Wafer type product electroplating feeding and discharging equipment

Abstract

The invention discloses wafer type product electroplating feeding and discharging equipment which comprises a workbench, a wafer box loading device, a wafer robot, a wafer calibrator, an overturning manipulator, a mounting and dismounting mechanism, an electroplating hanging tool and a wafer jig. The wafer robot, the wafer calibrator, the overturning manipulator and the mounting and dismounting mechanism are all arranged on the workbench, and the electroplating hanging tool is arranged on the mounting and dismounting mechanism. The wafer box loading device, the wafer calibrator and the overturning manipulator are located in an operation range of a wafer taking arm of the wafer robot. The mounting and dismounting mechanism is located within the operation range of the overturning manipulator, during feeding operation, the wafer products and the wafer jigs are locked and attached to the electroplating hanging tool, and during discharging operation, the wafer products and the wafer jigs are unlocked from the electroplating hanging tool and taken down. Automatic feeding and discharging operation of products can be achieved, equipment operation and control are more flexible, and the efficiency is high.

Description

technical field [0001] The present invention relates to the technical field of automation equipment in the semiconductor industry, and more specifically, to an electroplating loading and unloading equipment for wafer products. Background technique [0002] Wafer refers to a silicon wafer made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A layer of conductive metal is plated on the wafer, and the conductive metal layer is processed to make a conductive circuit. In the automated process of the semiconductor industry, it is often necessary to flip the wafer up and down around its center. During the flipping process, there is a high requirement for concentricity between the center of the wafer and the center of the rotation axis, and there is also a high requirement for the accuracy of the angle of flipping. For example, the electroplating process is one of the key processes for making these metal layers. However, the existi...

AI Technical Summary

Problems solved by technology

For example, the electroplating process is one of the key processes for making these metal layers. However, the existing wafer electroplating equipment, especially the vertical wafer electroplating equipment, usually uses manual operations for wafer electroplating loading and unloading, resulting in low wafer loading and unloading efficiency. At the same time, manual operation also affects the quality of wafer plating

Images