Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of reusable electroplating method for accompanying plate

A technology of accompanying plated plate and electroplating treatment, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc. It can solve the problems of affecting production efficiency and increasing the cost of electroplating, so as to improve production efficiency, improve the quality of electroplating, and avoid deterioration of appearance Effect

Active Publication Date: 2021-01-15
JIANGMEN SUNTAK CIRCUIT TECH
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the problem that the accompanying plating plate used in the current VCP electroplating cannot be reused for a long time, which leads to the increase of electroplating cost and affects the production efficiency, and provides an electroplating method in which the accompanying plating plate can be reused so as to improve the production efficiency of electroplating and reduce the production cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0025] This embodiment provides a reusable electroplating method for the accompanying plate, which includes making the accompanying plate with a nickel-gold protective layer, and etching the accompanying plate after each electroplating so that the accompanying plate can be repeatedly used in electroplating. The specific electroplating method includes the following steps:

[0026] (1) Select a double-sided copper-clad laminate with a copper layer thickness of H OZ, and cut the double-sided copper-clad laminate according to the size of the production board to obtain a substrate. The height of the substrate is equivalent to the height of the production board, and the height difference is controlled within the range of ±3cm.

[0027] (2) The substrate is sequentially subjected to electroless nickel, electroless gold, and electroplating gold, and sequentially forms an electroplating nickel layer, an electroplating gold layer, and an electroplating gold layer on the copper surface o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of printed circuit boards, in particular to a reusable electroplating method for accompanying plating boards. When the present invention uses VCP to carry out the electroplating process to the production board, use the accompanying plating plate with electroplated nickel-gold layer as the etching protection layer, and make the accompanying plating plate go through alkaline once when the production board of each line completes the electroplating treatment. Etching line, remove the copper layer formed on the surface of the accompanying plated plate during the electroplating process through etching, so that the accompanying plated plate can be restored to the state before use, so that it can be re-used in the electroplating process, realizing the reuse of the accompanying plated plate, completely avoiding It solves the problems that the existing accompanying plated plate will deteriorate in appearance and become heavier and thicker as the number of times of use increases, which will cause the accompanying plated plate to drop, fixture damage, copper cylinder pollution and other problems during the electroplating process, which can reduce production costs and improve production efficiency. 10 The production capacity of 10,000 square meters can save about 15,000 yuan in the production cost of accompanying plated plates.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a reusable electroplating method for accompanying plated plates. Background technique [0002] In the production of circuit boards, electroplating is almost an essential process. At present, electroplating is usually carried out using gantry electroplating lines or vertical continuous electroplating equipment (VCP), and due to the safety and economy of vertical continuous electroplating equipment, it replaces gantry electroplating lines. has become an inevitable trend. [0003] When using vertical continuous electroplating equipment for electroplating, in order to ensure that during the electroplating process of the production board, the first board and the last board in each line of production boards will not cause burn-in problems due to excessive current. Add a plating plate before one plate and after the last plate. At present, the accompanying plate used for...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18
CPCH05K3/18
Inventor 徐文中杨勇李江涂波
Owner JIANGMEN SUNTAK CIRCUIT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products