Copper-plated graphite film reinforced copper-based laminated block composite material and preparation method thereof

Abstract

The invention provides a copper-plated graphite film reinforced copper-based laminated block composite material and a preparation method thereof. The composite material is the laminated block composite material composed of a copper-plated graphite film and a copper foil. The preparation method of the copper-plated graphite film adopts improved electroless plating to obtain a coating with good bonding and being controllable and uniform and clean; and the preparation method of the composite material adopts vacuum hot pressing sintering, so that requirements on equipment are low, and the operation is simple. The thermal conductivity of the composite material prepared by the preparation method exceeds 1000 W / (m.K), a coefficient of thermal expansion can be lower than 10 ppm / K, and the composite material is a promising thermal management material with both bending strength and advantages of metal materials and graphite materials.

Description

technical field [0001] The invention relates to the field of metal matrix composite materials and thermal management, specifically, a method for preparing copper-plated graphite film and copper foil laminated structure hot-pressing sintering, this material can be used for heat dissipation of microelectronic components, and belongs to integrated circuits , Electronic packaging materials field. Background technique [0002] With the continuous development of the electronics industry, electronic components tend to be miniaturized, integrated and high-power. The high-density heat generated during work accumulates rapidly, and the thermal mismatch of traditional materials seriously affects the reliability and stability of equipment. and service life. Therefore, the electronics industry urgently needs a new type of thermal management material with ultra-high thermal conductivity, low thermal expansion and certain mechanical properties to meet the ever-increasing requirements of t...

AI Technical Summary

Problems solved by technology

At high temperature, the compatibility between liquid copper and carbon reinforcement is very poor, the interfacial bonding strength of the composite material is very low, and the mechanical properties of the prepared bulk composite material are poor, which cannot meet the application requirements, which is an urgent problem to be solved

[0005] After comparing the existing technology, it was found that the patent application number CN201410114471.5 "a method for preparing a high thermal conductivity graphite film-copper composite material" prepared a single-layer graphite film-copper by electroless plating and electroplating on a high thermal conductivity graphite film. Film-like composite materials are used to improve axial thermal conductivity, but the film-like materials obtained by this method do not form bulk materials, which cannot effectively improve the overall performance of the material, and the application range is limited

The patent application number is CN201510052133.8 "a high thermal conductivity graphite film metal block composite material and its preparation method" uses high thermal conductivity graphite film and aluminum foil to be superimposed and hot pressed to prepare a graphite film reinforced aluminum matrix composite materials, but graphite film and aluminum foil are very easy to generate Al at high temperature 4 C 3 Harmful substances such as harmful substances, the control of interfacial products will affect the interfacial bonding of composite materials, thus resulting in the low strength of the prepared bulk composite materials, which cannot meet the application requirements

The patent application number is CN201711019866.7 "A preparation method of copper / graphite film multilayer laminated block composite material" uses the casting method to spread the copper powder slurry on the mesh graphite film, layer by layer, add Press sintering to prepare a laminated bulk composite material in which graphite films and copper layers are alternately arranged. This method uses copper powder slurry in the rivet structure of the mesh graphite film to solve the problem of low interlayer bonding strength, but sacrifices the graphite film. Due to its ultra-high in-plane thermal conductivity, the thermal conductivity of the obtained bulk composite material has no performance advantages compared with graphite sheet and diamond-reinforced copper-based composite materials. At the same time, it also increases the thermal mismatch at the interface between copper and carbon, which cannot meet Current Application Requirements

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