40results about How to "Improve the quality of electroplating" patented technology

The invention discloses a tree-dimensional pattern structure of a circuit board and a circuit technology thereof. The three-dimensional pattern structure of the circuit board comprises a dielectric layer, at least one first three-dimensional pattern and at least one second three-dimensional pattern. The first three-dimensional pattern and the second three-dimensional pattern are configured at a same surface of the dielectric layer. The thickness of the first three-dimensional pattern is larger than the thickness of the second three-dimensional pattern. Due to that the heat-dissipation capacity of the first three-dimensional pattern increases with the increase of the thickness, the first three-dimensional pattern with relatively good heat-dissipation capacity can be used for enhancing the whole heat-dissipation capacity of the circuit board.

The invention relates to a pneumatic copper ball addition apparatus, which uses the thrust effect of the air pressure conveys the copper ball from a work walkway to every titanium basket used for placing the copper ball, the work of adding the copper ball is completely conveyed to the work walkway to finish without normal operation of electroplate equipment, the copper ball can be added in safe, reliable, easy and rapid mode during the normal operation process of the electroplate equipment, thereby the production time is saved, the production power is enhanced, the resource waste is reduced, the electroplate quality is enhanced, the manual work is reduced, and the labor intensity is reduced.

The invention discloses a wafer processing unit, which is characterized by comprising a wafer electroplating pretreatment device for pre-treating wafers before electroplating, a wafer electroplating device for electroplating the wafers, a wafer cleaning device for cleaning the wafers after electroplating and a manipulator for conveying the wafers from one device to another device. According to the wafer processing unit, the wafer electroplating pretreatment device, the wafer electroplating device and the wafer cleaning device are combined organically; the wafers are conveyed by the manipulator, so that the working efficiency is improved greatly, the manpower is saved, the conveying stability of the wafers is improved, and the damage and rejection rate of the wafers is reduced.

The embodiment of the invention discloses a swing device for a hanging tool. The swing device for the hanging tool comprises a connection structure and at least one wing-shaped structure, wherein theconnection structure is used for connecting one or more hanging tools, and the wing-shaped structure is connected to the connection structure. In any cross section of the wing-shaped structure, the length of an upper curve is greater than the length of a lower curve, wherein the cross section is vertical to the extension direction of the connection structure; the upper curve of the cross section is the projection of the upper surface of the wing-shaped structure in the cross section; and the lower curve of the cross section is the projection of the lower surface of the wing-shaped structure inthe cross section. According to the technical scheme, stirring for a solution can be enhanced through the wing-shaped structure, so that the uniformity of the solution is improved, the consistency ofthe swing amplitudes of plated parts is improved, and then the uniformity of the plating thicknesses of the plated parts is improved.

The invention provides an automatic anodizing equipment for zipper sliders. The plating tank consisting of a pre-plating treatment tank, a plating treatment tank and a post-plating treatment tank is connected from end to end to form a closed ring. The anode generator is installed on a vertical guide rail. The guide rail is connected with the chain of the walking device, and the anode generator is also provided with rollers, which rest on the horizontal circular track, and the circular track can rise and fall under the drive of the lifting device; in the control system, the walking device and the lifting Under the action of the device, the anode generator walks intermittently on the circular track, and cycles in the order of rising, walking, falling, and staying. The present invention enables the zipper head to be electroplated continuously through automated equipment, which greatly improves the production efficiency of electroplating, and controls the time of each process by an intelligent program. The electroplating quality is high, and the electroplating quality of the zipper head is improved. The labor intensity is reduced, and the on-site environment is improved.

The invention provides an electroplating method, which comprises the following steps: a pair of anodes and an electroplated part are placed in a plating bath with a plating solution, the pair of anodes are respectively arranged at the left side and the right side of the electroplated part and enable electrically connected to the anode of the power supply respectively, the electroplated part enables electrically connected to the cathode of power supply for being as the cathode; a pair of first baffle plates are arranged between the pair of anodes and closed to one end of the electroplated part; according to the requirements of an electroplate area of the electroplated part, the first baffle plates are controlled to cover a part of area of the electroplated part; power supply is switched on, and the electroplated part is electroplated. The electroplating method is characterized in that the first baffle plates are arranged between the pair of anodes, the area of the electroplated part directly opposite to the anode can be adjusted in a flexible way, thereby uniform electroplating of part of the electroplated part can be selectively completed, and the uniform electroplating of the integral electroplated part can be completed, the electroplate quality is enhanced, the application scope is wide, and the practicality is obviously increased.

The invention belongs to the technical field of electroplating, specifically a tinned copper wire electroplating method. The electroplating device used in the present invention includes an electroplating pool. Both sides of the top of the electroplating pool are installed with rotating shafts through the rotation of the mounting plate. Two The surface of the rotating shaft is fixed with more than two pulleys at equal distances, the top of the electroplating pool is fixed with a dryer, and the bottom of the inner cavity of the electroplating pool is equidistantly provided with more than two rectangular grooves, each of which is slidably connected with sleeves. Two or more rollers are arranged on both sides of the electroplating pool, and the rollers on one side of the electroplating pool are all driven by a motor, and a controller is provided on the electroplating pool; the electroplating device used in the present invention includes a push The structure of the rod motor and the piston can push the casing to move continuously during the movement of the piston. During the movement of the casing, it drives the electroplating solution in the electroplating pool to oscillate, so that the impurities in the electroplating pool will not precipitate, and also make the The electroplating solution is more uniform, which improves the electroplating effect.

A zooming key structure comprises a zooming key, a first middle frame part and a second middle frame part. The first middle frame part is provide with a first clamping portion and a first body, and the first clamping portion extends out from the first body and is positioned on one side of the zooming key. The second middle frame part is provided with a second clamping portion and a second body, and the second clamping portion extends out from the second body and is positioned on the other side of the zooming key. The first clamping portion and the second clamping portion are clamped with each other to form annular holding space, and the zooming key is surrounded by the first clamping portion and the second clamping portion and fixed to the annular holding space.

The invention relates to the field of circuit board production, and provides a vertical continuous electroplating equipment, which includes a cathode conveyor belt, a clamp, an electroplating tank and an anode on-off assembly. The anode insulation section connected between two adjacent anode conductive sections, each anode conductive section is connected to the positive pole of the rectifier in parallel; the anode on-off assembly includes a first inductor, a first control unit electrically connected to the first inductor, and multiple An anode switch electrically connected to the first control unit, the first control unit is used to calculate the time for the plate to pass through each anode conductive section according to the speed of the plate when the plate passes the first sensor, and to control the anode switch on the plate Closed when passing the anode conductive section, and open when no plate passes the anode conductive section. The vertical continuous electroplating equipment can achieve precise electroplating on the board, basically avoid the use of accompanying plating boards, increase production capacity, reduce costs, improve electroplating quality, and reduce the difference in copper plating thickness of each board.

The invention relates to the field of circuit board machining methods, and particularly discloses a tin plating leveling method for a circuit board. According to the tin plating leveling method for the circuit board, a tin plating device is adopted, a spraying mechanism in the tin plating device can be used for enhancing the liquidity of an electroplating solution in an electroplating box in the tin plating process, and the electroplating solution on the two sides of the circuit board can be exchanged, so that the electroplating solution in the whole electroplating box is uniform and stable and the electroplating efficiency of the circuit board can be effectively improved.

The invention relates to the technical field of printed circuit boards, in particular to a reusable electroplating method for accompanying plating boards. When the present invention uses VCP to carry out the electroplating process to the production board, use the accompanying plating plate with electroplated nickel-gold layer as the etching protection layer, and make the accompanying plating plate go through alkaline once when the production board of each line completes the electroplating treatment. Etching line, remove the copper layer formed on the surface of the accompanying plated plate during the electroplating process through etching, so that the accompanying plated plate can be restored to the state before use, so that it can be re-used in the electroplating process, realizing the reuse of the accompanying plated plate, completely avoiding It solves the problems that the existing accompanying plated plate will deteriorate in appearance and become heavier and thicker as the number of times of use increases, which will cause the accompanying plated plate to drop, fixture damage, copper cylinder pollution and other problems during the electroplating process, which can reduce production costs and improve production efficiency. 10 The production capacity of 10,000 square meters can save about 15,000 yuan in the production cost of accompanying plated plates.

The invention relates to a PCB copper electroplating groove, which comprises a groove body, two positive electrodes disposed on two sidewalls of the groove body and a kickboard rack which is arranged in the middle of the groove body and is used for disposing a PCB. One end of the groove body below the kickboard rack is provided with a water inlet. An installation groove for a screen filter is disposed near the kickboard rack between the kickboard rack and the two positive electrodes. The installation groove for the screen filter is provided with the screen filter. One end of the groove body between the screen filter and the two positive electrodes is provided with a water outlet externally connected with a filter. The screen filter concretely contains a fixed pedestal, a plurality of clamp poles vertically arranged on the fixed pedestal and a plurality of filters installed between the clamp poles, wherein the filter comprises a bracing frame, a handle arranged on the top of the bracing frame and filter cloth arranged on the side surface of the bracing frame; strip-shaped grooves are disposed on the side of the clamp poles; strip-shaped bosses are correspondingly arranged on the two sides of the filters; and the filters can be detachably installed on the clamp poles through the joint of the bosses and the grooves. According to the invention, copper ash and impurities in the copper grooves can be effectively minimized and the copper electroplating groove pollution can be prevented.

A semiconductor package and its manufacturing method. The manufacturing method is to first provide a carrier with a semiconductor element, and then form a packaging layer with at least one opening on the carrier, so that the packaging layer covers the semiconductor element. , and the side of the opening is a smooth surface; then, a circuit layer is formed on the second surface of the encapsulation layer, and the circuit layer has a conductor formed in the opening, and then the carrier is removed, so that by simultaneously Making the encapsulation layer and the opening can not only prevent the wall surface of the opening from being too rough, but also greatly shorten the process time.