Liquid-phase sintering method for preparing high-melting-point hard material particle dispersion-strengthened copper-based composite material and electromagnetic sintering device
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI UNIV
- Publication Date
- 2016-08-03
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Abstract
Description
technical field
[0001] The invention relates to a metal-based composite material preparation process and equipment, in particular to a copper-based composite material powder metallurgy preparation method and a sintering device. Background technique
[0002] Copper and its alloys are one of the most important functional and structural materials in national economic construction. Their excellent electrical conductivity and corrosion resistance make them widely used in communication, electric power, aerospace, transportation, home furnishing, automation and many other fields. However, the conductivity and strength of copper alloys are a pair of contradictory properties. To improve the strength of copper alloys, it is often at the expense of the conductivity of copper alloys. For example, alloys such as copper-magnesium, copper-tin, copper-chromium, and copper-iron-phosphorus, which are widely used at present, have high strength, but their electrical conductivity can only reach ...