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Process for preparing silumin electronic package materials

An electronic packaging material, high-silicon aluminum alloy technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve problems such as increased heating rate, increased circuit operating temperature, and increased component failure rate, and achieves a state of interface bonding Effects of improving, increasing thermal conductivity, and improving characteristics

Inactive Publication Date: 2008-08-13
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The improvement of chip integration will inevitably lead to an increase in its heat generation rate, which will cause the operating temperature of the circuit to rise continuously, resulting in an increase in the failure rate of components

Method used

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  • Process for preparing silumin electronic package materials
  • Process for preparing silumin electronic package materials
  • Process for preparing silumin electronic package materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A) Powder preparation

[0020] Industrial pure aluminum and high-purity silicon are melted in an induction furnace with a mass ratio of 8.8:1.2, heated to 750°C, fully stirred, and covered with a flux (30% NaCl + 47% KCl + 23% cryolite by mass percentage). Slag, and with hexachloroethane (C 2 Cl 6 ) outgassing. The metal droplets are injected into the spray device through the leak nozzle, and the metal droplets atomized by high-pressure nitrogen gas are directly sprayed into the high-pressure water flow 200mm away from the nozzle. After cooling, the water flow containing Al-Si alloy powder passes through the screen and leaks out. Miscellaneous materials flow into a high-speed rotary dryer for dehydration treatment, and the required Al-12Si alloy powder is obtained after drying and sieving. The powder-making process parameters are attached in Table 1.

[0021] Table 1 Milling Process Parameters

[0022]

[0023] B) Ball milling process of powder

[0024] Put the ...

Embodiment 2

[0030] A) Powder preparation

[0031] Industrial pure aluminum and high-purity silicon are melted in an induction furnace according to a mass ratio of 8:2, heated to 900°C, fully stirred, and covered with a flux (30% NaCl+47%KCl+23% cryolite by mass percentage) Slag, and with hexachloroethane (C 2 Cl 6 ) outgassing. The metal droplets are injected into the spray device through the leak nozzle, and the metal droplets atomized by high-pressure nitrogen gas are directly sprayed into the high-pressure water flow 200mm away from the nozzle. After cooling, the water flow containing Al-Si alloy powder passes through the screen and leaks out. Miscellaneous flows into the high-speed rotary dryer for dehydration treatment, and the required Al-20Si alloy powder is obtained after drying and sieving. The powder-making process parameters are attached in Table 2.

[0032] Table 2 Milling Process Parameters

[0033]

[0034] B) Ball milling process of powder

[0035] Put the prepared ...

Embodiment 3

[0041] A) Powder preparation

[0042]Industrial pure aluminum and high-purity silicon are melted in an induction furnace with a mass ratio of 7.4:2.6, heated to 1050°C, fully stirred, and covered with a flux (30% NaCl+47% KCl+23% cryolite by mass percentage) Slag, and with hexachloroethane (C 2 Cl 6 ) outgassing. The metal droplets are injected into the spray device through the leak nozzle, and the metal droplets atomized by high-pressure nitrogen gas are directly sprayed into the high-pressure water flow about 200mm away from the nozzle. After cooling, the water containing Al-Si alloy powder flows through the screen and leaks. The debris is flowed into a high-speed rotating drier for dehydration treatment, and the required Al-26Si alloy powder is obtained after drying and sieving. The powder-making process parameters are attached in Table 3.

[0043] Table 3 Milling Process Parameters

[0044]

[0045] B) Ball milling process of powder

[0046] The prepared Al-26Si al...

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Abstract

The invention discloses a making technology of high-silafont electronic packing material, which comprises the following steps: A) preparing powder: blending industrial pure aluminum and high-pure silicon at 6-8.8:4-1.2 percentage to prepare Al-Si alloy powder; B) proceeding ball grinding disposal for Al-Si alloy powder at 5-15:1 percentage for 8-32 h; C) loading oxide alloy powder in the pure aluminum; proceeding squeezing disposal on the 300-500 ton hydrostatic machine through forward squeezing pattern; keeping temperature at 400-520 deg.c for 0.5-2 h for Al-Si alloy powder before squeezing; placing each squeezing mould in the heat stove at 10-21 squeezing rate to preheat at 200-400 deg.c; squeezing to produce the product. The invention can improve heat conductivity, airtightness and tensile strength obviously, which keeps low expansion coefficient.

Description

technical field [0001] The invention relates to a preparation process of an aluminum-silicon electronic packaging material, in particular to a preparation process of a high-silicon aluminum alloy electronic packaging material. Background technique [0002] Since the first semiconductor integrated circuit came out in 1958, so far, the development of IC chip integration has basically followed the MOORE law. The improvement of chip integration will inevitably lead to the increase of its heating rate, which makes the operating temperature of the circuit rise continuously, which leads to the increase of component failure rate. At the same time, electronic packaging is also constantly developing in the direction of miniaturization, light weight and high-density assembly. Since the 1990s, various high-density packaging technologies, such as chip size packaging (CSP), multi-chip components ( The continuous emergence of MCM) and SLIM have further increased the heat generation rate p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29B22F9/08
Inventor 杨伏良易丹青甘卫平张伟刘泓
Owner CENT SOUTH UNIV
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