The invention provides a hybrid different board material high-frequency board manufacturing method. A double-face copper-plated high-frequency board material and an epoxy resin board are employed for manufacturing, a non-flowing glue PP plate is utilized as a stitching medium of the high-frequency board material and the epoxy resin board, dimensions of a groove hole on the non-flowing glue PP plate are specially designed to solve a groove hole glue spilling problem, processing quality of products is improved, moreover, the overlapping process for drilling is further specially designed for the high-frequency board material, for a board material sinking problem of the high-frequency board material during stitching after grooving, a stitching overlapped structure is especially designed, a three-in-one buffer pad is employed to solve the grooving-side board material sinking problem, a hot pressing program is designed according to the stitching overlapped structure, the cold press time is further prolonged to further reduce a board bending problem caused by different expansion coefficients of different board materials, the high-frequency board material contains fillers which are not easily removed in a chemical glue removal mode, before electroplating, plasma glue removal is firstly carried out, chemical glue removal is then carried out, and complete cleaning is carried out to effectively improve electroplating quality.