Copper-graphene composite material and preparation method thereof

A composite material and graphene technology, which is applied in the field of copper-graphene composite materials and its preparation, can solve the problems affecting the chemical composition and microstructure of copper-graphene composite materials, unsatisfactory forming and processing performance, and comprehensive performance impact. Achieve the effects of controllable distribution density, improved binding strength, and improved binding capacity

Active Publication Date: 2016-06-29
NINGBO POWERWAY ALLOY MATERIAL
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The existing research and development of copper-graphene composite materials basically focus on the improvement of electrical conductivity, and the subsequent molding and processing performance is not ideal, which just forms the bottleneck of the application of copper-graphene composite materials; at the same time, the existing The preparation method will inevitably bring in impurity nickel, which will affect the chemical composition and microstructure of the copper-graphene composite material, thereby affecting its comprehensive performance.

Method used

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  • Copper-graphene composite material and preparation method thereof
  • Copper-graphene composite material and preparation method thereof

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Effect test

Embodiment 1

[0021] Copper powder and graphene with a particle size of 500 nanometers are used as raw materials, and the graphene content is 0.01 wt%. Argon is used as a protective gas for ball milling and powder mixing, and the ball milling time is 3 hours. After ball milling and powder mixing, put the mixed powder into the hot-press sintering mold in an argon-filled glove box, and put the hot-press sintering mold with the mixed powder into the hot-press sintering furnace. When the vacuum degree reaches ≤10 -2 After Pa, the temperature is raised to 850°C at a rate of 10±1°C / min, sintered at a constant temperature, and the holding time is 3 hours. The pressure applied to the mixed powder during the entire sintering process is 4 tons. After the hot pressing sintering is completed, the billet is taken out for hot isostatic pressing. The hot isostatic pressing uses argon as the pressure gas, and the heating rate is 10±1°C / min. The hot isostatic pressing process is as follows: pressure 160MPa,...

Embodiment 2

[0026] Copper powder and graphene with a particle size of 500 nanometers are used as raw materials, and the graphene content is 0.15 wt%, and argon is used as a protective gas for ball milling and powder mixing, and the ball milling time is 3 hours. After ball milling and powder mixing, put the mixed powder into the hot-press sintering mold in an argon-filled glove box, and put the hot-press sintering mold with the mixed powder into the hot-press sintering furnace. When the vacuum degree reaches ≤10 -2 After Pa, the temperature is raised to 850°C at a rate of 10±1°C / min, sintered at a constant temperature, and kept for 3 hours. The pressure applied to the mixed powder during the entire sintering process is 4 tons. After the hot pressing sintering is completed, the billet is taken out for hot isostatic pressing. The hot isostatic pressing uses argon as the pressure gas, and the heating rate is 10±1°C / min. The hot isostatic pressing process is: pressure 160MPa, temperature 850°C...

Embodiment 3

[0028] Copper powder and graphene with a particle size of 500 nanometers are used as raw materials, and the graphene content is 0.30wt%. Argon is used as a protective gas for ball milling and powder mixing, and the ball milling time is 3 hours. After ball milling and powder mixing, put the mixed powder into the hot-press sintering mold in an argon-filled glove box, and put the hot-press sintering mold with the mixed powder into the hot-press sintering furnace. When the vacuum degree reaches ≤10 -2 After Pa, start to heat up (heating rate is 10±1°C / min), when the temperature rises to the sintering temperature, start to keep warm and count. The hot pressing sintering process is as follows: the sintering temperature is 850°C, the sintering holding time is 3 hours, and the pressure applied to the mixed powder during the whole sintering process is 4 tons. After the hot pressing sintering is completed, the billet is taken out for hot isostatic pressing. The hot isostatic pressing us...

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Abstract

The invention relates to a copper-graphene composite material and a preparation method thereof. The copper-graphene composite material comprises graphene and copper, and is characterized in that the graphene is evenly distributed in a copper matrix in a sheet structure; distribution density of the graphene is 100 sheets per square centimeter to 3000 sheets per square centimeter; and preferably, the content of the graphene is 0.01 wt% to 0.30 wt%, and the balance is Cu. The copper-graphene composite material disclosed by the invention is prepared by adding the graphene into the copper; the copper matrix can be served as an electrical conduction main body to enable electrical conductivity of the composite material to be close to pure copper, and the graphene is served as a reinforcement phase, so that tensile strength performance and yield strength performance are both increased; therefore the copper-graphene composite material can be widely applied to the fields of consumer electronics, electrics, aeronautics and astronautics, high-speed rails, lead frames, electronic connector preparation; and the preparation method provided by the invention is suitable for industrial and scale production.

Description

technical field [0001] The invention relates to a copper-graphene composite material and a preparation method thereof. Background technique [0002] With the rapid development of aerospace, transportation, mechanical industry, energy and chemical industry, communication, electrical, power electronics and national defense industries, the industry has higher and higher requirements for the conductivity of copper or copper alloys. In order to obtain highly conductive copper or copper alloy materials, the scientific and industrial circles at home and abroad have carried out extensive research, and have developed copper-silver alloys, alumina dispersion-strengthened copper and other high-conductivity copper alloy materials and composite materials. Although these alloys or composite materials can meet the performance requirements of high electrical conductivity, these materials are not widely used because they contain noble metals or the preparation process is complicated. The in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C9/00B22F9/04B22F3/14B22F3/15
CPCB22F3/14B22F3/15B22F9/04B22F2003/145B22F2009/043B22F2998/10C22C1/05C22C9/00
Inventor 潘志军谢识才张明马鹏龙波
Owner NINGBO POWERWAY ALLOY MATERIAL
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