High-thermal conductivity electronic packaging material and preparation method thereof

Abstract

The invention belongs to the technical field of electronic packaging materials, and provides a high-thermal conductivity electronic packaging material and a preparation method thereof. The packaging material comprises a reinforcement body comprising diamond grains, pure copper powder and a third component, namely chromium, molybdenum, silicon, titanium or tungsten, wherein the volume percentage of the reinforcement body is 25 to 80 percent and that of the third component is 0.01 to 10 percent. The preparation method comprises the following steps: mixing the reinforcement body, the pure copperpowder and the third component evenly in proportion, and reducing the mixture by hydrogen in a reducing furnace for 1 to 5 hours, at a temperature between 200 and 400 DEG C; feeding the mixed powder in a graphite die and treating the mixed powder by adopting a spark plasma sintering process; vacuumizing the graphite die, heating up the graphite die to between 700 and 1,100 DEG C at a rate of temperature increase of 50 to 200 DEG C / min and pressurizing the graphite die to between 20 and 50MPa; and carrying out heat preservation for 1 to 20 minutes when reaching a sintering temperature and thentaking the packaging material out for demoulding after furnace cooling.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials and provides a high thermal conductivity electronic packaging material and a preparation method thereof. Background technique [0002] With the continuous development of electronic technology, the degree of integration of electronic components is getting higher and higher, and the heat generation is also increasing. Microprocessors and power semiconductor devices often cannot work normally due to high temperature in the application process. Heat dissipation problems It has become one of the main technical bottlenecks facing the development of the electronic information industry. Traditional electronic packaging materials mainly include: Al, Cu, Kovar alloy, Invar alloy, W / Cu alloy, Mo / Cu alloy, etc. The thermal expansion coefficient of Al and Cu is too large, which does not match the ceramic substrate; the thermal conductivity of Kovar alloy and Invar alloy is too low, and ...

AI Technical Summary

Problems solved by technology

Russia's Ekimov et al. used high temperature and high pressure methods to prepare diamond / copper composite materials with thermal conductivity up to 900W / m·K, but the volume that can be obtained is small and the application value is not great.