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Method for preparing high-silicon aluminum alloy by peeling and thermal extruding through rapid-solidified powder metallurgy

A high-silicon aluminum alloy and powder metallurgy technology, applied in metal processing equipment, transportation and packaging, etc., can solve the problems of interdiffusion barriers of alloying elements, difficulty in forming metallurgical bonding, and low cooling speed of alloys, and achieve high added value of products , large amount of powder deformation, and the effect of improving the mechanical properties of the alloy

Inactive Publication Date: 2017-05-17
GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among many preparation technologies, the spray deposition method is a new technology developed on the basis of traditional powder metallurgy technology. In addition to the general characteristics of rapid solidification, it also combines the atomization pulverization process with the powder consolidation process to simplify production. process, reduce production costs, and solve the problem of powder surface oxidation in powder metallurgy, and reduce the adverse effects of element particle interfaces on alloy properties. Coarse and therefore relatively low strength
At the same time, the spray deposition method is easy to form holes and has low density
[0004] In summary, the combination of rapid solidification technology and powder metallurgy technology to prepare high-silicon aluminum alloy materials has excellent characteristics such as low density, high thermal conductivity, low expansion, and high specific strength, and has great potential in the fields of automobiles, electronics, and aviation industries. However, due to the high activity of Al, an oxide film will inevitably be formed during rapid solidification and pulverization, which will hinder the interdiffusion of alloying elements during the densification process and make it difficult to form a metallurgical bond. Therefore, Requires some special densification process

Method used

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  • Method for preparing high-silicon aluminum alloy by peeling and thermal extruding through rapid-solidified powder metallurgy
  • Method for preparing high-silicon aluminum alloy by peeling and thermal extruding through rapid-solidified powder metallurgy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Example 1: Al-16Si-3.5Fe-2.3Cu-0.5Mg high silicon aluminum alloy

[0032] The high-silicon aluminum alloy powder is sieved, and the high-silicon aluminum alloy powder with a particle size of -150 mesh is selected, put into a pure aluminum sheath, and then the pure aluminum sheath is placed in the degassing furnace. The lower part is equipped with thermocouples to measure the temperature, and the vacuum unit is used for vacuum degassing, and the temperature is raised to 120°C at a rate of 20°C / 30min, and the temperature is kept for 120min to make the vacuum degree reach 8╳10 - 2 Pa; then raise the temperature to 240°C at a rate of 20°C / 30min, keep it warm for 210min, and make the vacuum degree reach 8╳10 -2 Pa; then raise the temperature to 340°C at a rate of 20°C / 30min, keep it warm for 180min, and make the vacuum degree reach 8╳10 -2 Pa; then raise the temperature to 440°C at a rate of 20°C / 30min, keep it warm for 180min, and make the vacuum degree reach 1╳10 -2 Pa;...

Embodiment 2

[0035] Example 2: Al-20Si-5Fe-4.3Cu-1.5Mg high silicon aluminum alloy

[0036] The high-silicon aluminum alloy powder is sieved, and the high-silicon aluminum alloy powder with a particle size of -200 mesh is selected, put into a pure aluminum sheath, and then the pure aluminum sheath is placed in the degassing furnace. The lower part is equipped with thermocouples to measure the temperature, and the vacuum unit is used for vacuum degassing, and the temperature is raised to 150°C at a rate of 20°C / 30min, and the temperature is kept for 120min to make the vacuum degree reach 8╳10 - 2 Pa; then raise the temperature to 250°C at a rate of 20°C / 30min, keep it warm for 210min, and make the vacuum degree reach 8╳10 -2 Pa; then raise the temperature to 350°C at a rate of 20°C / 30min, keep it warm for 180min, and make the vacuum degree reach 8╳10 -2 Pa; then raise the temperature to 450°C at a rate of 20°C / 30min, keep it warm for 180min, and make the vacuum degree reach 1╳10 -2 Pa; t...

Embodiment 3

[0039] Example 3: Al-23Si-4Fe-4.3Cu-1Mg high silicon aluminum alloy

[0040] The high-silicon aluminum alloy powder is sieved, and the high-silicon aluminum alloy powder with a particle size of -200 mesh is selected, put into a pure aluminum sheath, and then the pure aluminum sheath is placed in the degassing furnace. The lower part is equipped with thermocouples to measure the temperature, and the vacuum unit is used for vacuum degassing, and the temperature is raised to 150°C at a rate of 20°C / 30min, and the temperature is kept for 150min to make the vacuum degree reach 8╳10 - 2 Pa; then raise the temperature to 250°C at a rate of 20°C / 30min, keep it warm for 240min, and make the vacuum degree reach 8╳10 -2 Pa; then raise the temperature to 350°C at a rate of 20°C / 30min, keep it warm for 210min, and make the vacuum degree reach 8╳10 -2 Pa; then raise the temperature to 450°C at a rate of 20°C / 30min, keep it warm for 210min, and make the vacuum degree reach 1╳10 -2 Pa; the...

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Abstract

The invention relates to a method for preparing high-silicon aluminum alloy by peeling and thermal extruding through rapid-solidified powder metallurgy. The method comprises the following steps: preparing high-silicon aluminum alloy powder through an atomizing powdering method; screening the powder; selecting the high-silicon aluminum alloy powder with average particle being not greater than -150 meshes; transferring into an aluminum covered sleeve; performing air removing and opening sealing; then carrying out peeling and thermal extruding to obtain a high-silicon aluminum alloy bar; machining to remove the aluminum covered sleeve in the periphery of the high-silicon aluminum alloy bar; and performing solid solution treatment and aging treatment to obtain the finished high-silicon aluminum alloy. The high-silicon aluminum alloy material prepared by the method is small and uniform in structure, high in density which can reach 100%, and high in powder deformation, so that the powder interface combination state can be improved; the mechanical property of the alloy can be improved; the strength of the high-silicon aluminum alloy material under room temperature is not less than 450MPa, and the plasticity is not less than 1%.

Description

technical field [0001] The invention belongs to the technical field of preparation of high-silicon aluminum alloy materials, in particular to a preparation method of rapid solidification powder metallurgy high-silicon aluminum alloy peeling hot extrusion. Background technique [0002] High-silicon aluminum alloy has a series of advantages such as small specific gravity, light weight, good thermal conductivity, low thermal expansion coefficient, good volume stability, wear resistance and corrosion resistance, and certain high temperature strength, and is widely used as piston and rotor of engines Materials have great potential for development in the fields of automobiles, electronics, and aviation industries. [0003] The preparation technology of high-silicon aluminum alloy materials includes ingot preparation technology and processing and forming technology. Among them, the ingot preparation technology includes melting casting method, powder metallurgy sintering method, spr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/20B22F1/00C22F1/043
CPCC22F1/043B22F3/20B22F2003/208B22F2999/00B22F2998/10B22F1/142B22F2003/248B22F2201/20
Inventor 邬小萍
Owner GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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