64results about How to "Improve interface binding state" patented technology

The invention discloses titanium carbide-based solid solution metal ceramic and a preparation method thereof. The titanium carbide-based solid solution metal ceramic is composed of a hard phase (Ti, W) C solid solution and an adhesive phase Ni, wherein the composite material powder is prepared by mold pressing forming, degreasing and vacuum sintering; the composite material is synthesized by utilizing Ti powder, W powder, Ni powder and graphite powder as raw materials and performing a high-energy ball milling induced self-propagating reaction under argon protection, and the raw materials comprise the following ingredient by mass percent: 40.60-58.02% of Ti powder, 11.02-29.18% of W powder, 15.00-20.00% of Ni powder and 11.94-15.27% of graphite powder. The preparation of solid solution powder is simple in process, short in cycle, low in energy consumption and easy to control the oxygen content, the hardness of the prepared titanium carbide-based solid solution metal ceramic is 89.0-91.8HRA, the bending strength is not smaller than 1680MPa, and the fracture toughness KIC is not smaller than 12.5MPa.m1 / 2, so that the titanium carbide-based solid solution metal ceramic is suitable for serving as high-speed and high-efficiency cutting tools, hot extrusion molds and heat-resistant, corrosion-resistant and wear-resistant parts and components.

The invention discloses a making technology of high-silafont electronic packing material, which comprises the following steps: A) preparing powder: blending industrial pure aluminum and high-pure silicon at 6-8.8:4-1.2 percentage to prepare Al-Si alloy powder; B) proceeding ball grinding disposal for Al-Si alloy powder at 5-15:1 percentage for 8-32 h; C) loading oxide alloy powder in the pure aluminum; proceeding squeezing disposal on the 300-500 ton hydrostatic machine through forward squeezing pattern; keeping temperature at 400-520 deg.c for 0.5-2 h for Al-Si alloy powder before squeezing; placing each squeezing mould in the heat stove at 10-21 squeezing rate to preheat at 200-400 deg.c; squeezing to produce the product. The invention can improve heat conductivity, airtightness and tensile strength obviously, which keeps low expansion coefficient.

The invention discloses a carbon fiber reinforced nickel-based composite material and a preparation method thereof, and relates to a metal-based composite material. The metal matrix composite materials prepared by the prior art are not suitable for parts such as steam turbines used at high temperatures. The composition and volume percentage of the composite material of the present invention are: carbon fiber: 30-35%, copper: 6-8%, nickel: 57-64%. The process steps are: carbon fiber pretreatment, copper electrodeposition, cleaning, neutralization, nickel electrodeposition, forming electrodeposited nickel, billet cleaning, drying, cutting billets into molds, vacuum hot pressing, and furnace cooling. The Cf / Ni composite material prepared by the three-step electrodeposition method in the present invention can not only meet the use requirements of gas turbine engine blades, but also has the advantages of good high temperature strength, high elastic modulus, low density, high melting point, and creep resistance. .

The invention belongs to the technical field of electronic packaging materials, and provides a high-thermal conductivity electronic packaging material and a preparation method thereof. The packaging material comprises a reinforcement body comprising diamond grains, pure copper powder and a third component, namely chromium, molybdenum, silicon, titanium or tungsten, wherein the volume percentage of the reinforcement body is 25 to 80 percent and that of the third component is 0.01 to 10 percent. The preparation method comprises the following steps: mixing the reinforcement body, the pure copperpowder and the third component evenly in proportion, and reducing the mixture by hydrogen in a reducing furnace for 1 to 5 hours, at a temperature between 200 and 400 DEG C; feeding the mixed powder in a graphite die and treating the mixed powder by adopting a spark plasma sintering process; vacuumizing the graphite die, heating up the graphite die to between 700 and 1,100 DEG C at a rate of temperature increase of 50 to 200 DEG C / min and pressurizing the graphite die to between 20 and 50MPa; and carrying out heat preservation for 1 to 20 minutes when reaching a sintering temperature and thentaking the packaging material out for demoulding after furnace cooling.