Inventor 曲选辉秦明礼钟小婧王英贤张怀龙吴茂
Owner UNIV OF SCI & TECH BEIJING
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