Method for chemically plating copper on surface of expanded graphite

A technology of expanded graphite and surface chemistry, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve problems such as rising production costs, and achieve the effect of reducing usage and production costs

Active Publication Date: 2016-01-27
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to propose a method for electroless copper plating on the surface of expanded graphite when the surface of expanded graphite needs to be activated by using palladium chloride to activate the surface of expanded graphite and cause the production cost to rise.

Method used

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  • Method for chemically plating copper on surface of expanded graphite
  • Method for chemically plating copper on surface of expanded graphite
  • Method for chemically plating copper on surface of expanded graphite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Step 1: Preprocessing

[0031] 1.1 Surface degreasing: Weigh 3g of expanded graphite powder and place it in 100ml of NaOH alkaline solution with a mass fraction of 10%, stir magnetically at 70°C for 30min, wash it repeatedly with deionized water until neutral, and place it at 80°C Dry to constant weight before use.

[0032] 1.2 Coarsening treatment: Put the degreased expanded graphite powder in 200ml roughening solution, and stir it electromagnetically at 30°C for 30min. The composition of the coarsening solution is: 200g / L (NH 4 ) 2 S 2 o 8 (ammonium persulfate), 100ml / LH 2 SO 4 , H 2 SO 4 The density is 1.84g / cm 3 ; After coarsening, wash with deionized water to neutrality, dry to constant weight at 80°C before use;

[0033] Step 2: Electroless Nickel Plating

[0034] 2.1 Configure the electroless nickel plating solution: the electroless plating solution is composed of nickel sulfate hexahydrate, sodium citrate, ammonium chloride, sodium hypophosphite, ammo...

Embodiment 2

[0043] Step 1: Preprocessing

[0044] 1.1 Surface degreasing: Weigh 3g of expanded graphite powder and place it in 100ml of NaOH alkaline solution with a mass fraction of 10%, stir magnetically at 30°C for 50min, wash it repeatedly with deionized water until neutral, and place it at 90°C Dry to constant weight before use.

[0045] 1.2 Coarsening treatment: Put the degreased expanded graphite powder in 200ml of roughening solution, and stir it electromagnetically at 40°C for 15 minutes. The composition of the coarsening solution is: 150g / L (NH 4 ) 2 S 2 o 8 (ammonium persulfate), 100ml / LH 2 SO 4 , H 2 SO 4 The density is 1.84g / cm 3 ; After coarsening, wash with deionized water to neutrality, dry at 90°C to constant weight before use;

[0046] Step 2: Electroless Nickel Plating

[0047] 2.1 Configure the electroless nickel plating solution: the electroless plating solution is composed of nickel sulfate hexahydrate, sodium citrate, ammonium chloride, sodium hypophosphi...

Embodiment 3

[0056] Step 1: Preprocessing

[0057] 1.1 Surface degreasing: Weigh 2g of expanded graphite powder and place it in 100ml of NaOH alkaline solution with a mass fraction of 10%, stir it magnetically at 100°C for 20min, wash it repeatedly with deionized water until neutral, and place it at 100°C Dry to constant weight before use.

[0058] 1.2 Coarsening treatment: Put the degreased expanded graphite powder in 200ml of roughening solution, and stir it electromagnetically at 40°C for 5 minutes. The composition of the coarsening solution is: 175g / L (NH 4 ) 2 S 2 o 8 (ammonium persulfate), 75ml / LH 2 SO 4 , H 2 SO 4 The density is 1.84g / cm 3 ; After coarsening, wash with deionized water to neutrality, and dry to constant weight at 100°C before use;

[0059] Step 2: Electroless Nickel Plating

[0060] 2.1 Configure the electroless nickel plating solution: the electroless plating solution is composed of nickel sulfate hexahydrate, sodium citrate, ammonium chloride, sodium hyp...

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Abstract

The invention provides a method for chemically plating copper on the surface of expanded graphite. Firstly, the surface of the expanded graphite is chemically plated with nickel to form nickel activated points which are evenly scattered; in chemical nickel plating, an iron stirrer or a nickel stirrer is utilized for carry outing plating with the expanded graphite at the same time and stir mechanically; electrons can be released through oxidization corrosion of metallic iron or nickel in plating liquid; the electrons make contact with the expanded graphite to be conducted to the surface of the expanded graphite, the nickel deposition reaction can be generated on the surface of the expanded graphite, and the nickel activate points which are evenly scattered are formed on the surface of the expanded graphite. Then, the expanded graphite with the evenly-scattered nickel activated points on the surface is put into plating liquid of chemical copper plating to carry out the second step of chemical copper plating. The nickel activated points formed on the surface of the expanded graphite in the first step serve as the catalytic activity center of the chemical copper plating in the second step to catalyze the chemical copper plating reaction, and copper ions can deposit and form a copper plated layer on the surface of the expanded graphite with the nickel activate points as the center.

Description

technical field [0001] The invention relates to a method for electroless copper plating on the surface of expanded graphite. Background technique [0002] Expanded graphite powder is obtained by rapid expansion of expandable graphite at high temperature to obtain worm-like expanded graphite, which is further pulverized. Expanded graphite has high electrical conductivity and very large surface area, so that expanded graphite has many excellent properties. Copper-plated composite materials on the surface of expanded graphite are widely used in the national economy due to their good mechanical and electrical properties, as well as good thermal conductivity and lubricity. When using powder metallurgy to prepare graphite-copper matrix composites, due to the poor wettability of liquid copper and graphite and the low interface bonding strength, graphite reinforcements are often pulled out and peeled off. Therefore, firstly, electroless copper plating on the graphite surface , and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40C23C18/36C23C18/18
Inventor 孙万硕程军胜李兰凯王秋良戴银明
Owner INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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