253results about How to "Improve plating quality" patented technology

A zinc alloy zipper electroplating apparatus, belongs to the field of zipper electroplating technology. The apparatus includes groove body and frame mounted on top of it, the left and right sides of rotary tray frame is connected by matching oil cylinder with frame, a set of trolleys is mounted in order by roller shaft on the rotary tray frame, cathodic copper is connectted and mounted on top of roller shaft, anodic conductivity coil is mounted around groove body, zipper actuating mechanism comprising motor, action wheel and driven wheel is connected and mounted at right side of frame. Zipper serial transmission electroplating is performed by electroplating zinc alloy zipper and crossing zipper transmission mechanism overlapping trolley and corresponding zipper electric motor drive, and the production efficiency is evidently improved. The rational arrangement of cathode and anode can efficiently avoid the appearance of cathodic and anodic face on plating layer of zinc alloy zipper tooth, and the plating layer is uniform. At the same time, cathode can be efficiently preventing electroplate liquid being dissovled and the pollution of electroplate liquid can be efficiently avoid, using protecting apparatus with up and down cathode, prolonging service life of apparatus and reducing cost of production.

The invention discloses a high density copper electroplating liquid without cyanogen and aluminum alloy boss electroplating craft, which is characterized by the following: allocating 250-400ml/l high density copper opening jar agent without cyanogen, 80-120 ml/l high density copper accelerant without cyanogen, 0-5 ml/l high density copper additive without cyanogen and surplus as water; adjusting pH value at 9. 2-10. 0; getting the electroplating liquid; adding following steps between twice depositing zinc step and acid bright coppering step; pre-coating the high density copper without cyanogen; petting the aluminum alloy boss into high density coppering liquid without cyanogen; electroplating; thick-plating; putting the aluminum alloy boss into thick coating liquid; proceeding thick electroplating. This craft can decrease cost and modify electroplating quality.

The invention provides a hybrid different board material high-frequency board manufacturing method. A double-face copper-plated high-frequency board material and an epoxy resin board are employed for manufacturing, a non-flowing glue PP plate is utilized as a stitching medium of the high-frequency board material and the epoxy resin board, dimensions of a groove hole on the non-flowing glue PP plate are specially designed to solve a groove hole glue spilling problem, processing quality of products is improved, moreover, the overlapping process for drilling is further specially designed for the high-frequency board material, for a board material sinking problem of the high-frequency board material during stitching after grooving, a stitching overlapped structure is especially designed, a three-in-one buffer pad is employed to solve the grooving-side board material sinking problem, a hot pressing program is designed according to the stitching overlapped structure, the cold press time is further prolonged to further reduce a board bending problem caused by different expansion coefficients of different board materials, the high-frequency board material contains fillers which are not easily removed in a chemical glue removal mode, before electroplating, plasma glue removal is firstly carried out, chemical glue removal is then carried out, and complete cleaning is carried out to effectively improve electroplating quality.

The invention discloses a wafer processing unit, which is characterized by comprising a wafer electroplating pretreatment device for pre-treating wafers before electroplating, a wafer electroplating device for electroplating the wafers, a wafer cleaning device for cleaning the wafers after electroplating and a manipulator for conveying the wafers from one device to another device. According to the wafer processing unit, the wafer electroplating pretreatment device, the wafer electroplating device and the wafer cleaning device are combined organically; the wafers are conveyed by the manipulator, so that the working efficiency is improved greatly, the manpower is saved, the conveying stability of the wafers is improved, and the damage and rejection rate of the wafers is reduced.

Provided are a chain belt electroplating supporting frame and electroplating equipment using the chain belt electroplating supporting frame. The chain belt electroplating supporting frame is used to electrify metal chain teeth on a chain belt in the process of electroplating, and comprises a supporting frame body and a chain belt traction mechanism, wherein the supporting frame body is provided with an outer side surface, the outer side surface is in an outward protruding arc-shaped structure and is provided with a containing groove, the width of the containing groove is the width between two leg portions of the chain teeth, the containing groove is used to contain a cloth belt of the chain belt, the outer side surface close to the containing groove is provided with a conductive belt which is fixed on the outer side surface, a part of the surface of the conductive belt is in electric connection with the bottoms of chain teeth, the part of the surface of the conductive belt not contacting the chain teeth is covered by an anti-corrosion layer, and the chain belt traction mechanism is used to drag the chain belt along the stretching direction of the chain belt when the chain belt is wound on the supporting frame body and exert tension force to the chain belt. The chain belt electroplating supporting frame and the electroplating equipment using the chain belt electroplating supporting frame have the advantages of being high in electroplating quality.

An electrical brush plating system and method for metal parts wherein a motion control member and a plating bath with a plating pen includes an anode member provided with an anode plate and bristles that are mounted on the motion control member. A part to be plated is disposed within the plating bath with the bristles provided towards the surface of the part to be plated and under the control of the motion control member, the bristles perform a relative friction motion with the surface of the part to be plated. During the relative friction motion, the surface of the part to be plated is opposite to the anode plate of the anode member. The method includes the steps of mounting the plating pen and the part to be plated; electrocleaning; strong activation; weak activation and electrical brush plating. The generation of pinholes, pits and nodules are avoided.

The invention discloses a method for preparing stannous pyrophosphate. The technique of the method is as follow: stannous chloride and stannous sulfate with a short time retention period (0 to 72 hours) reacts with stoichiometric alkali metal pyrophosphate solution (thickness of 1 to 30 percent) in room temperature; the reaction precipitate is washed by water until Cl<-> is less than 1 percent; white powder products are obtained after filtering, drying and crashing. The complex compound solution which is formed by the products and alkali metal pyrophosphate is colourless and transparent, and has a turbidity degree merely of 0 to 5.

The invention discloses a dielectric phase shifter with novel conducting cavities. The dielectric phase shifter includes an outer shell, dielectric sheets, a circuit board and coaxial cables; two rectangular cavities are formed in the outer shell; one conducting cavity is formed at one side of each cavity, wherein the conducting cavity is connected with the cavity; each conducting cavity is hollow and is a circular hole of which the diameter is 3.6 mm, and a small groove of which the width is 1.2 mm formed at one side of the hole; in each conducting cavity 4, a portion with a reserved width is maintained to be original at a position where the outer conductor of a corresponding coaxial cable is welded to the conducting cavity 4, and a portion of which the width is 15mm is machined downwards so as to be removed, and therefore, the coaxial cable can extend into the conducting cavity so as to be welded to the conducting cavity; the circuit board is designed into a rectangle with four grooves formed at one side; and the four grooves are corresponding to the edges of circuit board pads for welding the inner conductors of the coaxial cables. When welding is carried out, only one-time clamping is required, and therefore, a welding technique is better, and the economical efficiency of welding is improved; and the conducting cavities are utilized to excellently wrap the outer conductors of the coaxial cables, distortion can be avoided, bending stress of the coaxial cables can be avoided, the risk that welding spots and the circuit board are damaged can be lowered, and hidden hazard points in intermodulation can be decreased.

The invention discloses an electro-plating device and specifically relates to an open chain belt type barrel plating machine. The open chain belt type barrel plating machine comprises an electro-plating slot, an anode plate, a cathode plate guide wire and a control device, wherein the control device is electrically connected with the anode plate and the cathode plate guide wire respectively; the open chain belt type barrel plating machine further comprises a chain belt, a transmission wheel for driving the chain belt to move left and right and a motor; the motor is electrically connected with the control device; the chain belt is arc-shaped and arranged in the electro-plating slot; the circle centre of the circular arc where the chain belt lies is arranged above the chain belt; a plurality of liquid through holes for passing bath solution are arranged on the chain belt; and an unloading mechanism is fixed at the left side of the electro-plating slot. The open chain belt type barrel plating machine is simple in structure, high in production efficiency, good in quality of the surface of a plated part and extensive in applicative component dimension range; moreover, the chain belt for bearing components is open so as to be capable of detecting the quality of plated work pieces at any time in a working status, thereby ensuring the product yield.

The invention discloses an electroplating device for a lead wire framework. The electroplating device comprises a spraying plate, an anode plate, a substrate and a mask base plate from bottom to top, wherein a plurality of electroplating through holes are formed on the mask base plate in an array manner; each through hole corresponds to an electroplating unit region on the lead wire framework; and the electroplating device finishes the lead wire framework electroplating work at a time through electroplating liquid spraying loops on the spraying plate and the anode plate. In the electroplatingdevice, the electroplating liquid is sprayed into a spraying runner and electroplated onto a welding disk region of the lead wire framework so as to finish all electroplating unit regions at a time; moreover, the uniformity and the electroplating quality are high; the residual electroplating liquid is collected by the runners of the loops so that the spraying path of the electroplating liquid cannot be influenced; in particular, the electroplating device is suitable for a plurality of lead wire frameworks; and a charring phenomenon can be avoided and the yield rate is high.

The invention discloses a two-in-one trivalent chromium blue white passivation solution for passivation and sealing, which comprises Cr<3+>, SiO3<2->, complexing agents, film formation accelerating agents and other metal salt, wherein in the passivation solution, the mass ratio of Cr<3+> to SiO3<2-> is 1 : (2.5 to 3.5). The invention additionally discloses a passivation and sealing process, which comprises the step that workpieces which are bright-dipped and washed are put into the two-in-one trivalent chromium blue white passivation solution for passivation and sealing to be passivated and sealed. By adopting the passivation solution disclosed by the invention to conduct the passivation and sealing treatment, only one working procedure is needed; compared with an old process requiring two working procedures of passivation and then sealing, the cost of the process disclosed by the invention is only 70 to 80 percent of the cost of the old process, so the cost of the passivation and sealing process is remarkably reduced, an obtained passive film has better corrosion resistance and heat resistance, the neutral salt mist resisting time of the passive film can be effectively prolonged, and the economic benefits and the social benefits are good.

Flexographic printing plates are produced by exposing the photopolymer plates to a light source and washing out (developing) the masked out, non-exposed areas with a solvent. The invention provides terpene ether solvents suitable for use in the development of photopolymer printing plates. The solvents, which include terpene ethers alone or mixed with co-solvents and/or non-solvents, are effective in developing a large number of different photopolymer printing plates and can produce images superior to those obtained with commercially available solvents currently used in such applications.

The invention discloses a barrel plating current intensity real-time online testing device, which comprises a data acquisition and transmission module and a transducer module, wherein the data acquisition and transmission module consists a replaceable probe, an insulating protective sleeve, a switching device and a wire; the transducer module realizes feeble current to voltage signal conversion and nonlinear compensation, displays the detected current intensity, converts an acquired current signal to a 0 to 5 volt control voltage and outputs the 0 to 5 volt control voltage. The data acquisition part of the device can be placed in a barrel to be plated with a workpiece, so the concentration of plating liquid in the barrel and the actual conditions of a workpiece plating current during temperature change can be reflected, and under a condition of a known area of the replaceable probe, the current intensity of a workpiece in a barrel plating state can be acquired in real time according to the acquisition of the plating current of the probe. After the output of a power supply is regulated by using the output signal of the device, the constant current intensity control can be realized, so the problem of uneven plating thickness caused by incorrect calculation of the surface area of the workpiece is solved.

The invention discloses a method for improving excessive circuit etching of a circuit board, belonging to the field of outer circuit etching of printed circuit boards. The method for improving excessive circuit etching of the circuit board disclosed by the invention comprises the following steps of: micro-electroplating a copper layer with the thickness of 5-6 mu m on a complete board; transferring an outer pattern onto the outer layer of the circuit board to form a circuit pattern, wherein the width of a copper circuit is 0.03-0.04 mm more than that of a copper circuit required practically; thickening a pattern electroplated copper layer till the thickness is 11-13 mu m, and then, electrotinning with the thickness of 5-6 mu m; and vacuumizing and etching after demoulding. According to the invention, the processes before and after etching are improved in an unified manner; therefore, the improvement range of outer circuit etching is enlarged; the effect of preventing excessive circuit etching can be achieved better; the production efficiency of outer circuit etching is effectively increased; scraps due to the fact that circuits are too thin are reduced; and the electroplating quality is increased.

The invention provides an electroplating clamp of a solar cell. The electroplating clamp of the solar cell, provided by the invention, comprises a first frame, a second frame and a plurality of magnets, wherein the first frame and the second frame are of a hollow shape, edge parts of the first frame and the second frame are in contact and clamp the cell; and the plurality of magnets are respectively symmetrically fixed on the first frame or second frame, and the first frame and the second frame are jointed by using a magnetic force. The electroplating clamp of the solar cell, provided by the invention, is capable of rapidly locating the cell, quick in assembly, and continuous in production, ensures that the cell is uniformly conducted, and is capable of reducing the breakage rate of the cell.

The invention provides a structure of an electroplating rolling barrel, comprising a barrel body, a round sealing plate, an upper cover and a plurality of upper cover pressing bars; the barrel body is a polygonal barrel-shaped container which is provided with an opening and formed by the overlapping connection and combination of a plurality of rectangular plates one by one; the rectangular plates are respectively provided with a slab which is provided with a plurality of through holes; the upper cover is a rectangular plate; the rectangular plate is provided with a slab which is provided with the through holes; two ends of the upper cover pressing bar are respectively provided with a hooking end and a pulling handle end; the pulling handle end also integrally extends by a clamping end corresponding to the hooking end; the hooking end and the clamping end are respectively used for hooking two sides of the opening of the barrel body; the upper cover is pressed on the barrel body so as to close the opening; and the structure of the electroplating rolling barrel has the advantages and characteristics of simplifying the preparation process of the electroplating rolling barrel, reducing the preparation cost, improving the whole strength of the electroplating rolling barrel and improving the electroplating quality.

The present invention provides a method and a device for galvanising substrates and solar cells. The device comprises a reservoir (12) having an electrolytic coating liquid (13), a lower transport device (40), and an upper transport device (30) for substrates (1), where a transport device comprises mechanisms (20,21,24,32) for contacting and connecting the substrates (1) to a voltage source (21). At least one transport device (30) is provided with at least one tampon (41) which is made of a absorbent material (44). Furthermore, the mechanisms are equipped so the tampon (41) absorbs the electrolytic coating liquid (13) and contacts with the surfaces of the substrates (1) to be plated.

The inventive high-temperature high-humidity electrode plate curing process includes (1) sending green electrode plates into a curing chamber, and performing surface drying at 150-180 DEG C and relative humidity of 20-30%, to reach moisture content of 7.5-8.5 wt% in dried green electrode plate; and (2) regulating curing temperature to 90-95 DEG C and relative humidity of 100% in the curing chamber, and curing the green electrode plate for 24 h. The invention has the advantages of short curing time, firm bonding between lead paste and plate grid, no deformation and cracking, high production efficiency, high electrode plate quality, and substantially improved battery comprehensive performances.