23 results about "Copper high" patented technology

The invention relates to the technical field of aluminum alloy materials, and discloses a low-copper high-strength aluminum alloy material and a preparation method and application thereof. The low-copper high-strength aluminum alloy material comprises the following components in percentage by mass: 7.3 to 8.3 percent of Zn, 2.2 to 3.2 percent of Mg, 0.2 to 0.8 percent of Cu, 0.05 to 0.3 percent of Zr, 0.05 to 0.3 percent of RE, 0 to 0.13 percent of Ti, less than 0.13 percent of Fe, less than 0.12 percent of Si and the balance of aluminum. The preparation method comprises the steps that metal raw materials are put into a smelting furnace to be smelted, then slagging-off and impurity removal, refining, casting, homogenization treatment, extrusion forming and aging treatment are conducted in sequence, and the low-copper high-strength aluminum alloy material is obtained. The low-copper high-strength aluminum alloy material has good performance and can be applied to manufacturing of a thin-wall hollow structure with the thickness of about 2 mm, manufacturing of aerospace profiles, manufacturing of new energy battery trays or manufacturing of anti-collision beams through divergent die extrusion.

The invention discloses a tin-copper series high-temperature antioxidant solder with low copper corrosion rate, which comprises the following components in percentage by mass: 1.2-2.5% of Cu, 0.1-1.2% of Bi, 0.03-0.15% of alloy element X and the balance of Sn, X is one or more of Ni, Nd, As, P and Ga, and in the alloy element X, the content of Ni is 0.02-0.1%, the total content of Nd and As is 0.01-0.02%, and the total content of P and Ga is 0.005-0.025%. The solder has low copper corrosion rate, high oxidation resistance and high strength, and the copper corrosion rate at 360 DEG C is reduced by 26.4%-58.7% compared with SnCu 0.7; the liquid surface is kept bright for 40-70 seconds at the temperature of 400 DEG C, and the oxidizing slag rate is only 1%-2.5%; the Brinell hardness is improved by 4.8%-65.3% at the room temperature, the tensile strength is improved by 8.5%-59.4%, and the alloy is particularly suitable for dip soldering and wave soldering scenes with the high welding temperature.

The invention relates to an ultra-small platinum-ruthenium-iron-cobalt-nickel-copper high-entropy alloy particle / carbon paper composite material and a preparation method and application thereof. Metal chloride and carbon paper serve as raw materials, the ultra-small platinum-ruthenium-iron-cobalt-nickel-copper high-entropy alloy particle / carbon paper composite material us-HEA / CFP is prepared through a solvothermal method and high-temperature thermal shock, and the preparation method comprises the following steps that a, a platinum-ruthenium-iron-cobalt-nickel-copper precursor / carbon paper is prepared through the solvothermal method; b, the precursor is subjected to high-temperature thermal shock to prepare us-HEA / CFP, the overpotentials under the current density of-100 mA / cm <-2 >,-500 mA / cm <-2 > and-1000 mA / cm <-2 > are only 31.4 mV, 69.2 mV and 102.5 mV respectively, and the Tafel slope is 28.9 mV dec-1. When the temperature is 60 DEG C, an anion exchange membrane electrolytic cell constructed by taking us-HEA / CFP as a cathode needs the voltage of 1.94 V to reach the industrial-grade current density of 1000 mA cm <-2 >, and the anion exchange membrane electrolytic cell can stably operate for 500 hours under the current density, so that the anion exchange membrane electrolytic cell shows great practical application potential. The method can be expanded to design of other high-entropy materials, and a new idea is provided for efficient preparation of an electrocatalyst with excellent performance.

The application discloses a high-copper high-scandium Al-Cu-Mg casting alloy with long-term thermal stability and a heat treatment process. The composition of the casting alloy is as follows: Cu 5.0-6.6%, Mg 0.10-0.40%, Mn 0.20-0.50%, Ti 0.05-0.10%, Zr 0.10-0.25%, Sc 0.10-0.60%, and the rest is Al. According to some examples of the application, the morphology, content and distribution of the W phase are changed through the heat treatment process, and the room-temperature mechanical properties and thermal stability of the high-copper high-scandium Al-Cu-Mg casting alloy are improved. Firstly, the Sc and Zr atoms are precipitated in the form of Al3(Sc, Zr) through low-temperature homogenization, and the formation of the W phase in the medium-temperature homogenization process is reduced. The content of the Sc atoms is reduced under the medium-temperature condition, so that the content of the W phase is reduced and the W phase is dispersedly distributed; and secondly, according to the phase transition point of the W phase, part of the W phase is dissolved through high-temperature homogenization, a certain amount of Cu and Sc atoms are released, the θ' and Ω phases are precipitated in the aging process, the Sc atoms are segregated at the θ'-Al2Cu interface in the thermal exposure process, and thus the high-copper high-scandium Al-Cu-Mg casting alloy with long-term thermal stability is obtained.

The invention discloses a preparation method of a low-copper high-strength brass strip for a household appliance connector. The preparation method comprises the following steps: (1) smelting an alloy comprising 59-62 wt% of Cu, 0.8-1.2 wt% of Sn, 0.3-0.8 wt% of Fe, 0.2-0.6 wt% of Ni, 0.01-0.05 wt% of P and the balance of Zn and inevitable impurities; (2) after a cast ingot is obtained through semi-continuous casting, homogenization treatment is conducted for 4-6 h at the temperature of 680-720 DEG C; and (3) the initial rolling temperature of hot rolling is controlled to be 650 + / -10 DEG C, the final rolling temperature is controlled to be larger than or equal to 480 DEG C, and the total reduction rate is 85-90%. According to the preparation method of the low-copper and high-strength brass strip for the household appliance connector, through Cu-Zn-Sn-Fe-Ni-P component system design and cooperation with the specific homogenization treatment-multi-pass temperature control hot rolling-double-stage cold rolling annealing process, under the condition that the copper content is reduced to 59-62%, the tensile strength is larger than or equal to 500 MPa, the electric conductivity is larger than or equal to 25% IACS, and the ductility can stably reach 10-15%. The grain size of the product reaches ASTM12 level or above, the bending performance R / t is equal to 0, no crack is generated, the lead content meets the RoHS3.0 standard, the comprehensive cost is reduced by 18-22%, and the high-end electric appliance connector is particularly suitable for being plugged and unplugged for 50 thousand times.

The invention provides a wet leaching method for low-copper high-grade matte nickel. The wet leaching method for the low-copper high-grade matte nickel comprises the steps that first-stage normal-pressure leaching and solid-liquid separation are conducted on the low-copper high-grade matte nickel, second-stage normal-pressure leaching and solid-liquid separation are conducted on an obtained first slag phase, and second-stage normal-pressure leaching liquid and a second slag phase are obtained; then, after the second slag phase is subjected to size mixing, first-stage oxygen pressure leaching is conducted, solid-liquid separation is conducted, and total first-stage oxygen pressure leaching liquid and leaching slag are obtained; and then, copper removal treatment is conducted on at least one of the second-section normal-pressure leaching liquid and the total first-section oxygen pressure leaching liquid, and the normal-pressure leaching step is conducted again. The wet leaching method of the low-copper high-grade matte nickel comprises two-stage normal pressure leaching and one-stage pressure leaching, the process is simplified, the cost is low, the leaching rate of nickel and cobalt is high, reaction conditions are easy to control, and the problem that copper is accumulated in a system can be solved in time.

This invention relates to the field of heat dissipation materials, specifically a diamond-copper composite high thermal conductivity material and its preparation process. It addresses the problem that existing diamond / copper composite materials have poor overall thermal conductivity, failing to meet the demands of modern electronic devices and high-power devices for high-performance heat dissipation materials. The diamond-copper composite high thermal conductivity material prepared using this process forms a composite structure of diamond, a composite interface layer, and copper, achieving a good composite of diamond and copper with good interfacial bonding stability. This significantly improves the overall performance of the material, resulting in superior high-temperature heat dissipation in practical applications and meeting the needs of modern electronic devices and high-power devices for high-performance heat dissipation materials.

The present application relates to a kind of low-cost high-strength low-copper high-manganese non-magnetic steel and its preparation method, adopt raw material powder composition: with high-manganese high-carbon pre-alloy powder as matrix, with 0.5-1% graphite powder, 0.3-0.5% copper powder, 2-2.5% Fe3P powder, 1-2% iron powder as composite activator, again with 1-1.5% SiC powder and Y2O3 powder mixed into the enhancement phase composition of matrix weight;Raw material powder is obtained by powder metallurgy method the high-strength low-copper high-manganese non-magnetic steel described above. Through once sintering, sintering density can be realized in 6.3-7.0 g / cm 3 , tensile strength is above 630 MPa, elongation after break is above 10.1%, excellent mechanical properties, by using lower content Cu element, cost is greatly reduced.

The invention relates to the field of high-thermal-conductivity composite materials, in particular to a diamond and copper high-thermal-conductivity composite material and a preparation method thereof. The method is used for solving the problems that an existing diamond and copper high-thermal-conductivity composite material is low in density and thermal conductivity. The composite material is prepared by taking chromium-tungsten-coated diamond and aluminum nitride-coated copper powder as matrixes and adding lanthanum-magnesium-titanium-aluminum alloy powder, the diamond is firstly subjected to surface treatment, the surface of the diamond is plated with tungsten and chromium, the wettability of the diamond and copper can be enhanced through tungsten and chromium coating, the interface thermal resistance of the diamond and the copper matrixes is reduced, and the heat resistance of the diamond and the copper matrixes is improved; the surface of copper powder is coated with aluminum nitride to form a heat conduction network, lanthanum magnesium titanium aluminum alloy powder reduces the wetting angle of copper and diamond through alloying, interface gaps are filled, heat resistance is reduced, and the heat conductivity of the composite material is improved; all the components jointly improve the heat conduction performance of the composite material, and the requirements of the fields of high-power electronics, aerospace and the like for efficient heat dissipation are met.

The utility model provides a thick copper high-shielding circuit board structure, which comprises a thick copper circuit, prepregs, shielding layers and solder mask layers, the prepregs, the shielding layers and the solder mask layers are arranged on the two sides of the thick copper circuit in sequence outwards, the thick copper circuit is bonded between the two shielding layers through the prepregs, and the solder mask layers are arranged on the two sides of the thick copper circuit. The thick copper circuit is embedded in the prepreg to form a structure that the thick copper circuit is embedded in the prepreg, so that the thickness increase of the circuit board is relatively small while high shielding performance is realized, and the problem that the thickness of the circuit board is relatively large due to the fact that a shielding function needs to be designed on a welded electronic component or modules such as a shielding cage need to be independently designed in the prior art is solved.

The utility model discloses an aluminum-copper high-conductivity grounding device, which comprises an aluminum-copper grounding rod and a rotating head fixed at the lower end of the aluminum-copper grounding rod, the outer diameter of the rotating head is larger than that of the aluminum-copper grounding rod, the aluminum-copper grounding rod is in threaded connection with a rotating sleeve, and the rotating sleeve can rotate and drive the aluminum-copper grounding rod to move up and down. And a pressing plate is arranged at the upper end of the aluminum copper grounding rod and is pressed against the aluminum copper grounding rod downwards. The rotating head is inserted into the ground, the aluminum-copper grounding rod is pressed downwards through the pressing plate, the rotating sleeve is rotated, the aluminum-copper grounding rod is driven by the rotating sleeve to move downwards, and then the rotating sleeve is matched with downward pressing of the pressing plate, so that the aluminum-copper grounding rod can be inserted into the ground more efficiently and conveniently, and meanwhile the outer diameter of the rotating head is larger than that of the aluminum-copper grounding rod. And the surface of the aluminum-copper grounding rod is not easy to damage when the aluminum-copper grounding rod is inserted into the ground, so that the service life and the use effect of the aluminum-copper grounding rod are effectively ensured.

The application provides a brightener, a preparation method and application thereof. The brightener has a structure as shown in formula 1, wherein R is any one of CH3-(CH2) x -, Ph-(CH2) y - or an azacyclic group, x is 2-5, and y is 0-4. The brightener is connected with a functional group having strong polarity, has good inhibition effect on copper, and has a capturing cuprous ion at the other end of the structure, accelerates copper deposition, has certain leveling performance, can form leveling effect on the surface copper high potential, forms acceleration effect on the low point position in the hole, and can effectively improve the deep plating capacity of the acid copper plating solution, and the deep plating capacity can reach 79-85%.

The invention belongs to the technical field of electronic circuit manufacturing waste liquid treatment and resource recovery, and particularly relates to a chemical copper plating waste liquid electrochemical oxidation and copper high-value recovery method. The chemical copper plating waste liquid is sequentially subjected to pretreatment, electrochemical oxidation through a ruthenium-iridium-titanium electrode, precipitation reaction, solid-liquid separation, acid dissolution, solvent extraction and refining, back extraction and electrodeposition recovery, and a metal copper product is obtained. The method provided by the invention is an integrated method based on ruthenium iridium titanium electrode electrochemical oxidation-alkali precipitation-extraction refining, realizes efficient decomposition of organic complexes and high-valued recovery of copper resources, and can be widely applied to harmless treatment and resource utilization of the chemical copper plating waste liquid in the industries of printed circuit boards, integrated circuit packaging and the like.

The application discloses a manufacturing method of a thin-plate thick-copper high-load current line rigid-flexible combination board, which comprises a flexible area and a rigid area. A thick copper layer is taken twice for half-etching to form a first rigid core plate and a second rigid core plate, and the two half-etching patterns correspond to form a complete line. A double-sided thick-copper flexible copper-clad plate is taken to manufacture a flexible plate line pattern, a first cover film is pasted to the corresponding flexible area, and resin ink is screen-printed to the corresponding rigid area and dried to form a flexible core plate. A semi-cured sheet and a low-flow adhesive semi-cured sheet are taken to be stacked and pressed with the above core plate to form a pressing plate. Surface line patterns, a solder mask layer and a cover are sequentially manufactured on the pressing plate to form a rigid-flexible combination board. Through the above manufacturing, line gaps are filled, the semi-cured sheet only plays a bonding role, the semi-cured sheet arranged between layers can effectively reduce the thickness, and the problems of poor pressing and poor glue filling caused by the fact that thick-copper circuit boards need to fill more glue in line gaps are solved.

The utility model relates to the technical field of high-frequency welding equipment, in particular to copper high-frequency welding equipment which comprises a base, a welding mechanism and an adjusting mechanism, the welding mechanism comprises a moving plate, a high-frequency welding head, a grinding and polishing head, a junction box and a fixing assembly, and the moving plate is slidably connected to the upper portion of the base through the adjusting mechanism; the high-frequency welding head is fixedly connected to the bottom face of the movable plate, the grinding and polishing head is fixedly connected to the bottom face of the movable plate, and the junction box is fixedly installed on the surface of the movable plate. Through cooperation of the welding mechanism and the adjusting mechanism, according to the specification and size of a product, a clamping plate moves on the base, the product is clamped and fixed, the welding position is ground and polished, surface flatness is ensured, meanwhile, impurities and the like are cleaned and collected through a collecting device, surface cleanliness is ensured, and the welding quality is improved. In addition, the adjusting mechanism can drive the high-frequency welding gun head to move up and down, the distance between the high-frequency welding gun head and the workpiece is adjusted, and the workpieces of different specifications and sizes can be welded conveniently.

The utility model discloses a core separating machine of a dialyzer, which belongs to the field of core separating machines and comprises a bottom plate, a machine body is fixed at the top of the bottom plate, a double-display panel is mounted on the machine body, a protective barrel is detachably connected onto the machine body, a turntable is rotatably arranged in the protective barrel through a bearing, and a tool is fixed at the top of the turntable. A motor base is fixed to the bottom of the protection barrel, a pure copper high-temperature motor is fixed to the bottom of the motor base, the rotating disc is fixed to an output shaft of the pure copper high-temperature motor, a buffer spring is fixed between the motor base and the machine body, and machine shells are detachably connected to the two side faces of the machine body. A limiting mechanism used for fixing a machine shell is arranged on the bottom plate. Through the arrangement of the limiting mechanism, positioning and fixing can be rapidly completed through the magnetic attraction force of the magnet, tedious screw tightening operation is not needed, and the machine shell can be easily taken down by slightly forcing to overcome the magnetic attraction force in the disassembling process.

The invention relates to the technical field of inductor manufacturing, and discloses a cathode and anode double-sided copper high-precision one-time corrosion method, which comprises the following steps of: 1, monitoring the thickness of copper in real time by adopting a high-precision sensor, adjusting the spraying pressure and the flow of etching liquid, ensuring the cathode and anode double-sided corrosion to be uniform, and improving the product precision and the qualified rate; meanwhile, various parameters are automatically recorded by the system, data support is provided for subsequent production, and the production process is optimized; and step 2, dynamically adjusting the line width of the copper plates on the positive and negative sides through an accurate line width compensation algorithm, ensuring that the accuracy of the line width of the copper plates is controlled within a reasonable range in the corrosion process, further reducing the line width deviation, and improving the flatness and straightness of the circuit. According to the method, the corrosion time and temperature are accurately controlled, and an accurate line width compensation algorithm is adopted, so that the thickness and the line width of the cathode and anode copper layers are accurately regulated and controlled, and the problems of high etching difficulty and inconsistent line width in the prior art are effectively solved.

The invention discloses a method for manufacturing a thick copper high-current-carrying flexible circuit board, comprising the steps of: forming a first dry film pattern on both sides of a copper layer, then etching a portion of the thickness, stripping the film, preparing a first ink, baking and curing, printing water glue, pre-baking, attaching a first covering film layer and pressing, forming a second dry film pattern on both sides, etching for a second time, stripping the film, preparing a second ink, baking and curing, attaching a second covering film layer and pressing, electroplating gold, and forming to form a thick copper high-current-carrying flexible circuit board; by adopting a method of manufacturing circuit patterns from both sides, the side etching phenomenon generated during etching is effectively reduced, the first ink pattern and the second ink pattern are manufactured, the gaps between the thick copper circuit patterns are effectively filled, the overall circuit gaps are fully filled, the covering film layer has strong bonding strength, and the overall manufacturing method forms a complete processing process with front-to-back coordination and mutual complementation, thereby providing an effective manufacturing method for the manufacturing of such products.

The application discloses a preparation method of an organic-inorganic ferroelectric polymer composite film. The method takes a graphene / copper high-index surface with one-dimensional periodic potential as a substrate, uniformly dissolves poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) powder in a tetrahydrofuran organic solvent, adds ground monocrystal lead titanate (PbTiO3) mesoporous material, takes a proper amount of solution after sufficient stirring, spin coats the solution on the substrate, and performs vacuum drying and annealing treatment to obtain the organic-inorganic ferroelectric polymer composite film. The composite film prepared by the method has good orientation and exhibits excellent ferroelectric performance, and has a wide application prospect in flexible transducer devices, sensor devices and ferroelectric memory devices.

The invention discloses a preparation method of a thick-copper high multilayer board and the thick-copper high multilayer board. The preparation method comprises the following steps: S1, material preparation: taking a substrate, a prepreg, an isolating membrane and a copper foil, and cutting the prepreg into a preset size; s2, cutting treatment is conducted, specifically, the base plate is cut into a preset size; s3, inner layer processing: conveying the cut substrate to an inner layer processing station, then carrying out coating and exposure operation, then printing a preset circuit pattern on the surface of the substrate, and then forming the circuit pattern through an etching process; s4, AOI maintenance: carrying out AOI detection on the substrate subjected to inner layer processing, and checking bad defects on the surface of the substrate; s5, a browning process: performing browning treatment on the substrate which is overhauled to be qualified, and forming a browning film on the surface of the substrate; s6, filling the fusion rivet and the prepreg; s7, carrying out plate arrangement operation; s8, pressing treatment is carried out; and S9, targeting and edge cutting. The method has the advantages of being high in interlayer positioning precision, capable of avoiding the problem of pressing height difference and the like.

The invention discloses a vacuum electron beam welding method for an oxygen-free copper high-pressure container. The vacuum electron beam welding method comprises the following steps: cleaning a welding seam of a cylinder of the high-pressure container; the high-pressure container barrel is fixed to a two-dimensional working platform of a vacuum electron beam welding machine, and the butt joint gap of welding seams is not larger than 0.1 mm; the high-pressure container barrel is fixed between the rotary positioner and the tail top; the two-dimensional working platform drives the high-pressure container barrel, the rotary positioner and the tail top to move into the vacuum chamber; electron beam welding is conducted after the vacuum chamber is vacuumized to the target vacuum degree; the electron beam welding process comprises electron beam scanning cleaning before welding, preheating before welding and formal welding. Good internal quality and appearance quality of the welding seam can be obtained, the welding seam joint is smooth and attractive, defects such as oxidation and cracks are avoided, the comprehensive performance of the welding seam is good, and the method is suitable for electron beam welding of high-pressure containers of spaceflight solid rocket engine products.

The application relates to a two-step envelope extrusion forming method for a laser copper high-finned shell, which comprises the following steps: S1, envelope extrusion preforming is carried out by adopting a preforming envelope die and a preforming concave die; under the synergistic multi-pass extrusion action of the preforming envelope die and the preforming concave die, a rectangular blank is incrementally plastically deformed and gradually thinned at room temperature, metal flows in multiple directions and in an orderly manner from a bottom plate area to a high-finned area, an inner profile surface of the high fin, an outer profile surface of the high fin and an inner surface of the bottom plate are formed at the same time, a groove of the outer profile surface of the high fin and an annular boss on the back surface of the bottom plate are formed at the same time, and a flash at the top end of the high fin is formed to obtain a preformed piece; S2, the flash of the preformed piece is cut off along the outer profile surface contour of the top end of the high fin of the preformed piece; and S3, envelope extrusion preforming is carried out by adopting a final forming envelope die and a final forming concave die. The application proposes a two-step envelope extrusion forming new process for the laser copper high-finned shell, and plastic forming manufacturing of the laser copper high-finned shell is realized through an incremental deformation mode.

The application discloses a combined collector for chalcopyrite in low-copper high-sulfur copper-sulfur ore and application thereof, and belongs to the technical field of mineral separation. The combined collector comprises pyridine methanol and ethyl xanthate. Firstly, the ore is crushed and ground to achieve monomer dissociation among minerals, and a small amount of lime is added to adjust the pH to 8-9 during the grinding; pyridine methanol and ethyl xanthate are used as the selective combined collector for chalcopyrite, and after one roughing, two scavenging and two cleaning operations, copper concentrate and copper tailings are obtained; the copper tailings are subjected to desliming operation, polymeric ferric sulfate and sodium carbonate are used for activation, and in the process of one roughing, three scavenging and three cleaning, sulfur concentrate and tailings are obtained. The efficient selective copper combined collector pyridine methanol and ethyl xanthate can greatly reduce the dosage of pyrite inhibitor, and simultaneously reduce the use of subsequent pyrite activator, and has the advantages of wide application range and high product index.