Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same

A technology of electroless nickel-tungsten-phosphorus plating and electroless plating, which is applied in the direction of liquid chemical plating, metal material coating technology, coating, etc., can solve problems such as difficulty in satisfying mass production, unsatisfactory coating quality, and low service life of the plating solution. Achieve high plating speed, high stability, and reduce pH value changes

Inactive Publication Date: 2008-07-23
罗森鹤
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing electroless nickel-tungsten-phosphorus plating technology has disadvantages such as slow plating speed, short se

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Preparation of plating solution: add nickel sulfate, sodium citrate, sodium gluconate, ammonium sulfate, sodium tetraborate, sodium tungstate, sodium hypophosphite, potassium iodate, thiourea, dodecyl Alkyl sodium sulfate, stir to dissolve and mix, the concentration of nickel sulfate is 24g / l, sodium citrate 40g / l, sodium gluconate 30g / l, ammonium sulfate 40g / l, sodium tetraborate 5g / l, sodium tungstate 50g / l, sodium hypophosphite 28g / l, potassium iodate 15mg / l, thiourea 0.5mg / l, sodium lauryl sulfate 15mg / l.

[0013] The pH value of the prepared plating solution was adjusted to 9 with sodium hydroxide, and heated to 87°C for use.

[0014] The plated piece is a Φ5mm×30mm brass piece. After pretreatment: degreasing-water washing-activation-water washing-nickel flash plating for 0.5min, put it in the plating solution for 40min and keep the temperature of the plating solution at 87 °C, a smooth, uniform, and well-bonded coating with a thickness of 10 μm was obtained, and ...

Embodiment 2

[0016] Preparation of plating solution: add nickel sulfate, sodium citrate, sodium gluconate, ammonium sulfate, sodium tetraborate, sodium tungstate, sodium hypophosphite, potassium iodate, thiourea, dodecyl Alkyl sodium sulfate, stir to dissolve and mix, the concentration of nickel sulfate is 28g / l, sodium citrate 70g / l, sodium gluconate 20g / l, ammonium sulfate 30g / l, sodium tetraborate 10g / l, sodium tungstate 30g / l, sodium hypophosphite 20g / l, potassium iodate 10mg / l, thiourea 1.5mg / l, sodium lauryl sulfate 5mg / l.

[0017] The pH value of the prepared plating solution was adjusted to 8 with sodium hydroxide, and heated to 85°C for use.

[0018] The plated piece is a 6061 aluminum alloy piece of Φ16mm×30mm. After pretreatment: degreasing-water washing-alkali corrosion-water washing-glazing-water washing-secondary galvanizing-water washing, put it in the plating solution for 60min and then dip During the process, the temperature of the plating solution was maintained at 85° C...

Embodiment 3

[0020] Preparation of plating solution: add nickel sulfate, sodium citrate, sodium gluconate, ammonium sulfate, sodium tetraborate, sodium tungstate, sodium hypophosphite, potassium iodate, thiourea, dodecyl Alkyl sodium sulfate, stir to dissolve and mix, the concentration of nickel sulfate is 26g / l, sodium citrate 60g / l, sodium gluconate 24g / l, ammonium sulfate 34g / l, sodium tetraborate 15g / l, sodium tungstate 38g / l, sodium hypophosphite 23g / l, potassium iodate 17mg / l, thiourea 0.8mg / l, sodium lauryl sulfate 7mg / l.

[0021] Adjust the pH value of the prepared plating solution to 8.5 with sodium hydroxide, and heat it to 80°C for use.

[0022] The plated piece is a Φ5mm×30mm brass piece. After pretreatment: degreasing-water washing-activation-water washing-nickel flash plating for 1 minute, put it into the plating solution for 50 minutes of immersion plating, and keep the temperature of the plating solution at 80°C during the immersion plating process , to obtain a thickness ...

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Abstract

The invention relates to a plating solution for chemical plating nickel-tungsten-phosphor alloy, comprising nickel vitriol of 24 to 28 g/l, sodium citrate of 40 to 70 g/l, gluconic acid sodium salt of 20 to 30 g/l, ammonium sulfate of 30 to 40 g/l, sodium pyroborate of 5 to 15 g/l, sodium tungstate of 30 to 50 g/l, sodium hypophosphite of 20 to 28 g/l, potash iodate of 10 to 20 mg/l, thiourea of 0.5 to 1.5 mg/l and sodium dodecyl sulfate of 5 to 15 mg/l. The plating solution is characterized in that: the chemical plating method using the plating solution comprises the following steps that: the pH value of the plating solution is adjusted to 8 to 9, and then the plating solution is heated to 80 to 90 degree centigrade, and then the processed plating articles are dipped into the plating solution; the time of dip plating is determined by the required plating layer thickness. The plating solution for chemical plating nickel-tungsten-phosphor alloy has the advantages of higher stability and higher plating speed.

Description

(1) Technical field [0001] The invention relates to an electroless nickel-tungsten-phosphorus alloy plating solution and a method for electroless nickel-tungsten-phosphorus plating. (2) Background technology [0002] Electroless nickel-tungsten-phosphorus alloy plating, compared with electroless nickel-phosphorus alloy plating, can further improve the wear resistance, corrosion resistance and thermal stability of the coating. However, the existing electroless nickel-tungsten-phosphorus plating technology has disadvantages such as slow plating speed, short service life of the plating solution, and unsatisfactory coating quality, which makes it difficult to meet the requirements of mass production. (3) Contents of the invention [0003] In order to overcome the above-mentioned shortcomings of the electroless nickel-tungsten-phosphorus alloy plating solution in the prior art, the invention provides a new electroless nickel-tungsten-phosphorus alloy plating solution with high ...

Claims

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Application Information

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IPC IPC(8): C23C18/36C23C18/18
Inventor 罗森鹤
Owner 罗森鹤
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