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Preparation method of ceramic substrate high-frequency copper-clad plate

A technology of ceramic substrate and copper clad laminate, applied in the field of preparation of high frequency copper clad laminate of ceramic substrate, can solve the problems of high dielectric loss, low mechanical properties and dimensional stability, poor electromagnetic shielding performance, etc., and achieve high impact resistance performance , Excellent electromagnetic shielding performance, good heat resistance

Inactive Publication Date: 2019-07-26
SYNERGY INNOVATION INST OF GDUT HEYUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper clad laminates are used more and more widely in various fields. Traditional copper clad laminates can no longer meet higher and higher performance requirements. The main problems are: high dielectric loss, poor electromagnetic shielding performance, and mechanical properties and dimensional stability under high temperature conditions. Low

Method used

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  • Preparation method of ceramic substrate high-frequency copper-clad plate

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preparation example Construction

[0024] A method for preparing a high-frequency copper-clad laminate with a ceramic substrate, comprising the following steps:

[0025] 01. Substrate preparation;

[0026] 02. Plasma spraying ceramic material layer: uniform plasma spraying is carried out on the surface of the substrate, and the plasma spraying forms a ceramic material layer on the surface of the substrate, and the thickness of the ceramic material layer is 5-30 μm;

[0027] 03. Metal foil lamination and curing: apply a layer of glue on the surface of the ceramic material layer prepared above, and then cover it with metal foil, and then put it into a vacuum hot press for hot pressing and compounding to obtain a ceramic substrate with a high thickness. Frequency copper clad laminate. The glue solution is the glue solution prepared during the substrate preparation process.

[0028] Further, in the plasma spraying ceramic material layer in step 03, the spraying voltage is 40-60V, the current is 500-700A, the flow...

Embodiment 1

[0042] A method for preparing a high-frequency copper-clad laminate with a ceramic substrate, comprising the following steps:

[0043] 11. Add 120g of epoxy resin, 15g of diphenyl polyarylether, 30g of DDS curing agent and curing accelerator, add 45g of acetone solvent, after fully dissolving, add fillers (silicon dioxide and hydroxide with a particle size of 300-600nm Aluminum, the ratio is 3:2), and then mix and stir to obtain glue. Use NE-glass fiber cloth as a reinforcing material to impregnate the above glue solution, and then bake in an oven at 150-160°C for 8 minutes to cure to obtain the substrate;

[0044] 12. Adopt plasma spraying process to spray one layer of ceramic material layer on the substrate surface obtained above; h 2 ) flow rate of 6L / min, powder feeding gas (Ar) flow rate of 8g / min, and a distance of 15cm between the nozzle and the surface of the substrate to achieve uniform spraying on the surface of the substrate and form a ceramic material layer with ...

Embodiment 2

[0047] 21. Add 120g of epoxy resin, 15g of polyaryl ether, 30g of DDS curing agent and curing accelerator, and add 45g of acetone solvent. After fully dissolving, add fillers (silicon dioxide and hydroxide Aluminum, the ratio is 3:2), and then mix and stir to obtain glue. Use NE-glass fiber cloth as a reinforcing material to impregnate the above glue solution, and then bake in an oven at 150-160°C for 8 minutes to cure to obtain the substrate;

[0048] 22. Adopt plasma spraying process to spray a layer of ceramic material layer on the surface of the substrate obtained above; the ceramic material layer is TiN; the plasma spraying process is: spraying voltage 50V, current 600A, plasma gas (Ar) flow rate 40L / min, auxiliary gas ( h 2 ) flow rate of 6L / min, powder feeding gas (Ar) flow rate of 8g / min, and a distance of 15cm between the nozzle and the surface of the substrate to achieve uniform spraying on the surface of the substrate and form a ceramic material layer with a thickn...

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Abstract

The invention relates to a preparation method of a ceramic substrate high-frequency copper-clad plate. The preparation method includes the procedures of substrate preparation, plasma spraying of a ceramic material layer, metal foil lamination curing and the like. According to the method, plasma spraying is added in the preparation process of a traditional high-frequency copper-clad plate, the shortcomings of existing high-frequency plate preparation are overcome, a plasma spraying technology is high in efficiency, simple and unrestrained by sample piece shapes and sizes, the sprayed ceramic material layer can be effectively combined with a substrate and a metal foil, an alloy middle layer is thin and uniform, the thickness of the alloy middle layer can be adjusted, and the high-frequency copper-clad plate prepared by the preparation method is excellent in processability, high in impact resistance, good in heat resistance and mechanical property and excellent in electromagnetic shielding property.

Description

technical field [0001] The invention relates to the field of copper clad laminate preparation, in particular to a method for preparing a ceramic substrate high frequency copper clad laminate. Background technique [0002] Copper-clad laminates are mainly used to produce printed circuit boards. They are made of fiber paper, glass fiber cloth or glass fiber non-woven fabric as reinforcing materials, impregnated with resin, covered with metal foil on one or both sides, and hot-pressed. products. At present, copper clad laminate materials with excellent performance are widely used. At the same time, with the rapid development of the mobile communication industry, people put forward higher requirements for the mechanical properties, signal transmission performance, stability and heat dissipation performance of electronic products, especially In aerospace, radar satellite and communication and other fields. [0003] There are many factors that affect the dielectric properties of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02B32B17/06B32B15/14B32B15/06B32B27/12B32B37/06B32B37/10B32B37/24
CPCB32B5/02B32B15/14B32B37/06B32B37/10B32B37/12B32B37/24B32B2037/243B32B2255/02B32B2255/20B32B2262/101B32B2307/212B32B2307/306B32B2307/558B32B2457/08
Inventor 谭台哲张永光黄国宏唐浩
Owner SYNERGY INNOVATION INST OF GDUT HEYUAN
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