Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same

Abstract

The invention relates to a plating solution for chemical plating nickel-tungsten-phosphor alloy, comprising nickel vitriol of 24 to 28 g / l, sodium citrate of 40 to 70 g / l, gluconic acid sodium salt of 20 to 30 g / l, ammonium sulfate of 30 to 40 g / l, sodium pyroborate of 5 to 15 g / l, sodium tungstate of 30 to 50 g / l, sodium hypophosphite of 20 to 28 g / l, potash iodate of 10 to 20 mg / l, thiourea of 0.5 to 1.5 mg / l and sodium dodecyl sulfate of 5 to 15 mg / l. The plating solution is characterized in that: the chemical plating method using the plating solution comprises the following steps that: the pH value of the plating solution is adjusted to 8 to 9, and then the plating solution is heated to 80 to 90 degree centigrade, and then the processed plating articles are dipped into the plating solution; the time of dip plating is determined by the required plating layer thickness. The plating solution for chemical plating nickel-tungsten-phosphor alloy has the advantages of higher stability and higher plating speed.

Description

(1) Technical field

[0001] The invention relates to an electroless nickel-tungsten-phosphorus alloy plating solution and a method for electroless nickel-tungsten-phosphorus plating. (2) Background technology

[0002] Electroless nickel-tungsten-phosphorus alloy plating, compared with electroless nickel-phosphorus alloy plating, can further improve the wear resistance, corrosion resistance and thermal stability of the coating. However, the existing electroless nickel-tungsten-phosphorus plating technology has disadvantages such as slow plating speed, short service life of the plating solution, and unsatisfactory coating quality, which makes it difficult to meet the requirements of mass production. (3) Contents of the invention

[0003] In order to overcome the above-mentioned shortcomings of the electroless nickel-tungsten-phosphorus alloy plating solution in the prior art, the invention provides a new electroless nickel-tungsten-phosphorus alloy plating solution with high ...