Hybrid different board material high-frequency board manufacturing method

Abstract

The invention provides a hybrid different board material high-frequency board manufacturing method. A double-face copper-plated high-frequency board material and an epoxy resin board are employed for manufacturing, a non-flowing glue PP plate is utilized as a stitching medium of the high-frequency board material and the epoxy resin board, dimensions of a groove hole on the non-flowing glue PP plate are specially designed to solve a groove hole glue spilling problem, processing quality of products is improved, moreover, the overlapping process for drilling is further specially designed for the high-frequency board material, for a board material sinking problem of the high-frequency board material during stitching after grooving, a stitching overlapped structure is especially designed, a three-in-one buffer pad is employed to solve the grooving-side board material sinking problem, a hot pressing program is designed according to the stitching overlapped structure, the cold press time is further prolonged to further reduce a board bending problem caused by different expansion coefficients of different board materials, the high-frequency board material contains fillers which are not easily removed in a chemical glue removal mode, before electroplating, plasma glue removal is firstly carried out, chemical glue removal is then carried out, and complete cleaning is carried out to effectively improve electroplating quality.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a high-frequency board production method in which different board materials are mixed and pressed. Background technique [0002] With the development of mobile and data communication, the mobile communication network is gradually developing from 4G to 5G. As far as the structure of the equipment is concerned, the traditional design structure of the indoor all-in-one machine has been gradually abandoned, and it has developed into an existing one that is smaller in size and easy to dismantle. The split structure of the transceiver in the outdoor (ODU), modem and baseband interface in the indoor (IDU). Especially for the communication needs of marine vessels, the requirements for the communication distance of microwave communication equipment are developing from short-distance communication to long-distance communication, and the transmission capacity and interface mode of dr...

AI Technical Summary

Problems solved by technology

Due to the different expansion and contraction characteristics of high-frequency sheet metal and ordinary sheet metal, it is difficult to control the bending and expansion and contraction of the sheet metal. In addition, this type of sheet needs to be grooved first and then pressed, but there is a risk of sheet metal sag after the groove is pressed. , and when PP is pressed between the high-frequency board and the ordinary board, the glue flow will be difficult to control, resulting in residual glue around the slot, which will affect the quality of the product

[0004] At present, PCB manufacturers are adopting the method of continuously adjusting the lamination program in order to solve the above problems, and the characteristics of the resin in the high-frequency sheet material require a higher temperature rise during lamination, and a higher curing temperature, and the heating rate is 3.2- 4.2°C / min, the curing temperature is above 200°C, so the space for adjusting the pressing program is limited, and simply adjusting the pressing program has little effect

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