401 results about "Copper matrix" patented technology

The invention belongs to the technical field of superconducting material processing, and discloses a preparation method of a copper-clad aluminum slot wire WIC superconducting wire, and the method comprises the steps: obtaining a to-be-processed workpiece which comprises a copper-clad aluminum rod and a copper matrix round wire; the copper-clad aluminum rod is sequentially subjected to drawing, annealing, rolling and forming, and the copper-clad aluminum groove wire is prepared; the copper-clad aluminum slot wire and the copper matrix round wire are respectively cleaned and coated with a soldering flux, and then are simultaneously immersed into a tin bath filled with tin liquor to be matched with an inlaying mold to carry out inlaying welding for at least 1000m, so that the copper-clad aluminum slot wire WIC wire is obtained; and surface layer and deep layer welding defect characterization is carried out on the obtained copper-clad aluminum slot wire WIC, and it is ensured that the number of the surface layer and the number of the deep layer welding defects of the copper-clad aluminum slot wire WIC are both zero. According to the method, inlay welding is carried out in the mode that copper-clad aluminum is matched with dip soldering, and the problems that in the traditional technology, the labor cost is high, the welding quality is not stable, and the productivity is insufficient can be solved at the same time.

The invention discloses a Cu-Cr-Zr-TiB2 copper-based composite material and a preparation method and application thereof. A blank containing TiB2 particles is subjected to rotary forging to obtain a rotary forging piece, the rotary forging piece is subjected to primary aging treatment and then subjected to electric pulse drawing to obtain a drawing piece, and then the drawing piece is subjected to secondary aging treatment to obtain the Cu-Cr-Zr-TiB2 copper-based composite material. According to the Cu-Cr-Zr-TiB2 copper-based composite material prepared through the preparation method, the copper matrix is of a gradient structure with the surface layer being a nanocrystalline layer of 50-200 nm and the core part being fine grains of 0.5-1 micron, TiB2 particle reinforced phases are distributed in the copper matrix in a fibrous mode in the axial direction, and Cr / Zr nano precipitated phases are distributed in gaps of the TiB2 particle reinforced phases and in crystals of the copper matrix in a dispersed mode; therefore, the high-hardness, high-strength, high-conductivity, high-softening-temperature, excellent high-temperature performance and excellent arc extinguishing performance are achieved.

The invention belongs to the technical field of metal matrix composite materials, and relates to a tungsten-copper three-dimensional orthogonal woven composite material and an intelligent design method thereof.The composite material comprises a space interwoven network structure formed by tungsten fiber skeletons arranged in the X orthogonal direction, the Y orthogonal direction and the Z orthogonal direction, and the tungsten fiber skeletons are wrapped by a copper matrix to form a three-dimensional heterogeneous composite system; the method comprises the following steps: generating a composite material structure based on parametric modeling, acquiring mechanical and electrical performance data by utilizing finite element and multi-physics field simulation, and constructing a structure-performance data set; performing performance prediction by adopting three types of machine learning models, namely ANN, SVR and LightGBM, and determining an optimal model in combination with Bayesian optimization; performing parameter reverse screening based on the optimal agent model, screening a structural combination meeting performance constraints, and constructing a closed-loop optimization process through simulation verification and model iteration; according to the method, efficient design and accurate performance prediction of the composite material structure can be realized, and the method is suitable for high-performance electromagnetic structural materials.

The invention discloses a free-cutting copper-nickel-tin-tellurium alloy and a preparation method thereof. The free-cutting copper-nickel-tin-tellurium alloy comprises the following components in percentage by weight: 5.5 to 15.5 percent of Ni, 4.5 to 8.5 percent of Sn, 0.1 to 0.6 percent of Te and the balance of Cu and inevitable impurities. According to the free-cutting copper-nickel-tin-tellurium alloy, Ni, Sn, Te and other elements are added into a copper matrix, precipitated phases containing a Cu2Te compound and the like are formed, the strength, hardness and abrasion resistance of the alloy are improved, meanwhile, the cutting performance of the alloy can be remarkably improved through addition of the Te element, the cutting performance of the alloy is remarkably improved, on the basis, the tensile strength of the alloy is 500 MPa or above, and the tensile strength of the alloy can be greatly improved. The hardness is 170 HV or more, and the cutting performance is 80% or more of that of C17300. The free-cutting copper-nickel-tin-tellurium alloy is free of beryllium and lead, excellent in performance, environmentally friendly and capable of meeting the application requirements of the test probe industry.

The invention discloses a regulation and control method and a preparation method of in-situ ceramic particles of a copper-based composite material. The method comprises the following steps: weighing according to a reaction equation and a reaction molar ratio; the molar ratio coefficient is changed, trace alloy is added, and the size and morphology of in-situ particles are regulated and controlled; the copper-based pre-dispersed in-situ ceramic intermediate alloy reinforcer is prepared through powder mixing, cold pressing and sintering; crushing the reinforcer, remelting, stirring and casting; and after the cast alloy is subjected to heat treatment, the high-performance in-situ particle reinforced copper-based composite material is prepared. According to the obtained in-situ ceramic intermediate alloy reinforcer, pre-dispersion of ceramic particles in a copper matrix can be achieved, and good combination of the particles and the matrix is achieved by adding the copper-based pre-dispersion in-situ ceramic intermediate alloy reinforcer into a molten matrix alloy; interface pores caused by sharp corners, surface pollution and the like of the heterogeneous particles in an external addition method are avoided, and the strengthening effect of the heterogeneous particles is weakened.

The invention discloses a high-entropy alloy particle reinforced copper-based contact material and a preparation method and application thereof, and belongs to the technical field of contact materials. The reinforced-phase high-entropy particles are added into the copper matrix to improve the ablation resistance of the contact material. Powder of five different elements is mixed, subjected to ball milling and annealed to obtain high-entropy alloy powder, then copper powder and the high-entropy powder are mixed and subjected to ball milling to obtain Cu-HEAs composite powder, and finally the high-entropy alloy reinforced copper-based contact material is obtained through the SPS hot pressing sintering technology. The Cu-HEAs contact material has excellent physical and mechanical properties, the arc erosion resistance of the copper-based contact material is enhanced, and the service life of a contact is prolonged.

An electrical connection for a vehicle and methods of forming an electrical connection for a vehicle. The electrical connection includes a first electrical component including a first joining area. The electrical connection also includes a conductor including a second joining area. The conductor is joined at the second joining area to the first joining area of the first electrical component. In addition, the electrical connection includes a fusion zone formed in the first electrical component in the first joining area. The conductor includes a copper-graphene multilayer composite formed on the surface of the conductor, the composite including at least one of the following composite structures: a) alternating layers of graphene and copper deposited on the substrate, b) graphene particles dispersed in a copper matrix, and c) alternating layers of graphene and copper deposited on a copper foil, wherein the copper foil is wrapped around the substrate.

The invention discloses a preparation method of a low-density high-thermal-conductivity copper-based graphite heat sink material, which comprises the following steps of: 1, selecting one or more than two copper alloy powder of CuZr powder, CuCr powder and CuCrZr powder as matrix powder, and mechanically ball-milling and mixing the matrix powder with graphite powder; 2, sintering the mixed powder to obtain a sintered body; and 3, carrying out aging heat treatment on the sintered body to obtain the low-density high-thermal-conductivity copper-based graphite heat sink material. The reinforced phase raw material graphite powder is added into the copper alloy powder to be mixed and sintered, so that a carbide ceramic phase is generated in situ, a ceramic phase transition layer is formed, the interface bonding capacity between a copper matrix and graphite is improved, the copper alloy powder with different components and sizes is used at the same time, a heterostructure matrix structure is formed, and the performance of the composite material is improved. The strength and plasticity of the copper-based graphite heat sink material are improved, so that the copper-based graphite heat sink material has excellent mechanical properties and thermal conductivity, and is simple in process, low in cost and suitable for the field of heat sink materials.

The invention discloses low-temperature curing silver-coated copper composite slurry and a preparation method thereof. The conductive adhesive comprises the following raw material components in percentage by weight: 60-80% of conductive phase, 2-2.8% of adhesive, 5-10% of resin and 3-8% of additive, and 20%-30% of a solvent. Wherein the conductive phase is formed by compounding spherical silver-coated copper powder and flaky silver powder, and the silver content is reduced and the sheet resistance of the silver-coated copper composite conductive paste is below 25m omega / square through a copper matrix surface silver plating process. A step-by-step mixing technology is adopted in the preparation process, resin and a solvent are dispersed at a high speed at 60 DEG C, then conductive powder is introduced to avoid agglomeration, and a uniform and compact conductive network is finally formed after grinding. After being cured at the low temperature of 130-180 DEG C, the paste has excellent adhesive force and durability, can be applied to the fields of heterojunction solar cells, flexible circuits and the like, and remarkably improves the photoelectric conversion efficiency and the processing adaptability.

The invention discloses a method for detecting trace chromium element in copper foil based on ICP-OES (Inductively Coupled Plasma-Optical Emission Spectrometer), which comprises the following steps: soaking a lithium battery copper foil in a mixed solution of concentrated nitric acid and hydrofluoric acid for high-temperature digestion, adding a scandium internal standard solution, and fixing the volume to obtain a solution to be detected; preparing a mixed standard solution of chromium element and scandium element with a plurality of concentration gradients, and establishing a standard curve through ICP-OES; and determining the content of the chromium element in the to-be-detected solution according to the standard curve. The lithium battery copper foil is digested through a mixed acid system, concentrated nitric acid provides an acid environment and an oxidation effect, hydrofluoric acid promotes dissolution, it is ensured that the copper foil is completely dissolved, and the digestion efficiency is improved; a scandium internal standard method is introduced, a dynamic background correction mode of ICP-OES is adopted, a scandium internal standard element can correct signal fluctuation in a sample introduction process, dual guarantee is formed by the scandium internal standard element and dynamic background correction, interference of a copper matrix on a Cr spectral line is specifically eliminated, and the trace chromium element detection precision is remarkably improved.

The invention relates to a method for constructing a composite super-hydrophobic coating through double bonding. The preparation method comprises the following steps: taking a clean copper sheet which is not pretreated as a substrate, dipping the copper sheet in a suspension consisting of nanoparticles and sulfydryl-containing siloxane ethanol, taking out, washing, drying, dipping in a perfluoromercaptan ethanol solution, taking out, washing, and drying to obtain the copper-based super-hydrophobic surface coating. The coating prepared by the method has excellent super-hydrophobicity, icing resistance and stability. Different from an existing conventional preparation method, the method has the advantages that pretreatment operation such as abrasive paper polishing, strong acid etching or anodic oxidation does not need to be carried out on a copper sheet, and micro-nano roughening and low-surface-energy self-assembly can be completed on the copper surface only through two-step normal-temperature dipping. The method is simple in preparation process, mild in condition, free of expensive equipment, thin in coating thickness and small in influence on electric conduction and heat conduction of the copper substrate, intrinsic performance of copper can be reserved, the electric conduction / heat conduction characteristic of the copper substrate is considered, and the method has wide application value and prospects.

The invention discloses a high-entropy alloy wear-resistant coating with a silicon-containing transition layer for improving the wettability of a copper surface and a laser cladding method, and relates to the technical field of alloy coatings. The method comprises the following steps: providing silicon-containing transition layer alloy powder and CoCrFeNiTi series high-entropy alloy powder; providing a copper base material, and cleaning the surface to be cladded of the copper base material; cladding silicon-containing transition layer alloy powder on the surface of the copper base material by adopting a laser cladding process under a protective atmosphere to form a silicon-containing transition layer; and under the protective atmosphere, CoCrFeNiTi series high-entropy alloy powder is cladded on the surface of the silicon-containing transition layer through a laser cladding process, and the high-entropy alloy wear-resistant coating is formed. According to the high-entropy alloy coating disclosed by the invention, the Si element in the transition layer can be subjected to interface reaction with a copper substrate to form a Cu-Si solid solution phase with low interface energy, so that the interface tension between copper and a subsequent cladding coating is remarkably reduced, and the wettability between the copper substrate and a coating material is fundamentally improved; the high-entropy alloy coating is successfully cladded on the copper surface with poor wettability.

The invention discloses a transition metal doped copper micron wire catalyst and a preparation method and biomass reduction application thereof. The preparation method comprises the following steps: preparing a copper matrix material, cleaning and drying for later use; immersing the pretreated copper matrix material into a mixed solution of ammonium persulfate and sodium hydroxide, and carrying out ion corrosion; taking out the material from the mixed solution, cleaning, and carrying out first annealing treatment to obtain a copper oxide microwire precursor; performing electrochemical reduction treatment on the copper oxide micron wire precursor to obtain a copper micron wire precursor; immersing the copper micron wire precursor into a transition metal solution, and carrying out transition metal doping; and taking out the material from the transition metal solution, carrying out secondary annealing treatment after cleaning, and cooling to room temperature to obtain the transition metal doped copper micron wire catalyst. The catalyst disclosed by the invention is used for preparing furanol by electrically reducing furan aldehyde biomass organic small molecules, and has good catalytic activity and stability.

The invention relates to the technical field of copper alloy materials, and discloses a preparation method of a high-strength copper-nickel-tin alloy material, which comprises the following steps: S1, raw material preparation, S2, smelting and casting, S3, homogenization treatment, S4, forging processing, S5, solid solution quenching, and S6, aging treatment. The invention further discloses the copper-nickel-tin alloy material prepared by the preparation method. According to the invention, by adding trace elements such as manganese and niobium into the copper-nickel-tin alloy, the internal structure of the crystal is changed, the structure grains are refined, the hardness and tensile strength of the copper-nickel-tin alloy are further improved, and continuous precipitation of discontinuous precipitates in the alloy structure grains is avoided; a forging process combining free forging and small-deformation forging is adopted, and meanwhile, a solution treatment process and an aging treatment process are adopted, so that the elements are fully dissolved in a copper matrix, internal stress generated in the forging process is greatly relieved, and the strength and hardness of the alloy material are further improved.

The invention discloses a low-temperature and low-pressure connection method for copper surface in-situ nanocrystallization, and relates to a copper connection method. The method aims at solving the technical problems that operation of current copper sintering connection is complex, an intermediate layer needs to be added for assistance, the connection strength is low, the interface welding rate is low, the connection temperature and pressure are too high, and the heat preservation time is long. The nanolayer is prepared on the surface of the copper substrate by adopting an in-situ nanocrystallization method, the nanostructure has relatively large surface energy, sintering connection can be realized at low temperature and low pressure, a high-strength joint is formed, and the method can be applied to the fields of copper connection, electronic packaging and the like. And under the condition of 125 DEG C / 10min / 5MPa, the shear strength of the obtained joint can reach 118.9 MPa without additionally adding a nano-particle sintering middle layer, and a connection structure with low connection temperature, short time, low required pressure and high mechanical stability is realized. The method is simple and effective to operate, can realize low-temperature connection of large-size samples, and has a wide application prospect.

The invention discloses an oxygen-free copper alloy rod and a preparation method thereof, the alloy rod comprises an oxygen-free copper matrix, an element Cr, an element Zr and an element Ag, the content of the element Cu in the oxygen-free copper matrix is greater than or equal to 99.95 wt.%, the oxygen content is less than or equal to 5 ppm, the content of the element Cr is 0.1-0.3 wt.%, the content of the element Zr is 0.05-0.15 wt.%, and the content of the element Ag is 0.01-0.1 wt.%. The preparation process comprises the steps of vacuum melting, stirring, continuous casting and continuous rolling integrated machining and gradient aging treatment. According to the invention, the performance is synergistically improved through component optimization and process innovation, and the preparation process has uniqueness and unexpected technical effects, so that the defect that the strength and the conductivity cannot be balanced in the prior art is overcome. And the tensile strength is greater than or equal to 450Mpa while the electric conductivity is greater than or equal to 95% IACS.

The invention discloses a preparation method and application of novel heat pipe sintered core powder, and belongs to the technical field of heat conduction materials. The preparation method comprises the steps of pioneer nucleation site construction and island-shaped structure construction. Through the gradient coupling process of replacement-reduction synergistic reaction, it is ensured that silver particles form a coating effect on copper matrix particles in an island form, so that the sintering temperature is effectively reduced, meanwhile, the capillary performance of sintered core powder is improved, the adsorption capacity of the sintered core powder and the bonding strength of the sintered core powder and a copper pipe are improved, and the service life of the sintered core powder is prolonged. Therefore, the sintered core powder has more excellent adaptability in the process of sintering and manufacturing the heat pipe, further the processing performance of the sintered heat pipe is improved, and a good foundation is laid for the subsequent flattening and other thinning procedures of the heat pipe.

The invention relates to the technical field of cuprous oxide particle testing, and discloses a method for characterizing cuprous oxide particles in a fine copper wire, which comprises the following steps: S1, fixing the fine copper wire on a copper sheet by using conductive silver paste, putting the copper sheet into a silica gel square mold, filling a metallographic phase cold inlay, and standing for 30 minutes to obtain a cured sample; s2, putting the cured sample obtained in the step S1 into a cross section cutting sample table of a three-ion-beam cutting instrument, selecting a cross section mode, setting ion gun voltage and ion beam cutting time, and starting a cutting program; and S3, transferring the sample obtained in the step S2 into a scanning electron microscope, selecting an electron channel contrast imaging mode, and setting acceleration voltage, current, working distance and magnification times to obtain a high-resolution scanning electron microscope image of the cross section of the fine copper wire. And key information such as the size, the morphology and the distribution condition of cuprous oxide particles and the interface bonding condition of the cuprous oxide particles and a copper matrix is obtained from the cuprous oxide particles. Therefore, a basis is provided for formulating a reasonable fine copper wire drawing process and a bus continuous casting and rolling process.

The invention belongs to the field of high-thermal-conductivity composite materials, and particularly relates to a 3D printing copper-diamond composite high-thermal-conductivity material and a preparation method thereof.The 3D printing copper-diamond composite high-thermal-conductivity material comprises a copper matrix and diamond particles dispersed in the copper matrix, and the surfaces of the diamond particles are provided with metal coatings; the copper matrix is formed by copper powder with the particle size of 10-100 microns, and the volume fraction of the diamond particles in the composite material is 40%-50%; according to the method, the titanium plating layer is prepared on the surface of the diamond, the stable titanium carbide transition layer is formed through the reaction of titanium and carbon, the interface thermal resistance between the diamond and copper is remarkably reduced, the interface bonding strength is improved, and heat conduction is facilitated. The selected area green laser 3D printing technology is adopted, a green laser device shows remarkable advantages in the field of 3D printing of copper alloy, and the heat conductivity of the prepared composite material can reach and is remarkably higher than that of pure copper by optimizing the diamond volume fraction and 3D printing process parameters.

The invention discloses a method for measuring trace gold, palladium and platinum in carbonylation copper-nickel alloy leachate, which comprises the following steps of: enriching trace precious metal elements in the carbonylation alloy leachate by utilizing the principle that gold, palladium and platinum and tellurium form coprecipitation, leaving a large amount of matrixes such as nickel, copper and the like in the solution, filtering and washing the precipitate so as to separate the precipitate from a large amount of copper-nickel matrixes, and measuring the content of gold, palladium and platinum in the carbonylation copper-nickel alloy leachate. According to the method, the influence of a matrix effect generated by a high-copper-nickel matrix on an analysis result is solved, trace precious metal elements can be enriched from the nickel-copper matrix which is more than about 200g / L, the detection conditions of ICP-AES (Inductively Coupled Plasma-Atomic Emission Spectrometry) are met, the accurate analysis of Au, Pd and Pt in the carbonylation alloy leachate is realized, the requirements of production on the accuracy and stability of the analysis result are met, and the method is suitable for industrial production. Therefore, operation parameters can be adjusted in time, and loss of precious metal elements is avoided.

The invention discloses composite powder with carbon nanotubes adsorbed on the surface of silicon dioxide, a preparation method of the composite powder and a silicon dioxide reinforced copper-based composite material, and belongs to the technical field of copper-based composite materials. The preparation method comprises the following steps: (1) functionalizing silicon dioxide, and grafting amino on the surface of the silicon dioxide; (2) acidizing and etching the carbon nano tube to graft carboxyl on the surface of the carbon nano tube; (3) activating the etched carbon nanotubes, adding functionalized silicon dioxide, and performing dehydration combination to obtain composite powder; and (4) uniformly mixing the composite powder with copper powder, and carrying out cold press molding and sintering to obtain the silicon dioxide-carbon nanotube co-reinforced copper-based composite material. According to the invention, a layer of reticular carbon nanotubes is adsorbed on the surface of silicon dioxide, so that the interface relationship between silicon dioxide and a copper matrix is changed, the binding force between the copper matrix and silicon dioxide is effectively improved, and the reduction of mechanical properties such as tensile strength and the like is reduced while the hardness and friction resistance of the copper-based composite material are enhanced by silicon dioxide.

The invention belongs to the technical field of additive manufacturing, and particularly relates to a diamond / copper radiator manufacturing method based on 3D printing, and the diamond / copper radiator manufacturing method comprises the steps that diamond / copper composite powder is prepared, and the composite powder comprises diamond particles with nano alloying elements attached to the surfaces and spherical copper powder; and under shielding gas, green laser with the wavelength of 532 nm is adopted for conducting selective laser melting scanning on the composite powder, meanwhile, high-frequency ultrasonic vibration is applied to a molten pool in a laser acting area, and a diamond / copper composite material radiator green body is formed through layer-by-layer powder laying, scanning melting, ultrasonic assistance and layer-by-layer accumulation. Copper matrix crystal grains are refined through ultrasonic energy, residual stress in the printing process is reduced, generation of microcracks is effectively restrained, the mechanical property and reliability of a workpiece are improved, the high absorptivity of green laser to copper and the technical advantages of 3D printing are combined, and high-quality 3D printing is achieved. And the radiator with fine structures such as complex three-dimensional micro-channels and ultrathin fins can be integrally manufactured.

The invention discloses a preparation method of an MXene reinforced Cu-based composite material with strong interface bonding, and belongs to the technical field of composite material preparation. According to the method, an MAX phase material is adopted, few layers of MXene are mixed with copper salt, and MXene with Cu or Cu2O single or mixed nano-particles uniformly deposited is formed; then mixing with copper powder or copper ions to obtain MXene / Cu composite powder; and finally, the MXene / Cu composite material with strong interface bonding is obtained through sintering. According to the preparation method, the spontaneous reduction deposition reaction of MXene with high reaction activity and Cu ions is utilized, and the structure and distribution of deposited nano-particles are subjected to interface regulation and control, so that tight interface combination between a copper matrix of the composite material and MXene is realized, inelastic scattering of carriers at an interface is reduced, the interface load transmission capacity is enhanced, and the mechanical property of the composite material is improved. Therefore, the strengthening efficiency of the MXene on the copper matrix is obviously improved; the prepared copper-based composite material has excellent mechanical and electrical properties, the yield strength of the copper-based composite material ranges from 295 MPa to 564 MPa, and the electric conductivity of the copper-based composite material is kept at 84.5%-94.5% IACS (International Annealed Copper Standard). The composite material is simple in preparation process and low in cost, and has the potential of large-scale industrialization.

The invention discloses a three-dimensional graphene copper composite material based on in-situ interface chemical bonding and a preparation method and application of the three-dimensional graphene copper composite material, relates to the technical field of metal-based composite materials, and solves the problems of graphene dispersion and interface bonding. The preparation method of the three-dimensional graphene copper composite material comprises the following steps: dissolving soluble copper salt and an organic ligand in water to form a complex solution, adding copper powder into the complex solution, uniformly mixing, and drying to obtain precursor coated copper powder; and carrying out spark plasma sintering or vacuum hot pressed sintering on the precursor coated copper powder to obtain the copper powder. A three-dimensional interpenetrating continuous network formed by graphene is arranged in the prepared three-dimensional graphene copper composite material, the interface of the graphene and a copper matrix is a chemical bonding interface, the comprehensive performance is excellent, and the composite material has high conductivity (gt; 103% IACS) and a high strength (gt; the comprehensive performance of the composite material is far better than that of a composite material prepared by a traditional method, and the composite material is suitable for high-end electric conduction, heat conduction and structural function integrated components.

The invention discloses a copper / graphene composite wire with high thermal conductivity and low temperature rise as well as a preparation method and application of the copper / graphene composite wire, the copper / graphene composite wire comprises the following components in percentage by mass: 99.50-99.98% of Cu and 0.02-0.5% of graphene; copper matrix crystal grains of the copper / graphene composite wire are isometric crystals, the size of the crystal grains is 5-30 microns, and graphene is distributed at a crystal boundary. The copper / graphene composite wire has high heat-conducting property and low temperature rise.

The invention relates to a preparation method of a graphene / copper-based composite material. Through a plasma-assisted ball milling method, nano graphite powder is stripped into graphene in situ and compounded with copper powder; and the ball milling parameters are adjusted, the content of introduced oxygen-containing groups is regulated and controlled, the structural integrity and intrinsic performance of the graphene in the compounding process are effectively controlled, and uniform dispersion of the graphene in a copper matrix and improvement of the bonding strength of a composite interface are achieved. Compared with traditional high-energy ball milling, graphene dispersion is more uniform, the interface bonding strength is higher, and the prepared material is more excellent in performance; the process is simple, the preparation cost of the graphene is greatly reduced, the problems of uniform dispersion of the graphene and interface bonding with the copper matrix are effectively solved, and the method is suitable for macro-scale preparation of the high-performance graphene / copper-based composite material.

The invention discloses a wear-resistant hybrid core-shell electric contact material and a preparation method, and relates to the technical field of electric contact materials, the electric contact material is prepared by taking copper as a matrix, adding SiC (at) Cu composite powder, CNT (at) Cu composite powder, Ti3SiC2 powder and a rare earth oxide dopant, and preparing the composite powder, mixing the powder, forming, sintering and the like. The composite powder with the core-shell structure is prepared through chemical plating, magnetron sputtering, chemical vapor deposition and other technologies, the interface wettability of a reinforcing phase and a copper matrix is effectively improved, through the multi-element hybrid reinforcing design, the hardness, abrasion resistance and heat conduction performance of the material are synergistically improved, the thermal expansion coefficient and the friction factor are reduced, and the service life of the material is prolonged. The prepared electric contact material has excellent comprehensive performance, can be widely applied to the fields of electric locomotive pantograph slide plates, electronic packaging and the like, and is stable and controllable in preparation process and suitable for industrial production.

The invention discloses a non-precious metal hydrogen evolution electrode and a preparation method thereof, which comprises the following steps: S1, preparing a nickel electroplating solution, placing a copper substrate in the electroplating solution, and forming a nickel plating layer on the surface of the copper substrate by a direct current power supply electrodeposition method; S2, after the nickel plating is completed, washing and drying, and then placing in an activation solution for activation to obtain a non-precious metal hydrogen evolution electrode. The non-precious metal hydrogen evolution electrode can generate a nickel micro / nano composite structure on the surface of the copper substrate material to improve the hydrogen evolution catalytic performance.

The invention discloses a porous copper-graphene composite current collector for a lithium battery, and also discloses a preparation method of the composite current collector, and the preparation method comprises the following steps: preparing an electroplating copper electrolyte, adding graphene into the electroplating copper electrolyte, and uniformly dispersing the graphene to obtain an electroplating copper-graphene electrolyte; placing a copper foil in the electrocoppering-graphene electrolyte for electroplating treatment to obtain a Cu-Gr foil of which the surface is uniformly coated with a copper-graphene composite layer; the Cu-Gr foil is placed in an electrogalvanizing electrolyte for electrogalvanizing treatment, on the basis of the copper-graphene composite layer, a zinc layer is coated, and the Cu-Gr / Zn foil of a double-layer structure is obtained; carrying out solution treatment on the Cu-Gr / Zn foil to obtain a porous copper precursor; and carrying out dealloying treatment on the porous copper precursor, and dissolving zinc in the porous copper precursor to obtain the porous copper-graphene composite current collector. The composite current collector has a cross-scale synergistic distribution pore structure, and the binding force between the graphene and the copper substrate is strong.

The invention relates to the technical field of photovoltaic, and discloses a preparation method of a photovoltaic module and the photovoltaic module. The photovoltaic module preparation method comprises the steps that a plurality of battery pieces and a low-temperature welding strip are provided, the low-temperature welding strip comprises a copper substrate and welding flux wrapping the copper substrate, and the welding flux comprises metallic tin; the battery pieces and the low-temperature welding strips are pre-fixed, so that the multiple battery pieces are connected through the low-temperature welding strips to form a battery string; packaging materials are arranged on the two sides of the cell string to form a to-be-laminated piece, and the to-be-laminated piece is laminated and solidified at a preset heating rate, so that the welding flux is melted to form an interconnection alloy layer between the copper substrate and the grid line electrode of the cell piece; wherein the preset heating rate is greater than 5 DEG C / min. According to the preparation method of the photovoltaic module and the photovoltaic module provided by the invention, the connection effect between the welding strip and the battery piece can be ensured, so that the use performance of the photovoltaic module is prevented from being influenced.