12 results about "Copper high" patented technology

This invention relates to the field of heat dissipation materials, specifically a diamond-copper composite high thermal conductivity material and its preparation process. It addresses the problem that existing diamond / copper composite materials have poor overall thermal conductivity, failing to meet the demands of modern electronic devices and high-power devices for high-performance heat dissipation materials. The diamond-copper composite high thermal conductivity material prepared using this process forms a composite structure of diamond, a composite interface layer, and copper, achieving a good composite of diamond and copper with good interfacial bonding stability. This significantly improves the overall performance of the material, resulting in superior high-temperature heat dissipation in practical applications and meeting the needs of modern electronic devices and high-power devices for high-performance heat dissipation materials.

The invention relates to the field of high-thermal-conductivity composite materials, in particular to a diamond and copper high-thermal-conductivity composite material and a preparation method thereof. The method is used for solving the problems that an existing diamond and copper high-thermal-conductivity composite material is low in density and thermal conductivity. The composite material is prepared by taking chromium-tungsten-coated diamond and aluminum nitride-coated copper powder as matrixes and adding lanthanum-magnesium-titanium-aluminum alloy powder, the diamond is firstly subjected to surface treatment, the surface of the diamond is plated with tungsten and chromium, the wettability of the diamond and copper can be enhanced through tungsten and chromium coating, the interface thermal resistance of the diamond and the copper matrixes is reduced, and the heat resistance of the diamond and the copper matrixes is improved; the surface of copper powder is coated with aluminum nitride to form a heat conduction network, lanthanum magnesium titanium aluminum alloy powder reduces the wetting angle of copper and diamond through alloying, interface gaps are filled, heat resistance is reduced, and the heat conductivity of the composite material is improved; all the components jointly improve the heat conduction performance of the composite material, and the requirements of the fields of high-power electronics, aerospace and the like for efficient heat dissipation are met.

The utility model provides a thick copper high-shielding circuit board structure, which comprises a thick copper circuit, prepregs, shielding layers and solder mask layers, the prepregs, the shielding layers and the solder mask layers are arranged on the two sides of the thick copper circuit in sequence outwards, the thick copper circuit is bonded between the two shielding layers through the prepregs, and the solder mask layers are arranged on the two sides of the thick copper circuit. The thick copper circuit is embedded in the prepreg to form a structure that the thick copper circuit is embedded in the prepreg, so that the thickness increase of the circuit board is relatively small while high shielding performance is realized, and the problem that the thickness of the circuit board is relatively large due to the fact that a shielding function needs to be designed on a welded electronic component or modules such as a shielding cage need to be independently designed in the prior art is solved.

The utility model discloses an aluminum-copper high-conductivity grounding device, which comprises an aluminum-copper grounding rod and a rotating head fixed at the lower end of the aluminum-copper grounding rod, the outer diameter of the rotating head is larger than that of the aluminum-copper grounding rod, the aluminum-copper grounding rod is in threaded connection with a rotating sleeve, and the rotating sleeve can rotate and drive the aluminum-copper grounding rod to move up and down. And a pressing plate is arranged at the upper end of the aluminum copper grounding rod and is pressed against the aluminum copper grounding rod downwards. The rotating head is inserted into the ground, the aluminum-copper grounding rod is pressed downwards through the pressing plate, the rotating sleeve is rotated, the aluminum-copper grounding rod is driven by the rotating sleeve to move downwards, and then the rotating sleeve is matched with downward pressing of the pressing plate, so that the aluminum-copper grounding rod can be inserted into the ground more efficiently and conveniently, and meanwhile the outer diameter of the rotating head is larger than that of the aluminum-copper grounding rod. And the surface of the aluminum-copper grounding rod is not easy to damage when the aluminum-copper grounding rod is inserted into the ground, so that the service life and the use effect of the aluminum-copper grounding rod are effectively ensured.

The application provides a brightener, a preparation method and application thereof. The brightener has a structure as shown in formula 1, wherein R is any one of CH3-(CH2) x -, Ph-(CH2) y - or an azacyclic group, x is 2-5, and y is 0-4. The brightener is connected with a functional group having strong polarity, has good inhibition effect on copper, and has a capturing cuprous ion at the other end of the structure, accelerates copper deposition, has certain leveling performance, can form leveling effect on the surface copper high potential, forms acceleration effect on the low point position in the hole, and can effectively improve the deep plating capacity of the acid copper plating solution, and the deep plating capacity can reach 79-85%.

The invention belongs to the technical field of electronic circuit manufacturing waste liquid treatment and resource recovery, and particularly relates to a chemical copper plating waste liquid electrochemical oxidation and copper high-value recovery method. The chemical copper plating waste liquid is sequentially subjected to pretreatment, electrochemical oxidation through a ruthenium-iridium-titanium electrode, precipitation reaction, solid-liquid separation, acid dissolution, solvent extraction and refining, back extraction and electrodeposition recovery, and a metal copper product is obtained. The method provided by the invention is an integrated method based on ruthenium iridium titanium electrode electrochemical oxidation-alkali precipitation-extraction refining, realizes efficient decomposition of organic complexes and high-valued recovery of copper resources, and can be widely applied to harmless treatment and resource utilization of the chemical copper plating waste liquid in the industries of printed circuit boards, integrated circuit packaging and the like.

The utility model relates to the technical field of high-frequency welding equipment, in particular to copper high-frequency welding equipment which comprises a base, a welding mechanism and an adjusting mechanism, the welding mechanism comprises a moving plate, a high-frequency welding head, a grinding and polishing head, a junction box and a fixing assembly, and the moving plate is slidably connected to the upper portion of the base through the adjusting mechanism; the high-frequency welding head is fixedly connected to the bottom face of the movable plate, the grinding and polishing head is fixedly connected to the bottom face of the movable plate, and the junction box is fixedly installed on the surface of the movable plate. Through cooperation of the welding mechanism and the adjusting mechanism, according to the specification and size of a product, a clamping plate moves on the base, the product is clamped and fixed, the welding position is ground and polished, surface flatness is ensured, meanwhile, impurities and the like are cleaned and collected through a collecting device, surface cleanliness is ensured, and the welding quality is improved. In addition, the adjusting mechanism can drive the high-frequency welding gun head to move up and down, the distance between the high-frequency welding gun head and the workpiece is adjusted, and the workpieces of different specifications and sizes can be welded conveniently.

The utility model discloses a core separating machine of a dialyzer, which belongs to the field of core separating machines and comprises a bottom plate, a machine body is fixed at the top of the bottom plate, a double-display panel is mounted on the machine body, a protective barrel is detachably connected onto the machine body, a turntable is rotatably arranged in the protective barrel through a bearing, and a tool is fixed at the top of the turntable. A motor base is fixed to the bottom of the protection barrel, a pure copper high-temperature motor is fixed to the bottom of the motor base, the rotating disc is fixed to an output shaft of the pure copper high-temperature motor, a buffer spring is fixed between the motor base and the machine body, and machine shells are detachably connected to the two side faces of the machine body. A limiting mechanism used for fixing a machine shell is arranged on the bottom plate. Through the arrangement of the limiting mechanism, positioning and fixing can be rapidly completed through the magnetic attraction force of the magnet, tedious screw tightening operation is not needed, and the machine shell can be easily taken down by slightly forcing to overcome the magnetic attraction force in the disassembling process.

The application discloses a preparation method of an organic-inorganic ferroelectric polymer composite film. The method takes a graphene / copper high-index surface with one-dimensional periodic potential as a substrate, uniformly dissolves poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) powder in a tetrahydrofuran organic solvent, adds ground monocrystal lead titanate (PbTiO3) mesoporous material, takes a proper amount of solution after sufficient stirring, spin coats the solution on the substrate, and performs vacuum drying and annealing treatment to obtain the organic-inorganic ferroelectric polymer composite film. The composite film prepared by the method has good orientation and exhibits excellent ferroelectric performance, and has a wide application prospect in flexible transducer devices, sensor devices and ferroelectric memory devices.

The invention discloses a preparation method of a thick-copper high multilayer board and the thick-copper high multilayer board. The preparation method comprises the following steps: S1, material preparation: taking a substrate, a prepreg, an isolating membrane and a copper foil, and cutting the prepreg into a preset size; s2, cutting treatment is conducted, specifically, the base plate is cut into a preset size; s3, inner layer processing: conveying the cut substrate to an inner layer processing station, then carrying out coating and exposure operation, then printing a preset circuit pattern on the surface of the substrate, and then forming the circuit pattern through an etching process; s4, AOI maintenance: carrying out AOI detection on the substrate subjected to inner layer processing, and checking bad defects on the surface of the substrate; s5, a browning process: performing browning treatment on the substrate which is overhauled to be qualified, and forming a browning film on the surface of the substrate; s6, filling the fusion rivet and the prepreg; s7, carrying out plate arrangement operation; s8, pressing treatment is carried out; and S9, targeting and edge cutting. The method has the advantages of being high in interlayer positioning precision, capable of avoiding the problem of pressing height difference and the like.

The application relates to a two-step envelope extrusion forming method for a laser copper high-finned shell, which comprises the following steps: S1, envelope extrusion preforming is carried out by adopting a preforming envelope die and a preforming concave die; under the synergistic multi-pass extrusion action of the preforming envelope die and the preforming concave die, a rectangular blank is incrementally plastically deformed and gradually thinned at room temperature, metal flows in multiple directions and in an orderly manner from a bottom plate area to a high-finned area, an inner profile surface of the high fin, an outer profile surface of the high fin and an inner surface of the bottom plate are formed at the same time, a groove of the outer profile surface of the high fin and an annular boss on the back surface of the bottom plate are formed at the same time, and a flash at the top end of the high fin is formed to obtain a preformed piece; S2, the flash of the preformed piece is cut off along the outer profile surface contour of the top end of the high fin of the preformed piece; and S3, envelope extrusion preforming is carried out by adopting a final forming envelope die and a final forming concave die. The application proposes a two-step envelope extrusion forming new process for the laser copper high-finned shell, and plastic forming manufacturing of the laser copper high-finned shell is realized through an incremental deformation mode.

The application discloses a combined collector for chalcopyrite in low-copper high-sulfur copper-sulfur ore and application thereof, and belongs to the technical field of mineral separation. The combined collector comprises pyridine methanol and ethyl xanthate. Firstly, the ore is crushed and ground to achieve monomer dissociation among minerals, and a small amount of lime is added to adjust the pH to 8-9 during the grinding; pyridine methanol and ethyl xanthate are used as the selective combined collector for chalcopyrite, and after one roughing, two scavenging and two cleaning operations, copper concentrate and copper tailings are obtained; the copper tailings are subjected to desliming operation, polymeric ferric sulfate and sodium carbonate are used for activation, and in the process of one roughing, three scavenging and three cleaning, sulfur concentrate and tailings are obtained. The efficient selective copper combined collector pyridine methanol and ethyl xanthate can greatly reduce the dosage of pyrite inhibitor, and simultaneously reduce the use of subsequent pyrite activator, and has the advantages of wide application range and high product index.