The invention provides a precise circuit packaging substrate and a manufacturing method thereof, and the method comprises the following steps: providing a substrate which comprises a core plate and a conductive
metal layer at least disposed on the first surface of the core plate; forming a
grain boundary buffer material layer on the surface, far away from the core plate, of the conductive
metal layer, and pretreating the
grain boundary buffer material layer to obtain a
grain boundary buffer layer; providing an
electroplating shielding layer, and forming a base circuit layer on the surface, away from the substrate, of the grain boundary buffer layer based on the
electroplating shielding layer; at least one layer of wiring structure is formed on the surface, away from the substrate, of the base circuit layer, the wiring structure comprises a
dielectric layer covering the exposed surface of the base circuit layer, a
metal connecting layer penetrating through the
dielectric layer and a conductive circuit layer located on the surface, away from the base circuit layer, of the
dielectric layer, and the metal connecting layer is electrically connected with the base circuit layer and the conductive circuit layer. According to the precise circuit packaging substrate and the manufacturing method thereof, the problem of circuit separation in the process of manufacturing the precise circuit packaging substrate is avoided, and the yield of the packaging substrate is improved.