The invention relates to the technical field of
alloy-plated
copper wire production, and provides a
tin-plated
copper wire and a preparation method thereof.The
tin-plated
copper wire comprises a copper core and a
tin alloy plating layer, and the tin
alloy plating layer comprises the following components: 0.02-0.05 wt% of La, 0.01-0.05 wt% of Cu, 0.01-0.05 wt% of Ti, 0.01- 0.01 wt% to 0.03 wt% of P; 0.10 to 0.30 wt% of Cu; and the balance of Sn. 0.01-0.03 wt% of P can achieve a very good deoxidation effect, so that the
oxygen content of the prepared tin
alloy coating is reduced,
oxide inclusion is reduced, 0.10-0.30 wt% of Cu and Sn form a
solid solution,
coating grains are refined together with 0.02-0.05 wt% of La, La can inhibit
diffusion of copper and tin atoms at high temperature, generation of brittle
intermetallic compounds such as Cu3Sn and Cu6Sn5 is reduced, a
copper matrix is purified, element enrichment and internal defects are reduced, and the service life of the
coating is prolonged. And the
interface bonding force between the plating layer and the copper core is enhanced, and the
cracking and falling probability of the plating layer is reduced. And La can optimize the
microstructure of the plating layer, reduce pores and defects, improve the compactness of the plating layer and further enhance the
corrosion resistance, so that the tinned
copper wire prepared from the tin alloy plating layer on the copper core can stably adapt to a high-temperature packaging scene of
electronic equipment.