44 results about "Copper matrix" patented technology

This invention provides a battery. The battery includes a negative electrode sheet, which includes a negative electrode current collector and a negative electrode active material layer disposed on at least one surface of the negative electrode current collector. The negative electrode active material layer includes a first negative electrode active material layer and a second negative electrode active material layer, with the first negative electrode active material layer located between the negative electrode current collector and the second negative electrode active material layer. The first negative electrode active material layer includes a carbon-based active material, and the second negative electrode active material layer includes a silicon-based active material. The particle size Dv90 of the silicon-based active material is smaller than the thickness Bμm of the first negative electrode active material layer. The negative electrode current collector includes a copper substrate and a protective layer disposed on at least one surface of the copper substrate. The thickness Anm of the protective layer satisfies: 20≤A≤100. The negative electrode sheet satisfies: 0.5≤A / B≤6. The battery provided by this invention has a low interface resistance of the negative electrode sheet, a low degree of copper deposition, good structural stability of the negative electrode current collector, and high cycle performance.

The application discloses an oriented structure graphene / copper composite filler metal, graphene is coated on the surface of flaky copper powder, and then is compacted, so that the graphene and copper are closely arranged in layers and intervals. The application further discloses a preparation method of the oriented structure graphene / copper composite filler metal, comprising the following steps: taking the flaky copper powder coated with graphene to perform hot-pressing sintering or discharge plasma sintering, so as to obtain the oriented structure graphene / copper composite filler metal. The application further discloses a sandwich composite brazing structure. The application further discloses application of the oriented structure graphene / copper composite filler metal and the sandwich composite brazing structure in ceramic and metal welding. The application further discloses a welding method. In the oriented structure graphene / copper composite filler metal, the graphene and copper are closely arranged in layers and intervals, and the arrangement orientation of the graphene is kept consistent; when brazing, the graphene can effectively hinder active elements such as Ti from corroding the copper matrix, reduce the residual stress of the welded joint, and improve the welding strength.

This invention provides a collector for recovering platinum group metals (PGMs) from spent catalysts, its preparation method, and its application, belonging to the technical field of precious metal recovery. The collector comprises a copper matrix, a flux, a framework support, and a lattice activator: the copper matrix, flux, and lattice activator are loaded on the surface of the framework support; the copper matrix is ​​elemental copper or a copper-based compound; the flux is boric acid or a borate; the framework support is a porous inorganic material; and the lattice activator is tin, a tin alloy, or a metal sulfide. The collector serves as a collector for the pyrometallurgical recovery of PGMs from spent catalysts. This invention constructs a multi-component synergistic collector composed of a copper matrix, flux, framework support, and lattice activator, which significantly improves the recovery rate of PGMs, especially rhodium, from spent automotive exhaust purification catalysts in pyrometallurgical treatment, and reduces the smelting temperature required for pyrometallurgical treatment, thus significantly reducing energy consumption.

The application discloses a preparation method of a copper-graphene composite conductor, and comprises the following steps: S1, a graphene layer is formed on the surface of a copper strip by adopting a chemical vapor deposition method to obtain a graphene / copper composite strip; S2, a plurality of graphene / copper composite strips are stacked in a consistent direction of the graphene layer, and a copper strip without the graphene layer is placed on the outermost layer to form a laminated blank; S3, the laminated blank is subjected to multi-pass deformation treatment, the materials in each layer are metallurgically combined through cumulative deformation, and the laminated blank is formed into a rod-shaped blank through multi-directional forging of the laminated blank; S4, the rod-shaped blank is subjected to multi-stage reducing processing to gradually reduce the cross-sectional area, and a composite single wire with a relatively small diameter is obtained; and S5, a plurality of the composite single wires are twisted to obtain the copper-graphene composite conductor. Through the above scheme, the graphene is mechanically engaged with the copper matrix and is combined with the interface, the interface combined strength is strengthened through forging and extrusion, and the problem that the graphene is easy to fall off in the single vapor deposition method is solved.

This invention relates to the field of copper alloy materials technology, specifically to a high-performance copper alloy wire and its preparation process. A high-performance copper alloy wire includes a base copper alloy wire and a corrosion-resistant protective layer. The base copper alloy wire, by mass percentage, comprises: 0.4-0.6% Cr, 0.05-0.2% Zr, 0.05-0.06% Hf, 0.01-0.03% Ce, 0.4-0.5% rare earth modified carbon nanotubes, with the balance being Cu. This invention improves the dispersibility of carbon nanotubes by first activating them with carboxylation and then modifying them with rare earth citric acid coupling agents. The uniformly dispersed carbon nanotubes can form a continuous conductive network in the copper matrix. At the same time, the lanthanum and cerium introduced during modification can purify the grain boundaries and reduce electron scattering at the grain boundaries, thereby effectively improving the conductivity of the copper alloy wire. In addition, the uniformly dispersed rare earth modified carbon nanotubes can effectively hinder dislocation movement and refine the matrix grains, thereby effectively improving the tensile strength of the copper alloy wire.

The application discloses a copper / graphene composite conductor regulated by a metal transition layer and a preparation method thereof. The composite conductor comprises a copper base and a graphene layer arranged on the surface of the copper base, and a metal transition layer is formed between the copper base and the graphene layer. The metal transition layer is in a discontinuous distribution structure and is distributed in the copper / graphene interface in the form of atomic-level clusters or nanoparticles. Chemical bonds are formed between metal atoms and carbon atoms in the graphene, and metallurgical bonding is formed between the copper base and the metal transition layer. The preparation method comprises the following steps: loading a metal precursor on the surface of the graphene, generating a metal modifier in situ through heat treatment in a reducing atmosphere, preparing a plating solution to coat the surface of the copper base, and performing annealing treatment to construct the metal transition layer. The application introduces the metal transition layer in a discontinuous distribution structure, thereby enhancing the interface bonding strength, avoiding the introduction of additional interface resistance, significantly improving the conductive performance of the composite conductor, and having simple process, strong controllability and good engineering application prospect.

This invention discloses a phytic acid rust removal-film forming integrated agent, its preparation method, and its application. The raw material components and their respective mass percentages are as follows: phytic acid 2-3%, tartaric acid 0.5-0.7%, sulfamic acid 0.05-0.5%, surfactant 0.1-1.5%, corrosion inhibitor 0-0.5 wt%, and the balance being deionized water. Compared with traditional metal rust removers, this phytic acid rust removal-film forming integrated agent has advantages such as safe operation and convenient use. Its reaction is relatively mild, causing minimal damage to the copper substrate after removing corrosion products from the copper surface. Furthermore, after rust removal, the residual phytic acid can complex with the copper, forming a dense phytic acid passivation film on the substrate surface for subsequent protection, thereby effectively extending the service life of copper alloys and protecting the diversity of copper artifacts.

The application relates to the field of metal matrix composites and wire and cable manufacturing, in particular to a high-strength and high-conductivity copper alloy energy storage cable and a preparation method; the cable comprises, from inside to outside, a conductor core, an insulation layer, a flame-retardant armored layer and a weather-resistant sheath layer; the conductor core is uniformly dispersed with a multifunctional composite modifier in a copper matrix, the modifier has a core-shell structure and is composed of a multi-walled carbon nanotube center core, a 5-15nm silver conductive transition shell layer and a rare earth anchoring phase; the core is to construct a high-strength skeleton by using the carbon nanotube to provide physical strengthening support, and the silver transition shell layer is used to tightly fuse with the copper matrix in a microstate, so that micro-pores are eliminated to realize dense metallurgical coherent bonding; the alloy single wire is prepared by feeding the intermediate into the copper melt and assisting with ladder aging treatment, the electronic transmission channel is effectively bridged, the interface electron scattering is greatly reduced, and the technical bottleneck of the traditional metal material strong-conductivity mutual repulsion is successfully broken.

The present application belongs to the field of electrical materials and powder metallurgy, and particularly relates to a preparation method of a high-voltage electric contact with gradient tungsten-copper alloy and dispersion-strengthened copper composite. The W90Cu / W70Cu / W50Cu gradient layer is prepared by adopting gradient porosity pre-preparation and integrated pressing infiltration technology; the ODS-Cu matrix is prepared by adopting accurate internal oxidation-reduction technology; the vacuum hot pressing-brazing composite connection technology is adopted, combined with pressure keeping in the cooling stage, and the high-temperature plastic rheology of the copper matrix is used to actively inhibit the residual thermal stress, so that the W-Cu / ODS-Cu interface shear strength is greater than or equal to 300 MPa. The contradiction between the ablation resistance, electrical conductivity, thermal stability and interface reliability of the contact material is solved, and the service performance and structural reliability of the high-voltage electric appliance are significantly improved.

The application discloses a high-density diamond-copper composite heat dissipation material and a vacuum infiltration preparation method thereof, and relates to the technical field of metal-based composite heat dissipation materials. The material comprises a diamond reinforcing phase and a copper matrix. Diamond particles are classified according to particle size, and a Ti-Cu alloy coating is coated on the surface of the diamond particles. During preparation, the high-density composite heat dissipation material is obtained through cleaning and drying, coating deposition, cold isostatic pressing, vacuum infiltration, gradient cooling and grinding and polishing. The application can improve the interface bonding strength and the material density, reduce the interface thermal resistance, and improve the heat conduction performance and the thermal cycle stability.

This invention belongs to the field of copper-based composite material technology, and discloses a lignin-reinforced copper-based composite material, its preparation method, and its application. The method includes the following steps: mixing lignin powder and copper powder uniformly; the amount of lignin powder added is 0.5 wt.%, and the amount of copper powder added is 99.5 wt.% by mass percentage; the uniformly mixed powder is placed in a vacuum drying oven for drying and sieving to obtain composite powder; the composite powder is sintered in a vacuum hot-pressing sintering furnace to obtain a blocky copper-based composite material. This invention, by adding lignin as a precursor to the copper matrix, can fill the voids between the copper matrix particles. Furthermore, during the hot-pressing sintering process, lignin can be transformed into amorphous carbon or graphitized carbon phase, which has a better interfacial bond with the copper matrix, thus serving as a reinforcing phase to improve the overall performance of the composite material.

The utility model discloses a kind of prevent the shared tool of welding, it is related to wave-soldering jig technical field, including drag tin sheet, the drag tin sheet is double-layer structure, the drag tin sheet includes copper base and composite layer, the copper base is located in the lower layer of drag tin sheet, and the upper surface of copper base is plated with composite layer, the composite layer includes nickel layer, silver layer and Teflon layer in turn, the nickel layer is located in the upper layer of copper base close to composite layer below, and silver layer is located in the middle of composite layer, and Teflon layer is located in the upper of composite layer. The utility model in use, by making drag tin sheet setting in element pin relative to the rear of furnace direction, and half-enclosing in element pin side end by drag tin sheet edge notch, by the three depth gradient setting on notch, can layer guide solder flow, drag tin when PCB board tin, avoid the bridging of element pin, increase the straight-through rate of product, greatly reduce artificial cost.

The application discloses a high-entropy alloy particle reinforced copper-based contact material and a preparation method and application thereof, and belongs to the technical field of contact materials. The application adds a reinforcing phase high-entropy particle into a copper base to improve the anti-ablation performance of the contact material. The application mixes powders of five different elements, ball-mills, anneals, and obtains high-entropy alloy powder, then mixes copper powder and the high-entropy alloy powder, ball-mills, and obtains Cu-HEAs composite powder, and finally adopts SPS hot-pressing sintering technology to obtain the high-entropy alloy reinforced copper-based contact material. The Cu-HEAs contact material has excellent physical and mechanical properties, enhances the anti-arc erosion performance of the copper-based contact material, and prolongs the service life of the contact.

A novel method for manufacturing a high-wear-resistant and high-thermal-conductivity vent sleeve includes the following steps: (1) machining a groove on the surface of the copper substrate at the front end of the vent sleeve; (2) preheating the front end of the vent sleeve; (3) brushing or sprinkling flux on the inner wall of the groove, and then filling the groove with flux-cored solder; the flux-cored solder includes an outer skin and a core material, the outer skin being made of pure copper; the core material contains hard material powder, copper-phosphorus solder powder, activator, and adhesive material; (4) while the vent sleeve rotates around its axis, locally heating the part of the vent sleeve with the groove at the front end, so that the flux-cored solder in the groove gradually melts and forms a metallurgical bond with the copper substrate at the front end of the vent sleeve; (5) cooling to solidify the material in the groove. This invention can form a wear-resistant structure on the surface of the front end of the vent sleeve, improve the wear resistance of the front end of the vent sleeve, improve the thermal conductivity between the wear-resistant structure and the copper substrate, and make the wear-resistant structure less prone to falling off.

The application discloses a kind of for the electrocatalytic reduction CO2 produce multi-carbon product double-atom doped copper-based rare alloy catalyst and preparation method thereof.The catalyst is prepared by selective electrochemical dealloying and metal dissolution-redeposition reconstruction strategy, realizes the construction of multiple active sites of atomic dispersion;The catalyst has three-dimensional continuous nanoporous structure, which is composed of copper matrix and uniformly doped zinc and aluminum double atoms, and shows great potential in the field of energy and environment such as electrocatalytic reduction CO2 to produce multi-carbon product and energy storage.The catalyst with multiple active sites synergistic strategy prepared by the application shows excellent performance, and provides an effective way to improve the performance of CO2 reduction reaction by balancing the kinetics between CO2 activation and H2O dissociation, which has important significance for promoting the utilization of CO2 resources and the development of clean energy technology under the goal of carbon neutralization.

This invention relates to the field of wire and cable technology and discloses a method for preparing electroplated graphene copper conductors, comprising the following steps: copper substrate pretreatment, electroplating solution preparation, electroplating process, and post-treatment. This invention forms a composite structure of graphene and copper by electroplating graphene on the surface of a copper substrate. Graphene itself has excellent conductivity, and its unique two-dimensional structure can provide a good channel for electron transport, thereby effectively improving the conductivity of the copper conductor by 3%-5%.

The application provides a method for preventing corrosion of metal copper and a metal copper corrosion prevention structure, and belongs to the technical field of metal corrosion prevention. The method for preventing corrosion of metal copper comprises forming a graphene layer with a thickness of at least 2 atomic layers on the surface of a copper base. The method for preventing corrosion of metal copper can weaken the charge transfer between corrosive substances and the copper base by forming a graphene layer with a thickness of at least 2 atomic layers on the surface of the copper base, so that the copper base is not easy to undergo an electrochemical reaction through the graphene layer on the surface, and the corrosion resistance of the copper base is improved.

The application discloses a kind of gas atomization CoCrFeNiMo high-entropy alloy particle reinforced copper matrix composite material and its preparation method and application, belong to metal matrix composite material preparation technical field.The composite material includes copper matrix and the gas atomization CoCrFeNiMo high-entropy alloy particle dispersedly distributed in copper matrix, and the diffusion interface layer between the high-entropy alloy particle and copper matrix.The composite material is prepared by ball milling, cold pressing and rapid hot-pressing sintering of gas atomization CoCrFeNiMo high-entropy alloy powder and copper powder.By controlling the content of high-entropy alloy particles and SPS sintering conditions, a continuous diffusion interface layer can be formed between the high-entropy alloy particles and the copper matrix, allowing the reinforcing phase and the copper matrix to achieve good metallurgical bonding, while maintaining high density, significantly improving the tensile strength, hardness and wear resistance of the composite material.

This invention discloses an intelligent robot laser polishing system based on vision monitoring, belonging to the field of laser processing technology. The system includes an industrial robot unit, an integrated laser processing head, a central control unit, and a 3D vision positioning unit. The integrated laser processing head coaxially integrates a processing laser emission module, a LIBS spectral monitoring module, and a vision observation module. This invention uses the LIBS spectral monitoring module to collect plasma spectral signals from the processing area in real time. The central control unit analyzes the spectrum and distinguishes between the oxide layer and the substrate material on the workpiece surface in real time, thereby adaptively adjusting the laser process parameters and the robot's motion state. This method can accurately remove the oxide layer while absolutely avoiding thermal damage to the copper substrate, effectively solving the problems of low efficiency, poor consistency, and easy damage to the substrate in traditional polishing methods, achieving high-quality, high-efficiency, and intelligent surface treatment of high-current copper parts.

The application discloses a preparation method of an enhanced copper-carbon composite material, and relates to the technical field of composite materials, which comprises a copper matrix, carbon nanoparticles subjected to surface modification and nanoscale metal alloy particles; the carbon nanoparticles are prepared by a chemical vapor deposition method and are uniformly dispersed in the copper matrix after being subjected to surface modification; the metal alloy particles comprise lanthanide rare earth elements and are used for enhancing the mechanical properties and thermal stability of the composite material, so that the overall performance of the composite material is remarkably improved; in the technical scheme, the mechanical properties of the composite material are remarkably enhanced, the carbon nanoparticles with the metal oxide coating on the surface can effectively improve the interface bonding force between the copper matrix and the carbon nanoparticles, so that the tensile strength of the composite material is further improved, and by accurately controlling the volume fraction of the carbon nanoparticles and the nanoscale metal alloy particles, the best balance between the electrical conductivity and the mechanical properties of the composite material is achieved.

The application discloses a low-temperature curing type micron-level spherical silver-coated copper powder and a preparation method thereof, and comprises the following steps: (1) preparation of a modified bonding layer: micron-level spherical copper powder is dispersed in a modified solution composed of a high polymer modifier and a coordination type pre-reducing agent to react, and then the copper powder filter cake with a uniform composite bonding layer on the surface is obtained by filtration; (2) silver plating reaction: after the copper powder filter cake is pre-dispersed and swelled in a solvent, a reducing agent and a silver source solution are added to perform chemical silver plating, so that a silver-coated copper powder crude product is obtained; (3) post-treatment: the crude product is subjected to hydrothermal densification treatment, and the target product is obtained. Through the construction of an active interface of "pre-reduction-coordination anchoring", the application solves the problem of weak bonding force between the silver layer and the copper matrix; the hydrothermal densification process is used to repair the coating defects, and the density and oxidation resistance of the material are significantly improved. The method is controllable, the prepared silver-coated copper powder is low in resistance and complete in coating, and is suitable for the production of high-performance electronic conductive paste and photovoltaic paste.

The application provides a copper-diamond porous liquid cooling channel optimization method and system, the method comprises the following steps: constructing a three-dimensional parameterized model of a copper matrix, a diamond phase and a liquid cooling channel; taking porosity, pore size gradient, rib thickness and branch angle as design variables; establishing a feasible region evaluation model with the highest temperature of the radiator and the minimum fluid pressure drop as the target and geometric and physical constraints as the boundary; dividing the initial optimization individuals into out-of-bound, boundary and internal individuals; calculating the distance mapping coefficient of the out-of-bound individuals and adjusting the variables; determining the replacement position according to the constraint normal vector in the multi-constraint intersection area; after numerical solution of the flow field and the temperature field, screening the candidate set through non-dominated sorting and crowded distance; generating memory weight by combining the boundary residence times of the individuals; adjusting the parameter iteration optimization of the search step; and outputting the optimal structure parameters of the porous liquid cooling channel until the termination condition is met.

The application belongs to the technical field of copper alloy, and particularly relates to a copper alloy with TiC and TiB2 hybrid reinforcing phase, a preparation method and application. The preparation method of the copper alloy with TiC and TiB2 hybrid reinforcing phase provided in the application is to mix Ti, SiC and CuB and then sinter into a hybrid reinforcing phase body, so as to introduce the reinforcing phase such as TiC and TiB2 into the copper alloy by means of the reaction wetting method, avoid the defects such as poor wettability, weak interface bonding and uneven dispersion between the added reinforcing phase and the copper matrix, reduce the reaction between the Ti powder and the Si powder in the copper alloy raw material, increase the generation amount of the hybrid reinforcing phase such as TiC and TiB2, and improve the copper alloy. By using the spark plasma sintering and controlling the amount of Ti, SiC and CuB in the copper alloy raw material, the performance of the copper alloy is further improved, so as to solve the technical problem of low performance of the copper alloy prepared in the prior art.

This invention provides a copper-nickel-chromium heat sink, its chemical electroplating preparation method, and its application, relating to the field of heat sink technology. The preparation method includes: degreasing, removing impurities, and drying copper foil to obtain a copper substrate; depositing a nickel layer on the surface of the copper substrate to obtain a copper-nickel substrate; subjecting the copper-nickel substrate to vacuum heat treatment to obtain a copper-nickel composite sheet; chromium plating the copper-nickel composite sheet in a chromium plating solution to obtain a copper-nickel-chromium substrate; and surface reduction of the copper-nickel-chromium substrate in a reducing atmosphere to obtain a copper-nickel-chromium heat sink. This invention, by depositing a nickel layer on the surface of a copper substrate and then performing vacuum heat treatment, helps to improve the density of the nickel layer and the interfacial bonding force between the nickel layer and the copper substrate. Subsequently, chromium plating is performed on the surface of the nickel layer to form a chromium layer. Surface reduction in a reducing atmosphere can reduce high-valence toxic chromium to low-valence chromium, while also improving the uniformity and stability of the coating on the surface of the copper-nickel-chromium heat sink, thus contributing to an increased service life of the heat sink.

The application discloses a low-reflection and low-stress copper alloy coating and a preparation method and application thereof. A copper-based powder, a solvent, a binder and a dispersant are mixed to obtain a mixed solution, the mixed solution is atomized, sprayed out through a spraying port of the atomized solution and subjected to hot air treatment, and then porous agglomerated particles are obtained; a copper base is subjected to laser etching to form a texture, and then cleaned to obtain a copper base with the texture; the porous agglomerated particles are loaded on the surface of the copper base with the texture through super-high-speed laser cladding to obtain the low-reflection and low-stress copper alloy coating. The application reduces laser dissipation in the super-high-speed laser cladding process by preparing the porous agglomerated particles and pre-preparing the texture on the copper base, realizes full melting of the coating powder, increases the contact area between the copper base and the coating through the texture, enhances the combination between the coating and the copper base, reduces the internal stress of the coating, and then significantly improves the wear resistance and service life of the coating.

This invention relates to the field of metal layered composite material preparation technology, specifically a rolling process for a layered molybdenum-copper composite material, comprising the following steps: short-pulse energy beam scanning treatment of the surfaces of the molybdenum and copper matrix materials to be composited, to construct a three-dimensional surface texture and form an amorphous / nanocrystalline activation layer on the surfaces of the molybdenum and copper matrix materials; depositing a barrier layer and a gradient functional layer with gradually changing composition on the surface of the activation layer under vacuum; stacking the treated molybdenum and copper matrix materials and vacuum encapsulating them, followed by multiple passes of warm rolling at a temperature between the recrystallization temperatures of copper and molybdenum to form the composite material; and subjecting the warm-rolled composite material to gradient cooling annealing with continuously varying spatial gradients. This invention, through high-vacuum flexible metal encapsulation, essentially isolates the composite interface from oxygen throughout the entire process from stacking, heating to rolling, effectively improving the reliability of the bonding.

This invention discloses a TaB2 / Cu composite material for electrical contacts and its preparation method. The composite material, by mass percentage, comprises 95-99.5% Cu and 0.5-5% TaB2. The preparation method includes: independently melting Cu-Ta master alloy, Cu raw material, and B raw material, followed by in-situ reaction to obtain a cast TaB2 / Cu composite material; hot forging the cast TaB2 / Cu composite material followed by cold rolling; and finally annealing the cold-rolled material. This invention introduces TaB2 ceramic particles into a copper matrix, combining the high melting point, high strength, and arc erosion resistance of the boride ceramic phase with the high conductivity of pure copper, resulting in a copper-based composite material with high conductivity, low mass loss, and stable contact resistance.

The application discloses a high-strength copper alloy for power grid and a preparation method thereof. The copper alloy contains Ti, Si and Cu, wherein the weight percentage of Ti is 0.4%-1.0%, the weight percentage of Si is 0.14%-0.35%, the atomic ratio of Ti and Si is 5:3, and the balance is copper; the copper alloy is composed of a copper matrix and a Ti5Si3 precipitated phase, and the Ti5Si3 precipitated phase is spherical particles with a diameter of 10-50 nm. The strength and electrical conductivity of the Cu-Ti-Si alloy prepared by the application are not inferior to those of a Cu-Ni-Si series alloy, but the raw material cost is lower, and the application of the Cu-Ti-Si alloy in a high-voltage transformer sleeve clamp is facilitated. The alloy preparation process of the application is simple, and does not need complex processes such as solid solution, hot rolling, drawing and the like.